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91.
公开(公告)号:US20240087860A1
公开(公告)日:2024-03-14
申请号:US17931374
申请日:2022-09-12
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Shoichi MURAKAMI
IPC: H01J37/32 , H01L21/3213
CPC classification number: H01J37/32972 , H01J37/32449 , H01J37/32963 , H01L21/32134 , H01J2237/3321 , H01J2237/3345
Abstract: An etching method includes etching a material in an etch chamber by alternating normal-flow etch steps and reduced-flow etch steps, where an etchant gas is provided at a normal flow rate into the etch chamber during the normal-flow etch steps, and the etchant gas is provided at a reduced flow rate lower than the normal flow rate into the etch chamber during the reduced-flow etch steps, obtaining optical emission spectroscopy (OES) data during the reduced-flow etch steps, determining an end point for the etching based on the obtained OES data, and ending the etching at the determined end point.
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公开(公告)号:US20240086074A1
公开(公告)日:2024-03-14
申请号:US17940465
申请日:2022-09-08
Applicant: SanDisk Technologies LLC
Inventor: Yi Song , Jiahui Yuan , Yanjie Wang
IPC: G06F3/06
CPC classification number: G06F3/0619 , G06F3/0653 , G06F3/0679
Abstract: An apparatus includes a control circuit configured to connect to NAND strings that are connected to bit lines, where each bit line is connected to a plurality of NAND strings in a corresponding plurality of regions of a block. The control circuit is configured to apply a read voltage in read operations directed to NAND strings of the plurality of regions of the block and subsequently adjust the read voltage by a first predetermined amount for read operations directed to NAND strings of a first region of the block. The control circuit is further configured to adjust the read voltage by a second predetermined amount for read operations directed to NAND strings of a second region of the block. The first and second predetermined amounts are based on respective locations of the first and second regions in the block.
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公开(公告)号:US20240079068A1
公开(公告)日:2024-03-07
申请号:US17939748
申请日:2022-09-07
Applicant: SanDisk Technologies LLC
Inventor: Dengtao Zhao , Deepanshu Dutta , Peng Zhang , Heguang Li
CPC classification number: G11C16/3427 , G11C16/10 , G11C16/26
Abstract: A storage device is disclosed herein. The storage device comprises: a non-volatile memory, where the non-volatile memory includes a block of N wordlines partitioned into a plurality of sub-blocks and the plurality of sub-blocks includes a first sub-block of a first subset of the block of N wordlines and a second sub-block of a second subset of the block of N wordlines; and control circuitry coupled to the block of N wordlines. The control circuitry is configured to: perform a program operation in a normal order programming sequence on the first sub-block; perform a sensing operation on the first sub-block using a reverse sensing scheme; perform a program operation in a reverse order programming sequence on the second sub-block; and perform a sensing operation on the second sub-block using a regular sensing scheme.
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公开(公告)号:US20240079063A1
公开(公告)日:2024-03-07
申请号:US17939160
申请日:2022-09-07
Applicant: SanDisk Technologies LLC
Inventor: Han-Ping Chen , Yanjie Wang
CPC classification number: G11C16/10 , G11C16/0483
Abstract: The memory device includes a memory block, which includes a plurality of memory cells arranged in a plurality of word lines. The memory device also includes control circuitry in communication with the memory block. The control circuitry is configured to perform a programming operation to program the memory cells of a selected word line of the plurality of word lines. During the programming operation, the control circuitry is configured to apply a programming pulse VPGM to a selected word line to the selected word line, apply a first pass voltage to a first set of word lines of the plurality of word lines, the first set of word lines being adjacent the selected word line, and apply a second pass voltage to a second set of word lines of the plurality of word. The first pass voltage is greater than the second pass voltage.
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95.
公开(公告)号:US20240079061A1
公开(公告)日:2024-03-07
申请号:US17901197
申请日:2022-09-01
Applicant: SanDisk Technologies LLC
Inventor: Xiaoyu Che , Yanjie Wang
CPC classification number: G11C16/10 , G11C16/0483 , G11C16/16
Abstract: A memory apparatus and method of operation are provided. The apparatus includes drain-side select gate transistors for coupling to a drain-side of memory holes of memory cells and configured to retain a transistor threshold voltage. The memory holes are arranged in rows comprising strings. A control means is configured to program drain-side select gate transistors of the memory holes to an initial transistor threshold voltage using pulses increasing in magnitude by a first transistor step amount during each of a plurality of foggy loops of a foggy program operation. The control means is also configured to program the drain-side select gate transistors of the memory holes to a target transistor threshold voltage using pulses increasing in magnitude by a second transistor step amount during each of a plurality of fine loops of a fine program operation. The first transistor step amount is greater than the second transistor step amount.
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96.
