公开(公告)号：US5569960A

公开(公告)日：1996-10-29

申请号：US438466

申请日：1995-05-10

申请人： Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Naotaka Tanaka ,  Nae Yoneda ,  Ichiro Anjoh

发明人： Tetsuo Kumazawa ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Naotaka Tanaka ,  Nae Yoneda ,  Ichiro Anjoh

IPC分类号： H05K1/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/50 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48

CPC分类号： H01L24/11 ,  H01L23/3128 ,  H05K3/3436 ,  H01L2224/13099 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/20752 ,  H05K1/11 ,  H05K1/111 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K3/3431 ,  Y02P70/613

摘要： An electronic component unit is provided with two electronic components which are disposed in parallel with each other and each of which has an internal electric circuit therein. Electrode pads are provided on the opposed surfaces of the two electronic components and are electrically connected to the internal electric circuits. The pads on one of the electronic components are respectively electrically and mechanically connected to the corresponding pads on the other electronic component by solder bumps. The areas of the pads increase or decrease stepwise in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the volumes of the solder bumps are constant. Alternatively, the volumes of the solder bumps decrease or increase in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the areas of all pads are constant. Each of the pads of the two electronic components is bonded to an associated solder bump over the whole area of the pad, whereby the shapes of the solder bumps respectively connected to the pads of the two electronic components change in the direction from the central portions toward the outer peripheral edges of the two electronic components to provide the solder bumps with different durabilities to stress, thereby assuring high reliability of the connection between the two electronic components.

摘要翻译： 电子部件单元设置有彼此并联布置的两个电子部件，每个电子部件在其中具有内部电路。 电极焊盘设置在两个电子部件的相对表面上并与内部电路电连接。 其中一个电子部件上的焊盘通过焊料凸块分别电连接和机械连接到另一电子部件上的对应的焊盘。 焊盘的面积在从两个电子部件的中心部分朝向外周边缘的方向上逐渐增加或减小，而焊料凸块的体积是恒定的。 或者，焊料凸块的体积在从两个电子部件的中心部分朝向外周边缘的方向上减小或增加，而所有焊盘的面积是恒定的。 两个电子部件的每个焊盘在焊盘的整个区域上结合到相关联的焊料凸块，由此分别连接到两个电子部件的焊盘的焊料凸块的形状在从中心部分朝向 两个电子部件的外周边缘，以使焊料凸块具有不同的应力耐久性，从而确保两个电子部件之间的连接的高可靠性。

公开(公告)号：US5391916A

公开(公告)日：1995-02-21

申请号：US75928

申请日：1993-06-14

申请人： Ryuji Kohno ,  Makoto Kitano ,  Asao Nishimura

发明人： Ryuji Kohno ,  Makoto Kitano ,  Asao Nishimura

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L21/52 ,  H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L23/48 ,  H01L29/44

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2225/1005 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01061 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/351

摘要： A semiconductor device of a structure in which lateral surfaces of a semiconductor element and an element supporting member are bonded to each other without resorting to use of a base member on which the semiconductor element is disposed. Since thicknesses of the base member and a bonding resin provides no contribution to overall thickness of the semiconductor device, reduction of thickness thereof by 30 to 40% is made possible. In dependence on configuration of the element supporting member, the semiconductor device can be applied to large size elements, lead-on-chip structure (LOC) and others.

摘要翻译： 半导体元件和元件支撑构件的侧表面彼此结合而不需要使用其上设置有半导体元件的基底构件的结构的半导体器件。 由于基材和接合树脂的厚度对半导体器件的总厚度没有贡献，所以可以使其厚度减少30〜40％。 根据元件支撑构件的配置，半导体器件可以应用于大尺寸元件，片上芯片结构（LOC）等。

