公开(公告)号：US09502333B2

公开(公告)日：2016-11-22

申请号：US14056230

申请日：2013-10-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Meng-Tsung Lee ,  Yi-Che Lai ,  Shih-Kuang Chiu

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L24/14 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13 ,  H01L2224/1401 ,  H01L2224/1412 ,  H01L2924/15788 ,  H01L2924/00

Abstract: A semiconductor device is provided, including: a substrate having opposing first and second surfaces and a plurality of conductive vias passing through the first and second surfaces; an insulating layer formed on the first surface of the substrate and exposing end portions of the conductive vias therefrom; and a buffer layer formed on the insulating layer at peripheries of the end portions of the conductive vias, thereby increasing product reliability and good yield.

Abstract translation: 提供一种半导体器件，包括：具有相对的第一和第二表面的衬底和穿过第一和第二表面的多个导电通孔; 绝缘层，形成在所述基板的所述第一表面上，并暴露所述导电通孔的端部; 以及在导电通孔的端部的周边形成在绝缘层上的缓冲层，从而提高产品的可靠性和良好的产率。

公开(公告)号：US20180158784A1

公开(公告)日：2018-06-07

申请号：US15883808

申请日：2018-01-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Meng-Tsung Lee ,  Fu-Tang Huang

IPC: H01L23/552 ,  H01L25/10 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/31 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method for fabricating an electronic package is provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant on the carrier for encapsulating the electronic element and the package block; and removing the carrier so as to expose the electronic element and the conductive posts from a surface of the encapsulant. As such, the invention dispenses with formation of through holes in the encapsulant for forming the conductive posts as in the prior art, thereby saving the fabrication cost.

公开(公告)号：US09899237B2

公开(公告)日：2018-02-20

申请号：US14174988

申请日：2014-02-07

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu

IPC: H01L23/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/673 ,  H01L21/768 ,  H01L21/78 ,  H01L21/68 ,  H01L21/48 ,  H01L21/683 ,  H01L21/677

CPC classification number: H01L21/56 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L21/673 ,  H01L21/67333 ,  H01L21/67763 ,  H01L21/68 ,  H01L21/683 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014

Abstract: A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided.

公开(公告)号：US20170229364A1

公开(公告)日：2017-08-10

申请号：US15497964

申请日：2017-04-26

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3135 ,  H01L23/5389 ,  H01L24/09 ,  H01L24/19 ,  H01L24/20 ,  H01L24/27 ,  H01L24/29 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01L2224/19 ,  H01L2924/014 ,  H01L2924/00

Abstract: A fabrication method of a semiconductor package includes the steps of: forming a release layer on a carrier having concave portions; disposing chips on the release layer in the concave portions of the carrier; forming an encapsulant on the chips and the release layer; forming a bonding layer on the encapsulant; removing the release layer and the carrier so as to expose the active surfaces of the chips; and forming a circuit structure on the encapsulant and the chips. Since the release layer is only slightly adhesive to the chips and the encapsulant, the present invention avoids warpage of the overall structure during a thermal cycle caused by incompatible CTEs.

公开(公告)号：US09041189B2

公开(公告)日：2015-05-26

申请号：US13659181

申请日：2012-10-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Meng-Tsung Lee ,  Chiang-Cheng Chang ,  Shih-Kuang Chiu

IPC: H01L23/538 ,  H01L21/00

CPC classification number: H01L21/00 ,  H01L21/568 ,  H01L23/3185 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05558 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/215 ,  H01L2224/82 ,  H01L2224/96 ,  H01L2924/15153 ,  H01L2924/18162 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/19 ,  H01L2224/11 ,  H01L2224/03

Abstract: A method of fabricating a semiconductor package is provided, including: providing a carrier having a plurality of chip areas defined thereon, and forming a connection unit on each of the chip areas; disposing a semiconductor element on each of the connection units; forming an insulating layer on the carrier and the semiconductor elements; and forming on the insulating layer a circuit layer electrically connected to the semiconductor elements. Since being formed only on the chip areas instead of on the overall carrier as in the prior art, the connection units are prevented from expanding or contracting during temperature cycle, thereby avoiding positional deviations of the semiconductor elements.

