公开(公告)号：US20100147677A1

公开(公告)日：2010-06-17

申请号：US12607689

申请日：2009-10-28

申请人： Mustafa Pinarbasi ,  Homayoun Talieh ,  Bulent M. Basol

发明人： Mustafa Pinarbasi ,  Homayoun Talieh ,  Bulent M. Basol

IPC分类号： C23C14/34 ,  C23C14/56

CPC分类号： G06F3/1446 ,  B05D3/0493 ,  B05D2252/02 ,  C23C14/562 ,  G06F3/1438 ,  G09F9/30 ,  G09F9/301 ,  G09F9/33 ,  G09G3/2088 ,  G09G3/32 ,  G09G2300/026 ,  G09G2300/0452 ,  G09G2320/0626 ,  G09G2380/02 ,  G09G2380/06 ,  H01L31/03923 ,  H01L31/206 ,  Y02E10/541 ,  Y02P70/521

摘要： A roll to roll system for depositing a material on a workpiece is provided. In one embodiment, the system includes a drum, which rotates about an axis that is transverse to a process direction, and a number of PVD deposition units. The drum further includes a peripheral surface that includes a groove having a recessed workpiece contact surface that is parallel to the axis and disposed between a first side wall and a second side wall. A portion of the recessed workpiece contact surface supports a section of the workpiece and the first and second side walls maintain the section of the workpiece on the portion of the recessed workpiece contact surface as the workpiece is moved along the process direction. The PVD deposition units are disposed across from some of the portion of the peripheral surface and continuously deposit the material across a width of some of the section of the workpiece.

摘要翻译： 提供了一种用于在工件上沉积材料的卷对卷系统。 在一个实施例中，系统包括围绕横向于工艺方向的轴线旋转的滚筒和多个PVD沉积单元。 滚筒还包括外围表面，该外围表面包括凹槽，凹槽具有凹入的工件接触表面，其平行于轴线并且设置在第一侧壁和第二侧壁之间。 凹陷工件接触表面的一部分支撑工件的一部分，并且随着工件沿着工艺方向移动，第一和第二侧壁将工件的部分保持在凹入工件接触表面的部分上。 PVD沉积单元跨越外围表面的一些部分设置，并且将材料连续地沉积在工件的一些部分的宽度上。

公开(公告)号：US20110239450A1

公开(公告)日：2011-10-06

申请号：US12906988

申请日：2010-10-18

申请人： Bulent M. Basol ,  Jalal Ashjaee ,  Douglas Young ,  Homayoun Talieh

发明人： Bulent M. Basol ,  Jalal Ashjaee ,  Douglas Young ,  Homayoun Talieh

IPC分类号： H01L31/18

CPC分类号： H01L31/0504 ,  B32B37/1018 ,  B32B37/22 ,  B32B2457/12 ,  H01L31/02 ,  H01L31/048 ,  H01L31/05 ,  Y02E10/50 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53261 ,  Y10T29/534 ,  Y10T29/53526

摘要： Described in one embodiment is a system that has a multiple number of different stations for forming solar cell modules. Described in another embodiment is a system that includes a cutting station, a setting station, and an interconnection station to create different series-connected flexible solar cell modules. Described in still another embodiment is a monolithically integrated multi-module power supply.

摘要翻译： 在一个实施例中描述的是具有用于形成太阳能电池模块的多个不同站的系统。 在另一实施例中描述的是包括切割站，设置站和互连站以创建不同串联的柔性太阳能电池模块的系统。 在又一实施例中描述的是单片集成多模块电源。

公开(公告)号：US07704880B1

公开(公告)日：2010-04-27

申请号：US12190082

申请日：2008-08-12

申请人： Cyprian E. Uzoh ,  Bulent M. Basol ,  Hung-Ming Wang ,  Homayoun Talieh

发明人： Cyprian E. Uzoh ,  Bulent M. Basol ,  Hung-Ming Wang ,  Homayoun Talieh

IPC分类号： H01L21/44

CPC分类号： H01L21/2885 ,  C25D5/02 ,  C25D7/123 ,  C25D17/005

摘要： A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.

