公开(公告)号：US10073339B2

公开(公告)日：2018-09-11

申请号：US14565520

申请日：2014-12-10

Applicant: CANON KABUSHIKI KAISHA

Inventor： Kazuki Nakagawa ,  Yosuke Murakami ,  Mitsuru Hiura

IPC: G03F7/00 ,  B29C59/02

CPC classification number: G03F7/0002 ,  B29C59/02 ,  B29C59/022 ,  B29C2059/023

Abstract: The present invention provides an imprint apparatus which performs an imprint process of molding an imprint material on a substrate with a mold and forming a pattern on the substrate, the apparatus including a detector configured to detect a shearing force generated in at least one of the mold and the substrate in a case where a pattern of the mold and a region of the substrate are aligned with each other with the imprint material on the substrate and the mold being in contact with each other, and a controller configured to control the imprint process based on the detected shearing force.

公开(公告)号：US20180250937A1

公开(公告)日：2018-09-06

申请号：US15908458

申请日：2018-02-28

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masafumi Morisue ,  Shinji Kishikawa ,  Tamaki Sato

IPC: B41J2/16 ,  G03F7/00 ,  B29C59/02 ,  G03F7/038 ,  G03F7/039 ,  G03F7/16 ,  G03F7/20 ,  G03F7/32 ,  B30B15/02

CPC classification number: B41J2/1637 ,  B29C59/022 ,  B29C59/026 ,  B29K2009/00 ,  B29K2033/12 ,  B29K2707/00 ,  B29K2709/02 ,  B29L2031/767 ,  B30B15/02 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1631 ,  B41J2/1635 ,  B41J2/1645 ,  B41J2202/22 ,  G03F7/0002 ,  G03F7/038 ,  G03F7/039 ,  G03F7/16 ,  G03F7/168 ,  G03F7/20 ,  G03F7/32

Abstract: A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.

公开(公告)号：US20180237562A1

公开(公告)日：2018-08-23

申请号：US15950536

申请日：2018-04-11

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Hiroshi TOKUE ,  Seiji MORITA ,  Kei KOBAYASHI

IPC: C08F22/10 ,  G03F7/027 ,  G03F7/00 ,  C09D4/00 ,  C08F222/06 ,  C08F220/18 ,  C08F220/24

CPC classification number: C08F22/10 ,  C09D4/00 ,  G03F7/0002 ,  G03F7/027 ,  C08F222/06 ,  C08F220/18 ,  C08F220/24

Abstract: According to an embodiment, a photosensitive composition is provided. The photosensitive composition contains a photosensitive material. The photosensitive composition, when a whole amount of the composition is 100 pts. mass, a sum total of values each obtained by multiplying a SP value, which is a solubility parameter, by a mass percentage of a photopolymerizable monomer contained in the composition is any value within a range of 17 to 20 [(J/cm3)1/2].

公开(公告)号：US10011057B2

公开(公告)日：2018-07-03

申请号：US15224911

申请日：2016-08-01

Applicant: CANON KABUSHIKI KAISHA

Inventor： Hiroshi Sato

IPC: B29C43/58 ,  G03F7/00 ,  B29C43/02

CPC classification number: B29C43/58 ,  B29C43/021 ,  B29C59/02 ,  B29C2043/585 ,  B29C2043/5891 ,  G03F7/0002 ,  H01L21/027

Abstract: The present invention provides an imprint apparatus which forms a pattern of an imprint material on a substrate by using a mold, the apparatus comprising an image sensing unit configured to sense an image of the imprint material via the mold, and a control unit configured to, in a state in which the mold and the imprint material are in contact with each other, cause the image sensing unit to sense the image of the imprint material while scanning the image sensing unit and obtain information on forming of the pattern of the imprint material based on the image obtained by the image sensing unit.

公开(公告)号：US20180180999A1

公开(公告)日：2018-06-28

申请号：US15740285

申请日：2016-05-31

Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.

Inventor： Junpei KOBAYASHI ,  Taku KATO ,  Keisuke SHUTO ,  Masayoshi SUZUKI

IPC: G03F7/038 ,  G03F9/00 ,  C08F2/44 ,  C08F2/48 ,  C08L33/10 ,  C08L33/08 ,  C08L33/26

CPC classification number: G03F7/0388 ,  C08F2/44 ,  C08F2/48 ,  C08F220/26 ,  C08F2222/1026 ,  C08L33/08 ,  C08L33/10 ,  C08L33/26 ,  C08L2203/16 ,  C09D4/06 ,  G03F7/0002 ,  G03F7/027 ,  G03F9/7042 ,  C09D4/00 ,  C08F222/1006 ,  C08F265/06 ,  C08F2222/1013 ,  C08F220/54

Abstract: A novel imprint material including a component (A); a component (B); a component (C); and a component (D) below. (A): a compound of Formula (1) below, (B): a compound of Formula (2) below, (C): a compound of Formula (3) below, and (D): a photopolymerization initiator, wherein, each R1 is independently a hydrogen atom or a methyl group, R2 is a C1-5 hydrocarbon group that optionally has a hydroxy group as a substituent, m is 2 or 3, X is a divalent linking group having an ethylene oxide unit and/or a propylene oxide unit, R3 is a hydrogen atom or a C1-3 alkyl group, n is 1 or 2, and when n is 1, R4 is a C1-12 alkyl group that is optionally substituted with at least one substituent, and when n is 2, R4 is a C1-12 alkylene group that is optionally substituted with at least one substituent.