公开(公告)号：US5347429A

公开(公告)日：1994-09-13

申请号：US68319

申请日：1993-05-28

申请人： Ryuji Kohno ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda

发明人： Ryuji Kohno ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Nae Yoneda

IPC分类号： H01L25/18 ,  H01L23/06 ,  H01L23/495 ,  H01L23/52 ,  H01L25/04 ,  H01L25/065 ,  H01L25/07 ,  H05K5/02

CPC分类号： H01L23/4951 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107

摘要： A plastic-molded-type semiconductor device includes a plurality of semiconductor chips, metallic wires connected to the semiconductor chips, leads connected to the metallic wires, and an insulating member interposed between the semiconductor chips and sealed in a resin member. Circuit formed surfaces of the semiconductor chips are directed in the same direction, and one or more of the semiconductor chips serve as a base on which the other semiconductor chips are mounted through the insulating member. One ends of the leads are bonded to the insulating member, and electrodes pad of each semiconductor chip are not covered by the other semiconductor chips, the insulating member and the leads, and therefore are exposed to the surface of the insulating member. In this device, the provision of a tab is omitted, and the laminated chips can be contained in a package thinner than a conventional package. Since the circuit formation surfaces of all of the chips are directed in the same direction, all of the electrical connections can be made by wire bonding from one direction.

摘要翻译： 塑料模制型半导体器件包括多个半导体芯片，连接到半导体芯片的金属线，连接到金属线的引线以及置于半导体芯片之间并被密封在树脂构件中的绝缘构件。 半导体芯片的电路形成表面指向相同的方向，并且一个或多个半导体芯片用作通过绝缘构件安装其它半导体芯片的基底。 引线的一端接合到绝缘构件，并且每个半导体芯片的电极焊盘不被其它半导体芯片，绝缘构件和引线覆盖，因此暴露于绝缘构件的表面。 在该装置中，省略了突片的设置，并且层压芯片可以被包含在比常规封装更薄的封装中。 由于所有芯片的电路形成表面指向相同的方向，所以所有的电连接都可以通过从一个方向引线接合而形成。

公开(公告)号：US5295045A

公开(公告)日：1994-03-15

申请号：US791551

申请日：1991-11-14

申请人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Maya Obata ,  Ryuji Kohno ,  Mitsuaki Haneda

发明人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Maya Obata ,  Ryuji Kohno ,  Mitsuaki Haneda

IPC分类号： H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K5/02

CPC分类号： H01L23/49575 ,  H01L23/4951 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041

摘要： A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.

摘要翻译： 具有高集成度的塑料模制型半导体器件将多个半导体芯片封装在封装单元中，每个芯片垂直于衬底设置用于安装。 在每个芯片容纳电路的表面上或其背面上，引线框架之间插入绝缘材料。 芯片和引线框架通过电线相互连接。 引线框架垂直布置成并联设置的另一引线框架，通过焊接与引线框架相连接。 可以使用印刷电路板代替所述后置引线框架。 通过将芯片布置在由树脂制成的突起中，半导体器件的热阻降低。 本发明对存储器IC特别有效。

公开(公告)号：US5159434A

公开(公告)日：1992-10-27

申请号：US649712

申请日：1991-02-01

申请人： Ryuji Kohno ,  Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Sueo Kawai

发明人： Ryuji Kohno ,  Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Sueo Kawai

IPC分类号： H01L21/60 ,  H01L23/495

CPC分类号： H01L24/49 ,  H01L23/49503 ,  H01L23/49531 ,  H01L2224/0401 ,  H01L2224/16 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107

摘要： An encapsulated semiconductor device has a chip, a chip pad having through holes and also conducting patterns corresponding to an electrode pad of the chip, and leads. An arbitrary external terminal arrangement is obtained by combining a wire bonding operation between the conduting pattern and lead. Wire bonding is advantageously performed between the leads and electrode pads of the semiconductor chip arranged at arbitrary positions. The degree of freedom in designing areas of the chips and also a printed circuit board is improved so that a high packaging density is achieved and furthermore the printed circuit board is made compact.

摘要翻译： 封装的半导体器件具有芯片，具有通孔的芯片焊盘以及与芯片的电极焊盘相对应的导电图案和引线。 通过组合凹凸图案和导线之间的引线键合操作来获得任意的外部端子布置。 有利地，在布置在任意位置的半导体芯片的引线和电极焊盘之间进行引线接合。 提高了芯片的设计自由度和印刷电路板的自由度，从而实现了高的封装密度，并且印刷电路板的结构紧凑。