摘要翻译： 提供了一种用于在基板的表面上制造可移除接触结构以在电加工期间将电从接触构件传导到表面的方法。 该方法包括在表面上形成导电层。 导电层的预定区域被接触层选择性地涂覆，使得当在导电层上进行电处理时，接触构件接触接触层。

公开(公告)号：US06867136B2

公开(公告)日：2005-03-15

申请号：US10201606

申请日：2002-07-22

申请人： Bulent M. Basol ,  Homayoun Talieh ,  Cyprian E. Uzoh

发明人： Bulent M. Basol ,  Homayoun Talieh ,  Cyprian E. Uzoh

IPC分类号： B23H5/08 ,  C25D5/02 ,  C25D5/06 ,  C25D5/10 ,  C25D5/18 ,  C25D5/22 ,  C25D5/48 ,  C25D7/12 ,  H01L21/288 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/768 ,  H01L21/44

CPC分类号： B23H5/08 ,  C25D5/02 ,  C25D5/10 ,  C25D5/18 ,  C25D5/22 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/32125 ,  H01L21/7684 ,  H01L21/76877

摘要： The present invention relates to a process for forming a near-planar or planar layer of a conducting material, such as copper, on a surface of a workpiece using an ECMPR technique. The process preferably uses at least two separate plating solution chemistries to form a near-planar or planar copper layer on a semiconductor substrate that has features or cavities on its surface.

摘要翻译： 本发明涉及使用ECMPR技术在工件表面上形成诸如铜的导电材料的近平面或平面层的方法。 该方法优选使用至少两个单独的电镀溶液化学物质，以在其表面上具有特征或空腔的半导体衬底上形成近平面或平面的铜层。

公开(公告)号：US06649523B2

公开(公告)日：2003-11-18

申请号：US09969531

申请日：2001-10-01

申请人： Bulent M. Basol ,  Cyprian E. Uzoh ,  Homayoun Talieh

发明人： Bulent M. Basol ,  Cyprian E. Uzoh ,  Homayoun Talieh

IPC分类号： H01L21302

CPC分类号： B24D13/14 ,  B24B37/042 ,  B24B37/24 ,  B24D3/346 ,  C23F3/00 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/7684

摘要： Systems and methods to remove a first material located on a top surface of a workpiece are presented according to one aspect of the present invention. According to an exemplary method, the pad including a second material is positioned proximate to the workpiece so that a front surface of the pad contacts an exposed surface of the first material. The front surface of the pad is mechanically moved against the exposed surface of the first material to initiate a chemical reaction between the first material and the second material that yields a reaction product. The reaction product may be removed by using a chemical solution, by using the mechanical movement of the pad against the exposed surface of the first material or both.

公开(公告)号：US06482307B2

公开(公告)日：2002-11-19

申请号：US09735546

申请日：2000-12-14

申请人： Jalal Ashjaee ,  Boguslaw A. Nagorski ,  Bulent M. Basol ,  Homayoun Talieh ,  Cyprian Uzoh

发明人： Jalal Ashjaee ,  Boguslaw A. Nagorski ,  Bulent M. Basol ,  Homayoun Talieh ,  Cyprian Uzoh

IPC分类号： C25D518

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/005 ,  C25F7/00 ,  H01L21/2885

摘要： Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the wafer frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the wafer is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the wafer frontal side surface, in its entirety, is thus permitted.

摘要翻译： 通过提供具有面向晶片正面的阳极区域的阳极和将晶片正面与至少一个电气电连接来进行导电材料沉积在半导体晶片的晶片正面上或从晶片正面去除导电材料 通过将电接触和晶片正面推动到彼此靠近来接触阳极区域外部。 在阳极和电接触之间施加电势，并且晶片相对于阳极和电触点移动。 因此允许在整个晶片正面侧面上进行全面电镀或电解抛光。

公开(公告)号：US07476304B2

公开(公告)日：2009-01-13

申请号：US10947628

申请日：2004-09-21

申请人： Jalal Ashjaee ,  Boguslaw Nagorski ,  Bulent M. Basol ,  Homayoun Talieh ,  Cyprian Uzoh

发明人： Jalal Ashjaee ,  Boguslaw Nagorski ,  Bulent M. Basol ,  Homayoun Talieh ,  Cyprian Uzoh

IPC分类号： C25D17/00 ,  C25D5/00

CPC分类号： C25F7/00 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885

摘要： Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the workpiece frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the workpiece frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the workpiece is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the workpiece frontal side surface, in its entirety, is thus permitted.