公开(公告)号：US10008683B2

公开(公告)日：2018-06-26

申请号：US15213029

申请日：2016-07-18

Applicant: The Regents of the University of California

Inventor： Byoung Hoon Lee ,  Alan J. Heeger

IPC: H01L51/00 ,  H01L51/05 ,  G03F7/00 ,  B05D1/18 ,  B05D1/00

CPC classification number: H01L51/0097 ,  B05D1/005 ,  B05D1/18 ,  G03F7/0002 ,  H01L51/0012 ,  H01L51/0036 ,  H01L51/0558 ,  Y02E10/549

Abstract: An organic device, including semiconducting polymers processed from a solution cast on one or more dielectric layers on a substrate; and electrical contacts to the semiconducting polymers, wherein the substrate and the one or more dielectric layers are flexible and the semiconducting polymers are aligned. The one or more dielectric layers can increase mobility of the semiconducting polymers and/or alignment of the semiconducting polymers with one or more of the nanogrooves in the dielectric layers.

公开(公告)号：US10005308B2

公开(公告)日：2018-06-26

申请号：US14669612

申请日：2015-03-26

Applicant: Micron Technology, Inc.

Inventor： Dan B. Millward ,  Gurtej S. Sandhu

IPC: B32B3/10 ,  B41N1/08 ,  B81C99/00 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/00 ,  B41N3/03 ,  B05D1/28

CPC classification number: B41N1/08 ,  B05D1/283 ,  B41N3/036 ,  B81C99/009 ,  B81C2201/0149 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017 ,  Y02C20/30 ,  Y10T428/24802

Abstract: Methods for fabricating stamps and systems for patterning a substrate, and devices resulting from those methods are provided.

公开(公告)号：US10005103B2

公开(公告)日：2018-06-26

申请号：US13808105

申请日：2011-07-06

Applicant: Eduard Arzt ,  Elmar Kroner ,  Peter William de Oliveira ,  Ebru Devrim Sam ,  Florian Buesch ,  Dieter Urban ,  Reinhold Schwalm ,  Benedikt Blaesi ,  Michael Nitsche ,  Hannes Spiecker ,  Claas Mueller

Inventor： Eduard Arzt ,  Elmar Kroner ,  Peter William de Oliveira ,  Ebru Devrim Sam ,  Florian Buesch ,  Dieter Urban ,  Reinhold Schwalm ,  Benedikt Blaesi ,  Michael Nitsche ,  Hannes Spiecker ,  Claas Mueller

IPC: B05D3/12 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/00 ,  C09J7/00

CPC classification number: B05D3/12 ,  B82Y10/00 ,  B82Y40/00 ,  C09J7/00 ,  C09J2201/626 ,  G03F7/0002 ,  G03F7/0035 ,  Y10T428/24479

Abstract: A method for producing finely structured surfaces, in particular in plastics, includes a) applying at least one coating compound on at least one substrate; b) forming a fine structure by a die, which has the negative of a fine structure, c) curing the resultant finely structured coating compound, obtaining a substantially cured coating; and d) separating the finely structured coating from the die, wherein steps d) and c) can also be carried out in the reverse order.

公开(公告)号：US20180174827A1

公开(公告)日：2018-06-21

申请号：US15387409

申请日：2016-12-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Byung-Jin CHOI

IPC: H01L21/027 ,  H01L21/3213 ,  G03F7/00

CPC classification number: H01L21/0273 ,  B29C33/00 ,  B29C59/00 ,  G03F7/0002

Abstract: A template for imprint lithography can include a body. The body can include a base surface and have a recession extending from the base surface lying along a base plane, the recession including a main portion having a tapered sidewall. In a particular embodiment, the recession includes an intermediate portion having an intermediate sidewall. The intermediate sidewall is rounded or at least part of the intermediate sidewall lies at a different angle as compared to an average tapered angle of the main portion. In another aspect, a method of fabricating a semiconductor device can include forming a patterned resist layer having a tapered sidewall over a substrate having device layers; patterning the device layers using the patterned resist layer; and etching portions of at least some of device layers to expose lateral portions of the at least some device layers. The template is well suited for forming 3D memory arrays.

公开(公告)号：US20180173119A1

公开(公告)日：2018-06-21

申请号：US15385189

申请日：2016-12-20

Applicant: Canon Kabushiki Kaisha

Inventor： Mario Johannes Meissl ,  Anshuman Cherala ,  Byung-Jin Choi

IPC: G03F9/00 ,  G03F7/00

CPC classification number: G03F9/7042 ,  G03F7/0002

Abstract: Methods, systems, and apparatus for of adjusting a shape of an imprint lithography template, including identifying a shape of an active area positioned on a first side of the template, the active area including patterning features; determining a correspondence between a shape of an adaptive chuck and the shape of the active area positioned on the first side of the template, the adaptive chuck coupled to a second side of the template, the second side opposite the first side of the template; and adjusting, by an actuation system coupled to the adaptive chuck, the shape of the adaptive chuck based on the correspondence to obtain a target shape of the active area positioned on the first side of the template.