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91.发明申请公开(公告)号：US20160087177A1
公开(公告)日：2016-03-24
申请号：US14888770
申请日：2014-05-05
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Thomas Schwarz , Frank Singer , Alexander Linkov , Stefan Illek , Wolfgang Mönch
CPC classification number: H01L33/62 , H01L24/24 , H01L25/0753 , H01L33/0095 , H01L33/46 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48471 , H01L2224/48479 , H01L2224/49107 , H01L2224/73265 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2933/0058 , H01L2933/0066 , H01L2924/00 , H01L2224/4554
Abstract: A radiation-emitting semiconductor device includes at least one semiconductor chip having a semiconductor layer sequence having an active region that produces radiation; a mounting surface on which at least one electrical contact for external contacting of the semiconductor chip is formed, wherein the mounting surface runs parallel to a main extension plane of the semiconductor layer sequence; a radiation exit surface running at an angle to or perpendicularly to the mounting surface; a radiation-guiding layer arranged in a beam path between the semiconductor chip and the radiation exit surface; and a reflector body adjacent to the radiation-guiding layer in regions and in a top view of the semiconductor device covers the semiconductor chip.
Abstract translation: 辐射发射半导体器件包括至少一个具有半导体层序列的半导体芯片，该半导体层序列具有产生辐射的有源区; 其上形成有用于半导体芯片外部接触的至少一个电触点的安装表面，其中所述安装表面平行于所述半导体层序列的主延伸平面延伸; 辐射出口表面以与安装表面成角度或垂直于该安装表面延伸; 布置在半导体芯片和辐射出射表面之间的光束路径中的辐射引导层; 并且在半导体器件的区域和顶视图中与辐射引导层相邻的反射器体覆盖半导体芯片。
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公开(公告)号：US20150295141A1
公开(公告)日：2015-10-15
申请号：US14441458
申请日：2013-11-04
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Thomas Schwarz , Matthias Sabathil
CPC classification number: H01L33/483 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H05K1/021 , H05K2201/09745 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
Abstract: In at least one embodiment, the optoelectronic semiconductor component contains at least one chip support having electrical contact devices and also at least one optoelectronic semiconductor chip that is set up to produce radiation and that is mechanically and electrically mounted on the chip support. A component support is attached to the chip support. The semiconductor chip is situated in a recess in the component support. The component support is electrically insulated from the chip support and from the semiconductor chip. The component support is formed from a metal or from a metal alloy. On a top that is remote from the chip support, the component support is provided with a reflective coating.
Abstract translation: 在至少一个实施例中，光电子半导体部件包含至少一个具有电接触器件的芯片支架，并且还包括至少一个光电子半导体芯片，该光电半导体芯片设置成产生辐射并且机械地和电气地安装在芯片支撑件上。 组件支持附加到芯片支持。 半导体芯片位于部件支撑件的凹部中。 元件支撑件与芯片支撑件和半导体芯片电绝缘。 部件支撑由金属或金属合金形成。 在远离芯片支架的顶部，元件支撑件提供反射涂层。
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公开(公告)号：US20150137162A1
公开(公告)日：2015-05-21
申请号：US14413670
申请日：2013-07-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz
CPC classification number: H01L33/486 , H01L25/0753 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component has a volume-emitting sapphire flip-chip with an upper side and a lower side. This optoelectronic semiconductor component is embedded in an optically transparent mold body with an upper side and a lower side.
Abstract translation: 光电子半导体元件具有上侧和下侧的体积发射蓝宝石倒装芯片。 该光电子半导体部件嵌入具有上侧和下侧的光学透明模具体中。
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公开(公告)号：US11984435B2
公开(公告)日：2024-05-14
申请号：US17289114
申请日：2019-11-08
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Frank Singer
IPC: H01L25/075 , H01L33/10 , H01L33/58 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/10 , H01L33/58 , H01L33/62
Abstract: A multi-pixel display device with an integrated circuit, a plurality of light-emitting semiconductor chips disposed on the integrated circuit, a display area having a plurality of pixels, each of the light-emitting semiconductor chips being associated with one of the pixels, a light-directing element disposed between the plurality of light-emitting semiconductor chips and the display area and adapted to direct the light of each light-emitting semiconductor chip from the plurality of light-emitting semiconductor chips to its associated pixel.