Abstract translation: 提供一种制造半导体封装的方法，包括：提供其上限定有多个芯片区域的载体，并且在每个芯片区域上形成连接单元; 在每个所述连接单元上设置半导体元件; 在载体和半导体元件上形成绝缘层; 以及在绝缘层上形成与半导体元件电连接的电路层。 由于在现有技术中仅在芯片区域而不是在整体载体上形成，所以连接单元在温度循环期间被防止膨胀或收缩，从而避免了半导体元件的位置偏差。

公开(公告)号：US20140021629A1

公开(公告)日：2014-01-23

申请号：US13654754

申请日：2012-10-18

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu ,  Fu-Tang Huang

IPC: H01L23/48 ,  H01L21/56

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76834 ,  H01L21/76877 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05567 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/24153 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.

Abstract translation: 提供一种制造半导体封装的方法，包括：通过粘合剂层将多个半导体元件设置在载体上，使载体的一部分从粘合剂层露出; 形成密封剂以封装半导体元件; 去除粘合剂层和载体以暴露半导体元件; 以及在半导体元件上形成积聚结构。 由于当温度变化时粘合剂层被分成多个不会由于膨胀或收缩而相互影响的分离部分，所以本发明防止了半导体元件在成型过程中的位置偏差，从而提高了对准精度。

公开(公告)号：US09875981B2

公开(公告)日：2018-01-23

申请号：US15297452

申请日：2016-10-19

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Meng-Tsung Lee ,  Yi-Che Lai ,  Shih-Kuang Chiu

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L24/14 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13 ,  H01L2224/1401 ,  H01L2224/1412 ,  H01L2924/15788 ,  H01L2924/00

Abstract: A semiconductor device is provided, including: a substrate having opposing first and second surfaces and a plurality of conductive vias passing through the first and second surfaces; an insulating layer formed on the first surface of the substrate and exposing end portions of the conductive vias therefrom; and a buffer layer formed on the insulating layer at peripheries of the end portions of the conductive vias, thereby increasing product reliability and good yield.

公开(公告)号：US09812340B2

公开(公告)日：2017-11-07

申请号：US15074110

申请日：2016-03-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu ,  Fu-Tang Huang

IPC: H01L21/00 ,  H01L21/56 ,  H01L23/00 ,  H01L21/683 ,  H01L21/768 ,  H01L23/31

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76834 ,  H01L21/76877 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05567 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/24153 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.

公开(公告)号：US20170040277A1

公开(公告)日：2017-02-09

申请号：US15297452

申请日：2016-10-19

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Meng-Tsung Lee ,  Yi-Che Lai ,  Shih-Kuang Chiu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L24/14 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/13 ,  H01L2224/1401 ,  H01L2224/1412 ,  H01L2924/15788 ,  H01L2924/00

Abstract: A semiconductor device is provided, including: a substrate having opposing first and second surfaces and a plurality of conductive vias passing through the first and second surfaces; an insulating layer formed on the first surface of the substrate and exposing end portions of the conductive vias therefrom; and a buffer layer formed on the insulating layer at peripheries of the end portions of the conductive vias, thereby increasing product reliability and good yield.

Abstract translation: 提供一种半导体器件，包括：具有相对的第一和第二表面的衬底和穿过第一和第二表面的多个导电通孔; 绝缘层，形成在所述基板的所述第一表面上，并暴露所述导电通孔的端部; 以及在导电通孔的端部的周边形成在绝缘层上的缓冲层，从而提高产品的可靠性和良好的产率。

公开(公告)号：US09324585B2

公开(公告)日：2016-04-26

申请号：US13654754

申请日：2012-10-18

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu ,  Fu-Tang Huang

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76834 ,  H01L21/76877 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05567 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/24153 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/05552

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.

Abstract translation: 提供一种制造半导体封装的方法，包括：通过粘合剂层将多个半导体元件设置在载体上，使载体的一部分从粘合剂层露出; 形成密封剂以封装半导体元件; 去除粘合剂层和载体以暴露半导体元件; 以及在半导体元件上形成积聚结构。 由于当温度变化时粘合剂层被分成多个不会由于膨胀或收缩而相互影响的分离部分，所以本发明防止了半导体元件在成型过程中的位置偏差，从而提高了对准精度。