Light emitting device and method for manufacturing light emitting device

    公开(公告)号:US11164991B2

    公开(公告)日:2021-11-02

    申请号:US16724007

    申请日:2019-12-20

    Abstract: A light emitting device includes: a plurality of light emitting elements; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a mounting board on which the light emitting elements are disposed; a first cover member located on or above the mounting board, the first cover member comprising: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements and comprising a second reflective material.

    Light emitting apparatus and production method thereof

    公开(公告)号:US10741729B2

    公开(公告)日:2020-08-11

    申请号:US14988319

    申请日:2016-01-05

    Abstract: A light emitting apparatus includes an electrically insulating base member; a first electrically conductive pattern portion and a second electrically conductive pattern portion formed on an upper surface of the base member; a plurality of intermediate electrically conductive pattern portions arranged between the first and second electrically conductive pattern portions; at least one light emitting device mounted on at least one of the intermediate electrically conductive pattern portions; a protection element mounted on the first and second electrically conductive pattern portions; and a resin portion disposed around the at least one light emitting device such that (i) the first and second electrically conductive pattern portions are partially covered by the resin portion and partially exposed from the resin portion, and (ii) the protection element is covered by the resin portion.

    Method of manufacturing light emitting device

    公开(公告)号:US10429011B2

    公开(公告)日:2019-10-01

    申请号:US15914190

    申请日:2018-03-07

    Abstract: A method of manufacturing a light emitting device includes: mounting a plurality of light emitting elements on a base material; joining a plurality of translucent members respectively on upper surfaces of the light emitting elements; covering side surfaces of the light emitting elements and side surfaces of the translucent members with a light reflecting member at once; and forming a groove in the light reflecting member between adjacent ones of the light emitting elements.

    Light-emitting device manufacturing method

    公开(公告)号:US09972752B2

    公开(公告)日:2018-05-15

    申请号:US15093162

    申请日:2016-04-07

    Inventor: Kenji Ozeki

    Abstract: A light-emitting device having good light extracting efficiency is provided, along with a method for manufacturing the same. A method for manufacturing a light-emitting device includes preparing a base that includes a recess, arranging a light-emitting element on a bottom surface of the recess, dropping a first member into the recess to continuously cover an upper surface of the light-emitting element and an inner wall of the recess by the first member, dropping a second member into the recess, wherein the second member has a higher specific gravity than the first member, and further wherein dropping the second member includes semi-curing the first member, and after the second member is dropped, fully curing the first member and the second member.

    Light emitting device
    8.
    发明授权

    公开(公告)号:US09780258B2

    公开(公告)日:2017-10-03

    申请号:US15216321

    申请日:2016-07-21

    Abstract: A light emitting device includes a base member; a light emitting element mounted on the base member; a light-transmissive member that covers an upper surface of the light emitting element, and is substantially rectangular in a plan view; and a light reflecting member that covers a lateral surface of the light-transmissive member, the light reflecting member having a substantially rectangular frame shape in a plan view. A width of the light reflecting member is smaller along a short side of the light-transmissive member than along a long side of the light-transmissive member. A height of the light reflecting member is smaller along the short side of the light-transmissive member than along the long side of the light-transmissive member at a position separated from an outer edge of the light reflecting member by a predetermined distance.

    Semiconductor light emitting device
    10.
    发明授权
    Semiconductor light emitting device 有权
    半导体发光器件

    公开(公告)号:US09478527B2

    公开(公告)日:2016-10-25

    申请号:US15152139

    申请日:2016-05-11

    Abstract: A light emitting device includes a substrate, a light emitting element mounted on the substrate, a light transmissive member placed on an upper surface of the light emitting element, and a sealing member which seals the light emitting element and the light transmissive member. The light transmissive member is a plate-shaped member not containing a phosphor and is larger than the light emitting element when viewed from above. The sealing member includes a first sealing member which is formed of a light reflecting member for reflecting light emitted from the light emitting element and covers side surfaces of the light emitting element, and a second sealing member which contains a phosphor for converting the light emitted from the light emitting element into light having wavelength different from wavelength of the light emitted from the light emitting element and covers at least an upper surface of the light transmissive member.

    Abstract translation: 发光装置包括基板,安装在基板上的发光元件,放置在发光元件的上表面上的透光构件以及密封发光元件和透光构件的密封构件。 透光构件是不含荧光体的板状构件,当从上方观察时大于发光元件。 密封构件包括:第一密封构件,其由用于反射从发光元件发射的光并且覆盖发光元件的侧表面的光反射构件形成;第二密封构件,其包含用于将从 所述发光元件变成具有与从所述发光元件发射的光的波长不同的波长的光并且覆盖所述透光构件的至少上表面。

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