摘要:
The invention concerns a method of manufacturing highly conducting composites, the method being characterized by the following steps: a) contacting a powder or fibers with an aqueous solution containing an appreciably water-soluble high-molecular substance, b) optionally washing with water, c) contacting with a dispersion containing finely particulate electrically conducting material, wetting agents (surfactants) and an ionogenic metal compound, d) optionally washing with water and e) molding to required shape.
摘要:
A method for coating surfaces of a non-conductor with finely particulate solid particles by substrate-induced coagulation, including the steps of: contacting the non-conductor with a first solution containing a first polar solvent and at least one coagulation initiator comprising high molecular weight material; and, subsequently contacting the non-conductor with a dispersion which contains a second polar solvent and: a) finely particulate solid particles, b) at least one surfactant for preventing the sedimentation of the solid particles, and c) a salt, essentially free of tin ions, for selectively destabilizing the dispersion.
摘要:
The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.
摘要:
Complex compounds are disclosed comprising a metal of the 8th to 11th groups of the Periodic Table with at least one organic ligand, wherein the complex exists in an oligomeric or polymeric form, and the organic ligand preferably contains at least one N or O atom, or a multiple bond, or several of these elements. The complex compounds are useful for the generation of metal seeds on a non-metallic substrate.
摘要:
A method for checking and/or controlling a metallization process in a galvanizing or chemical is based on the measurement of light scattered off or reflected from a surface portion being metallized. A deviation from a predetermined nominal value of the scattered or reflected light intensity serves for controlling at least one process parameter to neutralize the deviation.
摘要:
A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.
摘要:
A process is described for producing inductively operating counting systems by forming a conducting structure on an electrically non-conducting substrate, comprising a step involving the application of a suitable catalyst for the currentless deposition of metals onto the electrically non-conducting substrate as well as conventional pretreatment and post-treatment steps. The following process steps are essential for the process according to the invention:1) Application of a liquid photoresist, the liquid photoresist being printed only onto the surface not subsequently covered by the conductive pattern and onto the fine-structured portions of the conduction pattern,2) Subsequent photostructuring of the fine-structured portions of the conductive pattern by illumination and subsequent developing,3) Subsequent currentless deposition of a first thin metallic layer onto the exposed, catalytically coated surface regions,4) Subsequent electrolytic deposition of a second metallic layer onto the first metallic layer, and5) Subsequent application of a decorative protective lacquer or varnish film.
摘要:
The invention relates to a method for the electrolytic deposition of metal coatings, in particular of copper coatings with certain physical-mechanical and optical properties and uniform coating thickness. According to known methods using soluble anodes and applying direct current, only uneven metal distribution can be attained on complex shaped workpieces. By using a pulse current or pulse voltage method, the problem of the coatings being of varying thickness at various places on the workpiece surfaces can indeed be reduced. However, the further problem of the geometric ratios being changed continuously during the depositing process by dissolving of the anodes is not resolved thus. This can be avoided by using insoluble anodes. In order to guarantee sufficient stability of the anodes and a bright coating even at those points on the workpiece surfaces, onto which the metal is deposited with high current density, it is essential to add compounds of an electrochemically reversible redox system to the depositing solution.
摘要:
To check the useful data of a read-write memory, subsets of the data are formed from the total quantity of useful data, and error-correction data are calculated for each subset of useful data. The subsets of useful data and the corresponding error-correction data are transmitted block-by-block to the read-write memory. During each reading operation, the block containing the desired useful data is read out and the integrity of that data is checked with the aid of the error-correction data.
摘要:
A resilient mounting, such as a rubber mounting, with hydraulic damping, in particular for mounting engines of motor vehicles, has two rigid end walls which are disposed opposite to each other in the axial direction, and at least two chambers which are disposed axially one behind the other and which contain damping fluid. The chambers are separated by a rigid partitioning wall. The chambers communicate with each other through a flow passage which extends in an annular configuration around the axis of the mounting, the flow passage being formed in the rigid partitioning wall. The rigid partitioning wall is arranged radially inwardly of, and supported by, an elastic, axially movable diaphragm which is fixedly and sealingly clamped at its outer periphery. At least one of the chambers is defined in part by a rubber-elastic spring member constituting part of the generally peripheral wall of the chamber. Travel-limiting surfaces may be provided at the periphery of the rigid partitioning wall, outboard of its connection to the diaphragm, so as to control movement of the rigid partitioning wall.