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公开(公告)号：US20110260182A1
公开(公告)日：2011-10-27
申请号：US13093431
申请日：2011-04-25
CPC分类号： H01L33/486 , F21K9/20 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/48 , H05K1/141 , H05K1/189 , H05K2201/10106
摘要： Light emitting device (LED) array assemblies and related methods are provided. An LED array assembly can include a primary substrate with an array of light emitting devices disposed on the primary substrate. The LED array assembly can also include a secondary substrate comprising at least one or more grooves. The primary substrate can be positioned on the secondary substrate with the grooves facing the primary substrate.
摘要翻译： 提供发光器件（LED）阵列组件及相关方法。 LED阵列组件可以包括具有布置在初级衬底上的发光器件阵列的初级衬底。 LED阵列组件还可以包括包括至少一个或多个凹槽的次基底。 主衬底可以定位在次级衬底上，其中凹槽面向初级衬底。
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公开(公告)号：USD641719S1
公开(公告)日：2011-07-19
申请号：US29338186
申请日：2009-06-05
CPC分类号： H01L2224/48247 , H01L2224/48465 , H01L2224/49113 , H01L2924/00
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公开(公告)号：US20100133554A1
公开(公告)日：2010-06-03
申请号：US12479318
申请日：2009-06-05
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/486 , H01L33/642 , H01L2224/48465 , H01L2224/49113 , H01L2924/12032 , Y10T29/49002 , H01L2924/00
摘要： A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.
摘要翻译： 发光封装包括至少一个固态发射器，引线框架和封装引线框架的一部分的主体结构。 至少一个孔限定在电引线中以限定多个电引线段，孔的至少一部分设置在封装的外侧壁的外侧。 可以在外侧壁中限定凹部以容纳电引线的弯曲部分。 身体结构腔可以由地板界定，并且侧壁部分和端壁部分被过渡壁部分分隔开，该过渡壁部分包括弯曲或分段的上边缘，其中不同的壁部分以不同的倾斜角度设置。
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公开(公告)号：US07649209B2
公开(公告)日：2010-01-19
申请号：US11739307
申请日：2007-04-24
IPC分类号： H01L33/00
CPC分类号： H01L33/502 , C09K11/7731 , C09K11/7734 , C09K11/7774 , G02B6/0023 , G02B6/0068 , G02B6/0073 , H01L33/486 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/01322 , H01L2933/0091 , Y02B20/181 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode is disclosed. The diode includes a package support and a semiconductor chip on the package support, with the chip including an active region that emits light in the visible portion of the spectrum. Metal contacts are in electrical communication with the chip on the package. A substantially transparent encapsulant covers the chip in the package. A phosphor in the encapsulant emits a frequency in the visible spectrum different from the frequency emitted by the chip and in response to the wavelength emitted by the chip. A display element is also disclosed that combines the light emitting diode and a planar display element. The combination includes a substantially planar display element with the light emitting diode positioned on the perimeter of the display element and with the package support directing the output of the diode substantially parallel to the plane of the display element.
摘要翻译： 公开了一种发光二极管。 二极管包括封装支撑件和封装支撑件上的半导体芯片，其中芯片包括在光谱的可见部分中发光的有源区域。 金属触点与封装上的芯片电连通。 基本上透明的密封剂覆盖封装中的芯片。 密封剂中的荧光体发射可见光谱中与芯片发射的频率不同的频率，并响应芯片发出的波长。 还公开了组合发光二极管和平面显示元件的显示元件。 该组合包括基本上平面的显示元件，其中发光二极管位于显示元件的周边上，并且封装支撑件引导二极管的输出基本上平行于显示元件的平面。
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公开(公告)号：US09859471B2
公开(公告)日：2018-01-02
申请号：US13362683
申请日：2012-01-31
CPC分类号： H01L33/486 , H01L24/48 , H01L24/49 , H01L25/0753 , H01L25/167 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/4945 , H01L2924/00014 , H01L2924/01322 , H01L2924/12032 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/19107 , H01L2933/0033 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2224/4554
摘要： High-brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion are provided. In one aspect, a high brightness package for a light emitter (e.g., a LED or LED chip) can include a body and a cavity disposed in the body. The cavity can include at least one cavity wall extending toward an intersection area of the body where the cavity wall intersects a cavity floor. The package can further include at least one electrical element having first and second surfaces, each of the first and second surfaces proximate the intersection area. The first surface can be disposed on a first plane and the second surface can be at least partially disposed on a second plane that is different than the first plane. The body can at least substantially cover the second surface.
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96.发明授权Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction 有权采用发光二极管（LED）的发光器件和方法，用于改进光提取公开(公告)号：US09496466B2
公开(公告)日：2016-11-15
申请号：US13312508
申请日：2011-12-06
CPC分类号： H01L33/54 , H01L24/49 , H01L33/20 , H01L33/58 , H01L2224/49113 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2933/005 , H01L2933/0058 , Y10T29/49117 , Y10T29/4913 , Y10T29/49169 , H01L2224/45099 , H01L2924/00
摘要： Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.