摘要翻译： 通过提供具有正面与工件正面的阳极区域并将工件正面与至少一个电气电连接的阳极进行导电材料沉积在导电材料上或从半导体工件的工件正面去除导电材料 通过将电触点和工件正面推入彼此靠近，在阳极区域外部接触。 在阳极和电接触之间施加电位，并且工件相对于阳极和电触点移动。 因此允许在工件正面侧面上进行全面电镀或电解抛光。

公开(公告)号：US07427337B2

公开(公告)日：2008-09-23

申请号：US10822424

申请日：2004-04-12

申请人： Bulent M. Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard M. Frey

发明人： Bulent M. Basol ,  Jalal Ashjaee ,  Boris Govzman ,  Homayoun Talieh ,  Bernard M. Frey

IPC分类号： B23H3/00 ,  B23H3/02

CPC分类号： B24B37/046 ,  B24B37/20 ,  C25F7/00 ,  H01L21/2885 ,  H01L21/32115 ,  H01L21/32125 ,  H01L21/67075 ,  H01L21/6715

摘要： An apparatus for electropolishing a conductive layer on a wafer using a solution is disclosed. The apparatus comprises an electrode assembly immersed in the solution configured proximate to the conductive layer having a longitudinal dimension extending to at least a periphery of the wafer, the electrode assembly including an elongated contact electrode configured to receive a potential difference, an isolator adjacent the elongated contact electrode, and an elongated process electrode adjacent the isolator configured to receive the potential difference, a voltage supply is configured to supply the potential difference between the contact electrode and the process electrode to electropolish the conductive layer on the wafer.

摘要翻译： 公开了一种使用溶液对晶片上的导电层进行电解抛光的装置。 该装置包括浸入在靠近导电层配置的溶液中的电极组件，其具有延伸至晶片的至少周边的纵向尺寸，电极组件包括构造成接收电位差的细长接触电极，邻近细长的隔离器 接触电极和邻近隔离器的细长工艺电极，其被配置为接收电位差，电压源被配置为提供接触电极和处理电极之间的电位差以对晶片上的导电层进行电解抛光。

公开(公告)号：US07309413B2

公开(公告)日：2007-12-18

申请号：US10459321

申请日：2003-06-10

申请人： Homayoun Talieh ,  Cyprian Uzoh ,  Bulent M. Basol

发明人： Homayoun Talieh ,  Cyprian Uzoh ,  Bulent M. Basol

IPC分类号： C25D5/04 ,  C25D7/12 ,  C25F3/12

CPC分类号： B23H3/04 ,  B23H5/08 ,  C25D5/08 ,  C25D17/00 ,  C25D17/001 ,  C25D17/005 ,  C25F7/00 ,  H01L21/2885

摘要： Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.

摘要翻译： 可以通过包括第一和第二导电元件的特定装置来提供导电材料在包含导电材料的电解质的衬底的包括半导体晶片的表面上的基本均匀沉积。 第一导电元件可以具有相同或不同构造的多个电触点，或者可以是导电焊盘的形式，并且可以在基本上所有的衬底表面上与衬底表面接触或以其他方式电互连。 当在电解质与衬底表面和第二导电元件物理接触的同时在第一和第二导电元件之间施加电势时，导电材料沉积在衬底表面上。 可以使施加在阳极和阴极之间的电压的极性反转，从而可以对沉积的导电材料进行电蚀刻。

公开(公告)号：US07122473B2

公开(公告)日：2006-10-17

申请号：US10920028

申请日：2004-08-16

申请人： Jalal Ashjaee ,  Rimma Volodarsky ,  Cyprian E. Uzoh ,  Bulent M. Basol ,  Homayoun Talieh

发明人： Jalal Ashjaee ,  Rimma Volodarsky ,  Cyprian E. Uzoh ,  Bulent M. Basol ,  Homayoun Talieh

IPC分类号： H01L21/445

CPC分类号： H01L21/6708 ,  H01L21/2885 ,  H01L21/32134

摘要： The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof. The at least one nozzle is located in an upper chamber of a vertically configured processing subsystem that also includes mechanisms for plating, cleaning and drying in upper and lower chambers.

摘要翻译： 本发明提供了至少一个喷嘴，其在其边缘处用蚀刻剂喷射旋转的工件。 至少一个喷嘴位于垂直配置的处理子系统的上部室中，其还包括用于上部和下部室中的电镀，清洁和干燥的机构。