公开(公告)号：US08822055B2

公开(公告)日：2014-09-02

申请号：US13805975

申请日：2011-02-23

申请人： Ryuji Kohno

发明人： Ryuji Kohno

IPC分类号： H01M4/00

CPC分类号： H01M2/263 ,  H01M2/024 ,  H01M2/06 ,  H01M2/305 ,  H01M10/0431

摘要： A secondary battery adapted to minimize deterioration attributable to temperature is provided. In the secondary battery, a cross-sectionally elliptic electricity-generating element group in which a positive electrode sheet including at one side in a longitudinal direction thereof a section not coated with an active material mixture, and a negative electrode sheet including at one side in a longitudinal direction thereof a section not coated with an active material mixture are wound via separators is accommodated in a battery container. When a planar region of the electricity-generating element group is seen in plan view, the number of connections between the non-coated section of the positive or negative electrode sheet and a connecting surface of a positive or negative electrode connecting sheet is two for each of positive and negative electrodes, and a distance between the two connections is greater than ¼ of innermost circumferential length of the electricity-generating element group, but is smaller than ¼ of outermost circumferential length of the electricity-generating element group.

摘要翻译： 提供了适于最小化温度降低的二次电池。 在二次电池中，横截面椭圆形的发电元件组，其中正极片在其长度方向的一侧包括未涂覆活性物质混合物的部分，负极片包括一侧的 其长度方向是未被活性物质混合物涂覆的部分通过隔板缠绕在电池容器中。 当在平面图中看到发电元件组的平面区域时，正极板或负极板的未涂覆部分与正极或负极连接片材的连接表面之间的连接数为每个 的正极和负极之间的距离，并且两个连接之间的距离大于发电元件组的最内圆周长度的1/4，但小于发电元件组的最外周长的1/4。

公开(公告)号：US20110151343A1

公开(公告)日：2011-06-23

申请号：US13038530

申请日：2011-03-02

申请人： Ryuji Kohno ,  Makoto Kitano ,  Miyuki Fukushi

发明人： Ryuji Kohno ,  Makoto Kitano ,  Miyuki Fukushi

IPC分类号： H01M8/06

CPC分类号： H01M8/04194 ,  H01M8/04201 ,  H01M8/1011 ,  Y02E60/523

摘要： A fuel cell system is provided which can constantly control a fuel concentration of a liquid fuel supplied to a fuel cell, such as a DMFC. A DMFC system comprises a high-concentration cartridge in which a methanol aqueous solution having a concentration higher than a target fuel concentration is sealed, a water cartridge in which water is sealed, a mixing tank for mixing the methanol aqueous solution from the high-concentration cartridge with the water from the water cartridge to prepare the methanol aqueous solution having the target fuel concentration, and the DMFC for generating electricity by being supplied with the methanol aqueous solution from the mixing tank and air.

摘要翻译： 提供一种燃料电池系统，其可以不断地控制供应到诸如DMFC的燃料电池的液体燃料的燃料浓度。 DMFC系统包括其中密封浓度高于目标燃料浓度的甲醇水溶液的高浓度墨盒，密封水的墨盒，用于将来自高浓度的甲醇水溶液混合的混合槽 将来自水筒的水排出，以制备具有目标燃料浓度的甲醇水溶液，以及通过从混合罐和空气供应甲醇水溶液来发电的DMFC。

公开(公告)号：US07862952B2

公开(公告)日：2011-01-04

申请号：US11176358

申请日：2005-07-08

申请人： Ryuji Kohno ,  Tatsuya Nagata ,  Makoto Kitano ,  Masahiro Seido ,  Kazuhiko Nakagawa

发明人： Ryuji Kohno ,  Tatsuya Nagata ,  Makoto Kitano ,  Masahiro Seido ,  Kazuhiko Nakagawa

IPC分类号： H01M8/10 ,  H01M4/64

CPC分类号： H01M8/242 ,  H01M8/0206 ,  H01M8/0247 ,  H01M8/0271 ,  H01M8/04208 ,  H01M8/1011 ,  H01M8/1097 ,  H01M8/241 ,  H01M8/2418 ,  H01M2250/30 ,  Y02B90/18 ,  Y02E60/523 ,  Y02P70/56

摘要： According to the present invention, there is provided a membrane electrode composite module including a membrane electrode composite formed by sandwiching both surfaces of an electrolyte membrane between gas diffusion electrodes, an anode current collecting plate having fuel flow holes through which fuel flows, and a cathode current collecting plate having oxygen flow holes through which oxygen flows, wherein both surfaces of the membrane electrode composite are sandwiched between the anode current collecting plate and the cathode current collecting plate, the membrane electrode composite module further including films made of a synthetic resin (a first film and a second film) which are a base of the anode current collecting plate and a base of the cathode current collecting plate.

