Abstract:
The ionic strength of a diluent for preparing an analytical sample is set to be 0.06 to 0.16. The analytical sample prepared by using the diluent having the ionic strength within this range can be subjected to both for analyzing a first object in a test sample by electrode method and for analyzing a second object in the test sample by liquid chromatography method, and high-precision measurement can be attained. The analytical sample is especially useful for preparing a sample for measurement used both for measuring glucose concentration in a blood sample by enzyme electrode method and for measuring glycohemoglobin concentration in the blood sample by liquid chromatography method.
Abstract:
A measurement of plasma glucose is carried out through the following steps, a sample preparation step (S101, S102) of preparing a measurement sample by hemolyzing hemocytes in blood, a step of measuring whole blood glucose (S103 to S105) of measuring a glucose concentration in whole blood with the measurement sample, and a step of calculating a liquid content ratio of whole blood (S109) of calculating a liquid content ratio of whole blood from a hemocyte/plasma ratio in the blood hemocyte and predetermined ratios of liquid components of hemocytes and of liquid components of plasma.
Abstract:
A semiconductor device includes: a semiconductor substrate in which a trench is formed; a source region and a drain region each of which is buried in the trench and contains an impurity of the same conductive type; a semiconductor FIN buried in the trench and provided between the source and drain regions; a gate insulating film provided on a side surface of the semiconductor FIN as well as the upper surface of the semiconductor FIN; and a gate electrode formed on the gate insulating film.
Abstract:
A nonvolatile memory element comprises a first electrode layer (103), a second electrode (107), and a resistance variable layer (106) which is disposed between the first electrode layer (103) and the second electrode layer (107), a resistance value of the resistance variable layer varying reversibly according to electric signals having different polarities which are applied between the electrodes (103), (107), wherein the resistance variable layer (106) has a first region comprising a first oxygen-deficient tantalum oxide having a composition represented by TaOx (0
Abstract:
A liquid chromatography apparatus is provided with a sample preparation unit, a column that separates components of a sample, an eluent supplier that includes a feeder for supplying eluents to the column, a flow path directional valve capable of introducing fixed amounts of the sample and the eluents to the column, an analyzer for analyzing a test solution composed of the sample components separated by the column and one of the eluents, and a controller, wherein the eluent supplier supplies the eluents to the flow path directional valve in an unmixed state. As a result of employing this configuration, analysis time is shortened and eluent consumption is reduced.
Abstract:
A liquid chromatography device includes a column containing a filler, an injection valve capable of introducing a sample into the column and also capable of introducing a liquid mobile phase into the column, and a mobile phase feeder for feeding the liquid mobile phase from a mobile phase container containing the liquid mobile phase to the column via the injection valve. Between the mobile phase container and the injection valve is provided a storage chamber for temporarily storing the liquid mobile phase sent from the mobile phase container. The device further includes a liquid level detection sensor for detecting the liquid level of the liquid mobile phase in the storage chamber. This structure allows the liquid for use in analysis to be used completely without being wasted.
Abstract:
A semiconductor device includes: a semiconductor substrate in which a trench is formed; a source region and a drain region each of which is buried in the trench and contains an impurity of the same conductive type; a semiconductor FIN buried in the trench and provided between the source and drain regions; a gate insulating film provided on a side surface of the semiconductor FIN as well as the upper surface of the semiconductor FIN; and a gate electrode formed on the gate insulating film.
Abstract:
A method for manufacturing a nonvolatile storage element that minimizes shape shift between an upper electrode and a lower electrode, and which includes: depositing, in sequence, a connecting electrode layer which is conductive, a lower electrode layer and a variable resistance layer which are made of a non-noble metal nitride and are conductive, an upper electrode layer made of noble metal, and a mask layer; forming the mask layer into a predetermined shape; forming the upper electrode layer, the variable resistance layer, and the lower electrode layer into the predetermined shape by etching using the mask layer as a mask; and removing, simultaneously, the mask and a region of the connecting electrode layer that has been exposed by the etching.
Abstract:
A lower electrode (22) is provided on a semiconductor chip substrate (26). A lower electrode (22) is covered with a first interlayer insulating layer (27) from above. A first contact hole (28) is provided on the lower electrode (22) to penetrate through the first interlayer insulating layer (27). A low-resistance layer (29) forming the resistance variable layer (24) is embedded to fill the first contact hole (28). A high-resistance layer (30) is provided on the first interlayer insulating layer (27) and the low-resistance layer (29). The resistance variable layer (24) is formed by a multi-layer resistance layer including a single layer of the high-resistance layer (30) and a single layer of the low-resistance layer (29). The low-resistance layer (29) forming the memory portion (25) is isolated from at least its adjacent memory portion (25).
Abstract:
A nonvolatile semiconductor memory apparatus (10) of the present invention comprises a semiconductor substrate (11), an active element forming region provided on the semiconductor substrate (11) and including a plurality of active elements (12), a wire forming region which is provided on the active element forming region to electrically connect the active elements (12) and includes plural layers of semiconductor electrode wires (15, 16), a memory portion forming region (100) which is provided above the wire forming region and provided with memory portions (26) arranged in matrix, a resistance value of each of the memory portions changing according to electric pulses applied, and an oxygen barrier layer (17) which is provided between the memory portion forming region (100) and the wire forming region so as to extend continuously over at least an entire of the memory portion forming region (100).