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公开(公告)号：US11480723B2
公开(公告)日：2022-10-25
申请号：US17475030
申请日：2021-09-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Thomas Schwarz , Tilman Ruegheimer , Frank Singer
IPC: F21V8/00 , G02B27/01 , H01L25/075
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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Patent Agency Ranking
公开(公告)号：US20220254304A1
公开(公告)日：2022-08-11
申请号：US17677870
申请日：2022-02-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thorsten Baumheinrich , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Jens Richter , Thomas Schwarz , Paul Ta , Kilian Regau , Christopher Soell , Hoa Vu , Christopher Wiesmann , Patrick Hoerner , Jong Park , Kanishk Chand
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号：US11156759B2
公开(公告)日：2021-10-26
申请号：US17039422
申请日：2020-09-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Thomas Schwarz , Tilman Ruegheimer , Frank Singer
IPC: F21V8/00 , G02B27/01 , H01L25/075
Abstract: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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98.发明授权公开(公告)号：US11152423B2
公开(公告)日：2021-10-19
申请号：US16098283
申请日：2017-05-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Matthias Sabathil , Frank Singer , Thomas Schwarz
IPC: H01L27/15 , H01L25/075 , H01L33/58 , H01L33/08 , H01L33/62
Abstract: An optical assembly and a display device are disclosed. In an embodiment an optical assembly includes a common carrier, a plurality of first chip groups, each first chip group comprising at least two similar luminescence diode chips, a plurality of second chip groups, each second chip group comprising at least two similar luminescence diode chips, wherein the first and second chip groups are arranged planar along a regular grid of first unit cells on a main surface of the common carrier and an optical element arranged downstream of the first and second chip groups with respect to a main radiation direction, wherein the luminescence diode chips of the different chip groups are configured to emit electromagnetic radiation of different wavelength characteristics.
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公开(公告)号：US11024610B2
公开(公告)日：2021-06-01
申请号：US16318279
申请日：2017-07-13
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Alexander Martin , Jürgen Moosburger , Karl Engl
IPC: H01L25/075 , G09F9/00 , H01L33/62
Abstract: A module for a video wall includes a plurality of light-emitting components; and a carrier including conduction regions, wherein the light-emitting components each include a top side including a top-side contact and an underside including an underside contact, the light-emitting components are configured to emit electromagnetic radiation via the top side, the underside contacts of the light-emitting components electrically conductively connect to the conduction regions, the top-side contacts electrically contact a conductive layer, the light-emitting components each include at least four light-emitting semiconductor chips, the light-emitting semiconductor chips within a light-emitting component interconnect in parallel with one another, the light-emitting semiconductor chips within a light-emitting component each electrically conductively connect to the top-side contacts and the underside contacts of the light-emitting component, a plurality of adjacent light-emitting components constitute a cluster, and the light-emitting semiconductor chips of the light-emitting components of a cluster includes an identical nominal wavelength.
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公开(公告)号：US11023194B2
公开(公告)日：2021-06-01
申请号：US16314467
申请日：2017-06-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Frank Singer , Jürgen Moosburger , Karl Engl , Alexander Martin
Abstract: An arrangement includes at least two modules for a video wall including light-emitting components arranged on a carrier, wherein a drive circuit that selectively drives the component at the carrier is provided for each component, row lines and column lines are provided, each drive circuit connects to a row line and a column line, each drive circuit connects to power supply lines, the carrier includes plated-through holes that guide the row lines and the column lines onto an underside of the carrier, the two modules are arranged on a further carrier, the further carrier includes at least one recess, an electrical connector is arranged in the recess, and the electrical connector connects column lines and/or row lines of the two modules to one another.
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