摘要翻译： 根据本发明，提供了一种膜电极复合模块，其包括通过将电解质膜的两个表面夹在气体扩散电极之间而形成的膜电极复合体，具有燃料流动的燃料流通孔的阳极集电板和阴极 集电板，其具有通过氧气流动的氧气流通孔，其中膜电极复合体的两个表面夹在阳极集电板和阴极集电板之间，该膜电极复合模块还包括由合成树脂制成的膜 第一膜和第二膜），其是阳极集电板的基底和阴极集电板的基底。

公开(公告)号：US20100116247A1

公开(公告)日：2010-05-13

申请号：US12527063

申请日：2008-04-30

申请人： Mahito Shikama ,  Ryuji Kohno ,  Eisei Yamazaki ,  Hidekazu Hironobu

发明人： Mahito Shikama ,  Ryuji Kohno ,  Eisei Yamazaki ,  Hidekazu Hironobu

IPC分类号： F02D11/10 ,  F02M7/00

CPC分类号： F02D41/10 ,  F02D11/105 ,  F02D41/1498 ,  F02D2041/141 ,  F02D2250/21

摘要： A control system for an internal combustion engine for driving a vehicle, which controls an output torque of the engine, is provided. In this control system, a rapid change in a demand torque of the engine is detected, and a feedforward correction amount is generated during a correction period which is substantially equal to a resonance period of a powertrain of the vehicle, from a time when the rapid change in the demand torque is detected. An output torque control amount of the engine is corrected with the feedforward correction amount. A torque change amount integrated value is calculated by integrating an amount of change in the demand torque, and the feedforward correction amount is generated according to the torque change amount integrated value.

摘要翻译： 提供了一种用于驱动车辆的内燃机的控制系统，其控制发动机的输出转矩。 在该控制系统中，检测到发动机的需求扭矩的急剧变化，并且在从快速的时间起，基本上等于车辆的动力总成的共振周期的校正期间产生前馈修正量 检测到需求扭矩的变化。 用前馈修正量校正发动机的输出转矩控制量。 通过积分需求扭矩的变化量来计算转矩变化量积分值，并且根据转矩变化量积分值生成前馈校正量。

公开(公告)号：US20090323771A1

公开(公告)日：2009-12-31

申请号：US12084903

申请日：2006-11-13

申请人： Bin Zhen ,  Huan-Bang Li ,  Yihong Qi ,  Ryuji Kohno

发明人： Bin Zhen ,  Huan-Bang Li ,  Yihong Qi ,  Ryuji Kohno

IPC分类号： H04B1/707

CPC分类号： H04B1/71637 ,  H04B1/7174 ,  H04B1/7176

摘要： One communication apparatus 2 sequentially generates a pulse sequence having pulse signals arranged based on the UWB communication system, performs a framing process to form a frame having at least a preamble and a data portion on the generated pulse sequence and inserts a preamble segment comprised of a sequence of steady pulse signals in the data portion at a predetermined time interval, and transmits it as a radio wave, and another communication apparatus 2 receives a pulse sequence as a radio wave transmitted from the one communication apparatus 2, and detects at least the preamble segment from the frame contained in the received pulse sequence through a detection window structured to have a predetermined time length, whereby a transmission timing for the pulse sequence to the one communication apparatus 2 is controlled according to a state of detection of the preamble segment.

摘要翻译： 一个通信装置2顺序地产生具有基于UWB通信系统布置的脉冲信号的脉冲序列，执行成帧处理，以形成至少在生成的脉冲序列上的前同步码和数据部分的帧，并且插入由 以预定的时间间隔在数据部分中输出稳定脉冲信号的序列，并将其作为无线电波发送，另一个通信装置2接收作为从一个通信装置2发送的无线电波的脉冲序列，并至少检测前导码 通过被构造​​为具有预定时间长度的检测窗口从包含在接收脉冲序列中的帧中的帧分段，从而根据前导码段的检测状态来控制针对一个通信设备2的脉冲序列的发送定时。