公开(公告)号:US20240074171A1
公开(公告)日:2024-02-29
申请号:US18062807
申请日:2022-12-07
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Masanori TSUTSUMI
IPC: H10B41/27 , H01L23/522 , H01L23/528 , H10B41/10 , H10B41/35 , H10B41/40 , H10B43/10 , H10B43/27 , H10B43/35 , H10B43/40
CPC classification number: H01L27/11556 , H01L23/5226 , H01L23/5283 , H01L27/11519 , H01L27/11524 , H01L27/11526 , H01L27/11565 , H01L27/1157 , H01L27/11573 , H01L27/11582
Abstract: A bonded assembly includes first memory die bonded to a logic die. The first memory die includes a first alternating stack of first insulating layers and first electrically conductive layers, first memory openings vertically extending through the first alternating stack, first memory opening fill structures located within the first memory openings and containing a respective vertical stack of first memory elements and a respective vertical semiconductor channel, electrically conductive first side-contact via structures vertically extending through each layer within the first alternating stack and contacting a sidewall of a respective one of the first electrically conductive layers, and first memory-side bonding pads. The logic die includes a peripheral circuitry configured to control operation of the first memory die, logic-side metal interconnect structures, and logic-side bonding pads that are bonded to the first memory-side bonding pads.
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公开(公告)号:US20240072804A1
公开(公告)日:2024-02-29
申请号:US17898263
申请日:2022-08-29
Applicant: SanDisk Technologies LLC
Inventor: SHIV HARIT MATHUR , SAI RAVI TEJA KONAKALLA
IPC: H03K19/0185 , H03K3/037
CPC classification number: H03K19/018521 , H03K3/037
Abstract: Improved voltage level shifters are disclosed capable of achieving substantially higher data transfer speeds with reduced static current than existing cross-coupled voltage level shifters. The voltage level shifters disclosed herein include first stage that translates input voltage signals received from a core circuitry in a first voltage domain to intermediate output voltage signals an intermediate voltage domain, and second stage circuitry that translates the intermediate output voltage signals received from the first stage circuitry in the intermediate voltage domain to output voltage signals in a second voltage domain. The disclosed voltage level shifters are scalable to support various logic voltage levels in the second voltage domain.
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98.
公开(公告)号:US20240064985A1
公开(公告)日:2024-02-22
申请号:US18386456
申请日:2023-11-02
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Masanori Tsutsumi , Kazuki Isozumi , Peng Zhang
Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate. The electrically conductive layers include word-line-level electrically conductive layers and drain-select-level electrically conductive layers overlying the word-line-level electrically conductive layers. An array of memory opening fill structures is located within an array of memory openings vertically extending through the alternating stack. An encapsulated cavity vertically extends through the drain-select-level electrically conductive layers. The array of memory opening fill structures includes two rows of first memory opening fill structures that are arranged along a first horizontal direction. Each of the first memory opening fill structures includes a respective planar straight sidewall in contact with a respective portion of a pair of straight sidewalls of the encapsulated cavity.
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公开(公告)号:US20240063278A1
公开(公告)日:2024-02-22
申请号:US18500623
申请日:2023-11-02
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: Dai IWATA , Hokuto KODATE
IPC: H01L29/423 , H01L27/06 , H01L29/66 , H01L29/06
CPC classification number: H01L29/42364 , H01L27/0617 , H01L29/6656 , H01L29/0653
Abstract: A lateral extent of a gate electrode of a field effect transistor along a gate electrode direction that is perpendicular to a channel direction can be the same as a width of an underlying active region. A gate electrode of an additional field effect transistor may extend over a trench isolation structure that laterally surrounds the additional field effect transistor. Different types of electrodes may be formed by patterning a lower gate material layer and by patterning an upper gate material layer with different patterns such that patterned portions of the lower gate material layer are confined within areas of active regions, while patterned portions of the upper gate material layer extends outside of the areas of the active regions.
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公开(公告)号:US11907545B2
公开(公告)日:2024-02-20
申请号:US17731971
申请日:2022-04-28
Applicant: SanDisk Technologies LLC
Inventor: YenLung Li , Siddarth Naga Murty Bassa , Chen Chen , Hua-Ling Cynthia Hsu
IPC: G06F3/06
CPC classification number: G06F3/0619 , G06F3/0617 , G06F3/0656 , G06F3/0658 , G06F3/0679
Abstract: For a non-volatile memory that uses hard bit and soft bit data in error correction operations, to reduce the amount of soft bit data that needs to be transferred from a memory to the controller and improve memory system performance, the soft bit data can be compressed before transfer. After the soft bit data is read and stored into the internal data latches associated with the sense amplifiers, it is compressed within these internal data latches. The compressed soft bit data can then be transferred to the transfer data latches of a cache buffer, where the compressed soft bit data can be consolidated and transferred out over an input-output interface. Within the input-output interface, the compressed data can be reshuffled to put into logical user data order if needed.
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