公开(公告)号：US07047635B2

公开(公告)日：2006-05-23

申请号：US09805153

申请日：2001-03-14

申请人： Kenichiro Suetsugu ,  Takaharu Gamo ,  Shunji Hibino ,  Yoshio Morita ,  Mikiya Nakata

发明人： Kenichiro Suetsugu ,  Takaharu Gamo ,  Shunji Hibino ,  Yoshio Morita ,  Mikiya Nakata

IPC分类号： H05K3/34 ,  B23K35/34 ,  B23K28/00

CPC分类号： C01B3/508 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  C01B3/0026 ,  C01B3/0031 ,  C01B3/0057 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2203/087 ,  H05K2203/176 ,  Y02E60/327 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/4979 ,  Y10T29/49822 ,  Y10T29/53174

摘要： A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed, and the certain object can be more readily detached from the another object after formation of the connecting portion. The connecting material comprises a solder material and a hydrogen storage metal material which is able to occlude hydrogen, and which is in the form of particles dispersed in the connecting material.

摘要翻译： 连接材料可以形成可拆卸的连接结构。 根据连接材料，可以更容易地形成某个物体与另一物体之间的连接部分，并且在形成连接部分之后可以更容易地将某个物体与另一物体分离。 连接材料包括焊料材料和能够封闭氢气并且呈分散在连接材料中的颗粒形式的储氢金属材料。

公开(公告)号：US07540078B1

公开(公告)日：2009-06-02

申请号：US09889167

申请日：2000-01-07

申请人： Kenichiro Suetsugu ,  Shunji Hibino ,  Masato Hirano ,  Atsushi Yamaguchi ,  Mikiya Nakata

发明人： Kenichiro Suetsugu ,  Shunji Hibino ,  Masato Hirano ,  Atsushi Yamaguchi ,  Mikiya Nakata

IPC分类号： H01R43/00

CPC分类号： C22B25/06 ,  C22B13/00 ,  H01H2009/0077 ,  H05K1/0266 ,  H05K1/18 ,  H05K3/3463 ,  H05K13/0465 ,  H05K2201/09936 ,  H05K2203/178 ,  Y02P10/214 ,  Y02P10/228 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49819 ,  Y10T29/49821 ,  Y10T29/49822

摘要： A recycling method of wastes of an electrical appliance containing an article having a circuit soldered with parts soldered with a lead free solder. The method includes discriminating a first article having a circuit soldered with lead free parts from a second article having a circuit soldered with lead containing parts; recovering, grinding and melting each of the first and second articles to separate materials of the first article and materials of the second article; recycling reusable valuables contained in the materials of the first article and second article; and shredding a portion of the first and second article not containing the reusable valuables and burying/treating the portion at a stabilizing dumping ground or a controlled dumping ground for disposal.

摘要翻译： 一种电器废物的再循环方法，包括具有焊接有焊接无铅焊料的部件的电路的物品。 该方法包括区分具有焊接有无铅部件的电路的第一制品，其具有焊接有含铅部件的电路的第二制品; 回收，研磨和熔化第一和第二制品中的每一个以分离第一制品的材料和第二制品的材料; 回收第一篇文章和第二篇材料中包含的可重复使用的贵重物品; 并将不包含可重复使用的贵重物品的第一和第二物品的一部分切碎，并将该部分埋在/处理在稳定倾倒地或受控倾倒地面处理。

公开(公告)号：US06657135B2

公开(公告)日：2003-12-02

申请号：US09959482

申请日：2002-02-04

申请人： Kenichiro Suetsugu ,  Masuo Koshi ,  Kenichiro Todoroki ,  Shunji Hibino ,  Hiroaki Takano ,  Mikiya Nakata ,  Yukio Maeda

发明人： Kenichiro Suetsugu ,  Masuo Koshi ,  Kenichiro Todoroki ,  Shunji Hibino ,  Hiroaki Takano ,  Mikiya Nakata ,  Yukio Maeda

IPC分类号： H01R1204

CPC分类号： H05K3/3447 ,  H05K1/0293 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0979 ,  H05K2201/099

摘要： A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.