摘要翻译： 公开了具有改进的光提取和相关方法的发光器件。 在一个实施例中，发光器件可以包括底座，设置在底座上的至少一个发光芯片和设置在发光芯片上的透镜。 透镜可以包括透镜基座，其可以具有与基座的几何形状基本相同的几何形状。
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公开(公告)号：US09428688B2
公开(公告)日：2016-08-30
申请号：US12271945
申请日：2008-11-17
IPC分类号： C09K11/79 , C09K11/08 , C04B35/58 , C04B35/581 , C04B35/584 , C04B35/591 , C04B35/593 , C04B35/597 , C09K11/77
CPC分类号： C09K11/7734 , C04B35/58 , C04B35/581 , C04B35/584 , C04B35/591 , C04B35/593 , C04B35/5935 , C04B35/597 , C04B2235/3224 , C04B2235/3852 , C04B2235/3865 , C04B2235/3869 , C04B2235/3873 , C04B2235/445 , C09K11/025 , C09K11/0883 , C09K11/7728
摘要： A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
摘要翻译： 公开了一种形成混合荧光粉组合物的方法。 该方法包括以下步骤：在耐火金属坩埚中，并且在气体存在下，将包含至少钙，锶和铝的铕和氮化物的前体组合物焙烧，以防止在氮化物起始材料和耐火材料之间形成氮化物组合物 形成坩埚的金属。 所得组合物可以包括将可见光谱的蓝色部分中的频率转换成可见光谱的红色部分中的频率的磷光体。
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公开(公告)号：US09111778B2
公开(公告)日：2015-08-18
申请号：US13011609
申请日：2011-01-21
IPC分类号： H01L33/08 , H01L25/075 , G02F1/1335 , H01L23/00 , H01L33/48 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L25/0753 , G02F1/133603 , G02F1/133608 , H01L24/48 , H01L24/49 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/29144 , H01L2224/2929 , H01L2224/29399 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/83192 , H01L2224/92247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/10157 , H01L2924/10158 , H01L2924/12032 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/0105 , H01L2924/0665 , H01L2224/45099 , H01L2924/00
摘要： Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.
摘要翻译： 公开了发光二极管（LED）装置，系统和方法。 一方面，照明面板可以被配置为为液晶显示器（LCD）面板提供背光。 照明面板可以包括以阵列布置的一个或多个LED。 一个或多个LED可以使用金属对金属管芯附接方法安装在照明面板上，或者附接在设置在照明面板上的封装内。 在一个方面，可以使用本文公开的鲁棒金属 - 金属管芯附接技术和/或材料来连接一个或多个LED。
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公开(公告)号：US09052416B2
公开(公告)日：2015-06-09
申请号：US13087510
申请日：2011-04-15
CPC分类号： G02B6/0003 , F21K9/232 , F21K9/60 , F21K9/61 , F21K9/64 , F21V29/70 , F21Y2115/10 , G02B5/02 , G02B6/001 , G02B6/0035 , G02B6/005 , G02B6/0073 , G02B6/0096
摘要： A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that comprises an elongated wavelength conversion tube wall having wavelength conversion material such as phosphor dispersed therein uniformly or non-uniformly. The tube need not be cylindrical. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein.
摘要翻译： 半导体发光装置包括细长的中空波长转换管，其包括具有均匀或不均匀分散的诸如磷光体的波长转换材料的细长波长转换管壁。 管不需要是圆柱形的。 半导体发光器件被定向以在细长的中空波长转换管内发光，以照射到分散在其中的细长波长转换管壁和波长转换材料。
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公开(公告)号：US09048392B2
公开(公告)日：2015-06-02
申请号：US13093431
申请日：2011-04-25
IPC分类号： H01L33/00 , H01L33/48 , F21K99/00 , H01L25/075 , F21Y101/02 , F21Y105/00 , H01L33/62 , H05K1/14 , H05K1/18
CPC分类号： H01L33/486 , F21K9/20 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/48 , H05K1/141 , H05K1/189 , H05K2201/10106
摘要： Light emitting device (LED) array assemblies and related methods are provided. An LED array assembly can include a primary substrate with an array of light emitting devices disposed on the primary substrate. The LED array assembly can also include a secondary substrate comprising at least one or more grooves. The primary substrate can be positioned on the secondary substrate with the grooves facing the primary substrate.
摘要翻译： 提供发光器件（LED）阵列组件及相关方法。 LED阵列组件可以包括具有布置在初级衬底上的发光器件阵列的初级衬底。 LED阵列组件还可以包括包括至少一个或多个凹槽的次基底。 主衬底可以定位在次级衬底上，其中凹槽面向初级衬底。
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