公开(公告)号：US08033836B1

公开(公告)日：2011-10-11

申请号：US12874900

申请日：2010-09-02

Applicant: Jayesh R. Bhakta ,  Enchao Yu ,  Chi She Chen ,  Richard E. Flaig

Inventor： Jayesh R. Bhakta ,  Enchao Yu ,  Chi She Chen ,  Richard E. Flaig

IPC: H01R12/00

CPC classification number: H05K1/147 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/4691 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2203/1572 ,  H01L2224/0401

Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.

Abstract translation: 电路包括构造成与多个电子设备电连通的第一多个触点。 电路卡还包括柔性部分，该柔性部分包括电介质层，第二多个触点以及跨越柔性部分的区域延伸并且与第一多个触点的一个或多个触点电连通并且与 第二个多个联系人。 柔性部分还包括延伸穿过柔性部分的区域的导电层。 导电层与多个电导管重叠，其间具有介电层。 在柔性部分的区域中，导电层不覆盖电介质层的一个或多个部分。

公开(公告)号：USRE42785E1

公开(公告)日：2011-10-04

申请号：US12790380

申请日：2010-05-28

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H02H9/00

CPC classification number: H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0246 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.

Abstract translation: 提供一种半导体模块，其包括节拍散热器，与散热器热耦合的至少两个半导体以及电连接到半导体的多个导电引线。 至少一个导电引线对于两个半导体是共同的。半导体模块还包括电耦合到至少一个半导体的终端电阻器。 还教导了制造半导体模块的方法，由此提供多个导电引线。 至少两个半导体电耦合到多个导电引线，其中至少一个导电引线对于两个半导体都是共同的。 然后将半导体热耦合到散热器。 随后，终端电阻器电耦合到至少一个半导体。

公开(公告)号：US20110110047A1

公开(公告)日：2011-05-12

申请号：US12939915

申请日：2010-11-04

Applicant: Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

Inventor： Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.

Abstract translation: 模块可电连接到计算机系统。 模块包括耦合到第一表面的第一表面和第一多个电路封装。 该模块还包括耦合到第二表面的第二表面和第二多个电路封装。 第二表面面向第一表面。 模块还包括位于第一表面和第二表面之间的至少一个热导管。 所述至少一个热导管与所述第一多个电路封装件和所述第二多个电路封装体热连通。

公开(公告)号：US07932596B2

公开(公告)日：2011-04-26

申请号：US12277109

申请日：2008-11-24

Applicant: Debendra Mallik ,  Robert L. Sankman

Inventor： Debendra Mallik ,  Robert L. Sankman

IPC: H01L23/36

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/49816 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H05K1/182 ,  H05K2201/09054 ,  H05K2201/1056 ,  H05K2201/10734 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method and apparatus for making a package having improved heat conduction characteristics and high frequency response. A relatively thick package substrate, such as copper, has a wiring layer bonded to one face, leaving the opposite face exposed, for example, to be a surface for connection to a heat sink. One or more chips are bonded to the wiring layer, and an array of connectors, such as solder balls are provided around the periphery of the chip(s) for connection to a printed circuit board. In some embodiments, the printed circuit board has a hole that the chip(s) extend into to allow smaller external-connection solder balls. In some embodiments, a second heat sink is connected to the back of the chip through the PCB hole.

Abstract translation: 一种用于制造具有改善的热传导特性和高频响应的封装的方法和装置。 诸如铜的相对厚的封装衬底具有结合到一个面的布线层，使相对的面露出，例如是用于连接到散热器的表面。 将一个或多个芯片接合到布线层，并且在芯片的周边周围设置连接器阵列（例如焊球），以连接到印刷电路板。 在一些实施例中，印刷电路板具有一个孔，芯片延伸进入以允许更小的外部连接焊球。 在一些实施例中，第二散热器通过PCB孔连接到芯片的背面。

公开(公告)号：US07796399B2

公开(公告)日：2010-09-14

申请号：US12317892

申请日：2008-12-30

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/18 ,  H05K7/20 ,  H01R12/24 ,  H01R43/02 ,  H04L12/50 ,  H01L23/34