摘要翻译： 本发明的连接结构具有贯穿孔的通孔，形成在通孔周围的台面，以及从电子部件延伸设置在通孔中的引线。 所述平台包括形成在所述通孔的壁面上的壁面陆部，以及分别形成在所述板的前后表面上的前表面和后表面接合部。 连接陆地和铅的圆角包括分别与前表面和后表面陆部接触的上下圆角部分。 上部圆角部分的轮廓小于下圆角部分的轮廓，并且不小于通孔的轮廓。 因此，使用无铅焊料材料时，有效地减少了剥离的发生。

公开(公告)号：US20080210604A1

公开(公告)日：2008-09-04

申请号：US12109877

申请日：2008-04-25

申请人： Kenichiro Suetsugu ,  Shunji Hibino ,  Masato Hirano ,  Atsushi Yamaguchi ,  Mikiya Nakata

发明人： Kenichiro Suetsugu ,  Shunji Hibino ,  Masato Hirano ,  Atsushi Yamaguchi ,  Mikiya Nakata

IPC分类号： B07C5/34 ,  H05K1/00 ,  H05K5/00

CPC分类号： C22B25/06 ,  C22B13/00 ,  H01H2009/0077 ,  H05K1/0266 ,  H05K1/18 ,  H05K3/3463 ,  H05K13/0465 ,  H05K2201/09936 ,  H05K2203/178 ,  Y02P10/214 ,  Y02P10/228 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49819 ,  Y10T29/49821 ,  Y10T29/49822

摘要： The disclosure provides an article having a circuit mounted with parts characterized by comprising an electronic part soldered with a lead free solder and having an identification marking indicating no inclusion of lead and an electrical appliance including the same. The present invention also provides a recycling method of wastes of the same. The present invention can offer an article having a circuit mounted with parts and an electrical appliance including the same both of which facilitate identification whether lead which is poisonous to human body is contained or not.

摘要翻译： 本公开提供了一种具有电路的物品，其具有部件，其特征在于包括用无铅焊料焊接的电子部件，并且具有指示不包括引线的识别标记和包括其的电器。 本发明还提供了一种废物的回收方法。 本发明可以提供具有安装有部件的电路和包括该电路的电器的物品，两者都有助于识别是否含有对人体有毒的铅。

公开(公告)号：US06805282B2

公开(公告)日：2004-10-19

申请号：US10148014

申请日：2002-05-24

申请人： Yasuji Kawashima ,  Kenichiro Suetsugu ,  Shunji Hibino ,  Hiroaki Takano ,  Tatsuo Okuji ,  Shoshi Kabashima ,  Yukio Maeda ,  Mikiya Nakata

发明人： Yasuji Kawashima ,  Kenichiro Suetsugu ,  Shunji Hibino ,  Hiroaki Takano ,  Tatsuo Okuji ,  Shoshi Kabashima ,  Yukio Maeda ,  Mikiya Nakata

IPC分类号： H05K334

CPC分类号： B23K1/0016 ,  B23K1/012 ,  B23K1/085 ,  B23K1/203 ,  B23K3/0653 ,  B23K3/082 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/34 ,  H05K2203/044

摘要： There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

摘要翻译： 提供了通过焊料材料将电子部件安装在基板上的流动焊接工艺，该工艺适合于使用无铅焊料材料作为焊料材料。在流焊技术中，流动焊接的热效率提高 在预热步骤和/或焊料材料供应步骤中。 在本发明的一个方面中，加热盖位于预热器上方，并且在板通过加热盖和预热器之间时进行流动焊接。 在本发明的另一方面，预热器和焊料槽之间的间隙为20至60mm。 在本发明的另一方面，一次波与二次波之间的距离不大于60mm。

公开(公告)号：US06607116B2

公开(公告)日：2003-08-19

申请号：US09874038

申请日：2001-06-06

申请人： Kenichiro Suetsugu ,  Shunji Hibino ,  Yukio Maeda ,  Shoshi Kabashima ,  Mikiya Nakata

发明人： Kenichiro Suetsugu ,  Shunji Hibino ,  Yukio Maeda ,  Shoshi Kabashima ,  Mikiya Nakata

IPC分类号： B23K3102

CPC分类号： G01N25/4866 ,  B23K3/0646 ,  B23K2101/36

摘要： There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve.

公开(公告)号：US06702175B1

公开(公告)日：2004-03-09

申请号：US10009168

申请日：2001-12-07

申请人： Kazumi Matsushige ,  Toshihisa Horiuchi ,  Takashi Ikari ,  Kenichiro Suetsugu ,  Masato Hirano ,  Shunji Hibino ,  Atsushi Yamaguchi

发明人： Kazumi Matsushige ,  Toshihisa Horiuchi ,  Takashi Ikari ,  Kenichiro Suetsugu ,  Masato Hirano ,  Shunji Hibino ,  Atsushi Yamaguchi

IPC分类号： B23K106

CPC分类号： B23K1/06 ,  B23K1/20 ,  B23K35/262 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/3463

摘要： There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

摘要翻译： 提供了一种焊接无铅焊料的方法，其降低无铅焊料的熔点并防止在由无铅焊料接合的部分处的接合强度的劣化，以及使用 焊接方法。 作为不含铅的锡的合金的无铅焊料熔化，并且当熔融的铅 - 铅焊料作为熔融的铅 - 铅焊料时，超声波振动至少与通过无铅焊料接合的接合体或无铅焊料起作用， 自由焊料固化。 因此，无铅焊料中含有的成分的晶体变细，并且防止了被包含的部件在接合物的接合界面处偏析，从而可以提高接合界面处的接合强度。

公开(公告)号：US5962133A

公开(公告)日：1999-10-05

申请号：US981565

申请日：1997-12-19

申请人： Atsushi Yamaguchi ,  Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Akio Furusawa

发明人： Atsushi Yamaguchi ,  Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Akio Furusawa

IPC分类号： B23K35/02 ,  B23K35/14 ,  B23K35/26 ,  H01L23/495 ,  H05K3/24 ,  H05K3/34 ,  B32B5/16 ,  B32B15/00

CPC分类号： H05K3/244 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/26 ,  H01L23/49582 ,  H05K3/3463 ,  H05K3/3484 ,  B23K35/025 ,  H01L2924/0002 ,  H05K2201/0218 ,  H05K2201/10636 ,  H05K2203/0425 ,  H05K3/3421 ,  Y02P70/611 ,  Y10T428/24917 ,  Y10T428/2938 ,  Y10T428/294 ,  Y10T428/2951 ,  Y10T428/2991

摘要： The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).

摘要翻译： PCT No.PCT / JP96 / 01680 Sec。 371 1997年12月19日第 102（e）1997年12月19日PCT PCT 1996年6月19日PCT公布。 出版物WO97 / 00753 日期1997年1月9日通过提高粘合强度的润湿性，并且能够使焊料逐渐熔化，从而降低部分切屑剥离的发生。 提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。 焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。

公开(公告)号：US5198655A

公开(公告)日：1993-03-30

申请号：US642271

申请日：1991-01-15

申请人： Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Tokuhito Hamane ,  Junji Ikeda ,  Yukio Maeda

发明人： Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Tokuhito Hamane ,  Junji Ikeda ,  Yukio Maeda

IPC分类号： G02B6/122 ,  H04N1/028 ,  H04N1/031 ,  H04N1/04

CPC分类号： H04N1/02835 ,  H04N1/02855 ,  H04N1/02865 ,  H04N1/0311 ,  H04N1/0312 ,  H04N1/0314

摘要： An image reading device includes: a light emitting element for irradiating light on an image surface; a light receiving element for receiving image information in the form of reflected light from the image surface; and light waveguide passages provided between the light emitting element and the image surface and between the light receiving element and the image surface, respectively, and at least the light waveguide passage for the light emitting element is widened at an end surface thereof at the image surface to a width wider than at the end surface at the light emitting element.

公开(公告)号：US5037233A

公开(公告)日：1991-08-06

申请号：US447356

申请日：1989-12-07

申请人： Munekazu Nishihara ,  Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Jyunji Ikeda ,  Yakeshi Yoshii ,  Masato Tanida ,  Kazumi Nishimura

发明人： Munekazu Nishihara ,  Kenichiro Suetsugu ,  Tetsuo Fukushima ,  Jyunji Ikeda ,  Yakeshi Yoshii ,  Masato Tanida ,  Kazumi Nishimura

IPC分类号： B62K19/22 ,  F16B1/00 ,  F16B7/00 ,  F16B11/00 ,  F16B21/18

CPC分类号： F16B21/183 ,  B62K19/22 ,  F16B11/008 ,  F16B1/0014 ,  F16B11/006 ,  F16B7/00 ,  Y10T403/471 ,  Y10T403/60 ,  Y10T403/74

摘要： A bicycle frame comprising a lug and a pipe to be fitted onto a projection at the lug, annular grooves opposite to each other being disposed at the mutual contact surfaces of the lug projection and pipe, wherein an unidirectional form memory alloy changeable of its outer diameter by heating is disposed in one of the opposite annular grooves, and the projection of the lug and the pipe are bonded at the fitting surfaces by means of a thermosetting adhesive, whereby the bicycle frame is high in safety and superior in productivity and has an improved bonding strength and mechanical juncture.

摘要翻译： 一种自行车车架，包括：凸耳和配合在凸耳上的突出部上的管道;相对于彼此相对的环形槽设置在凸耳突起和管道的相互接触表面处，其中单向形式记忆合金可改变其外径 通过加热设置在一个相对的环形槽中，并且凸耳和管的突出部通过热固性粘合剂结合在配合表面，由此自行车车架的安全性高，生产率优异，并且具有改进的 接合强度和机械接合面。