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 导电图案包括与衬底的一个边缘相邻的一系列电接触。 衬底被粘合到两个刚性框架上，每个相对表面上一个。 每个衬底在一个边缘上具有一系列在优选通过焊接的衬底上对准并电连接到衬底上的相应接触件的蓖耳。 当模块与低轮廓的针阵列接触时，这些哨座可以用作自对准机构，并且模块可以通过插座中的导轨固定在主板上的位置，该插座与垂直于雉鸡的边缘接合 模块的边缘。 模块还可以设置有保护性散热罩。

公开(公告)号：US07768796B2

公开(公告)日：2010-08-03

申请号：US12147218

申请日：2008-06-26

Applicant: James W. Cady ,  Paul Goodwin

Inventor： James W. Cady ,  Paul Goodwin

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H05K1/189 ,  G11C5/04 ,  H01L23/5387 ,  H01L25/0652 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

Abstract translation: 柔性电路用多个集成电路管芯填充在一侧或两侧。 在优选的模式中，柔性电路装有倒装芯片。 柔性电路的一侧具有在具有边缘连接器触点的优选模式中实现的连接设备。 柔性电路围绕基板设置以形成电路模块，该电路模块可以插入诸如通常在计算机板上找到的边缘连接器。

公开(公告)号：US07724530B2

公开(公告)日：2010-05-25

申请号：US12317890

申请日：2008-12-30

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00 ,  H05K7/20

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。

公开(公告)号：US20100110642A1

公开(公告)日：2010-05-06

申请号：US12606136

申请日：2009-10-26

Applicant: Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

Inventor： Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

IPC: H05K7/20 ,  F28F13/00 ,  H01L23/34

CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.

Abstract translation: 模块可电连接到计算机系统。 模块包括可电连接到计算机系统的多个电触点。 模块还包括耦合到第一表面的第一表面和第一多个电路。 第一组多个电路与电触点电连通。 模块还包括耦合到第二表面的第二表面和第二多个电路。 第二组电路与电触点电连通。 第二表面面向第一表面。 模块还包括位于第一表面和第二表面之间的至少一个导热层。 所述至少一个导热层与所述第一多个电路，所述第二多个电路和所述多个电触头的第一组热连通。

公开(公告)号：US07679914B2

公开(公告)日：2010-03-16

申请号：US11902379

申请日：2007-09-21

Applicant: Atsushi Kashiwazaki

Inventor： Atsushi Kashiwazaki

IPC: H05K7/20 ,  H01L23/34

CPC classification number: H05K1/181 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/09745 ,  H05K2201/1034 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10924 ,  H05K2203/049 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic controller having a circuit board with an element disposed thereon, a base member with the circuit board adhered thereon and a lead terminal in an electrical connection with the circuit board includes as the elements thick film resistors and electric components soldered by solder on a bottom side of the circuit board, and also includes electronic components including bare chips being at least wired without soldering on a top surface of the circuit board. The electronic controller has a first concave portion at a position corresponding to a position of the components on a surface that has the circuit board of the base member adhered thereon, and the circuit board is molded by a sealing resin so as to expose a portion of the base member and a portion of the lead terminal.

Abstract translation: 一种电子控制器，具有设置在其上的元件的电路板，其上附着有电路板的基座构件和与电路板电连接的引线端子包括作为元件的厚膜电阻器和焊接在底部的焊料的电气部件 并且还包括电子部件，包括至少布线的裸芯片，而不在电路板的顶表面上焊接。 该电子控制器在对应于在其上附着有基底部件的电路板的表面上的部件的位置处的位置处具有第一凹部，并且电路板由密封树脂模制以暴露部分 基座部件和引线端子的一部分。

公开(公告)号：US07652358B2

公开(公告)日：2010-01-26

申请号：US12136117

申请日：2008-06-10

Applicant: Atsushi Minakawa ,  Mamoru Sekiya ,  Norio Umezu

Inventor： Atsushi Minakawa ,  Mamoru Sekiya ,  Norio Umezu

IPC: H01L23/495

CPC classification number: H01L23/4006 ,  H01L25/112 ,  H01L2023/4056 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/14 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.

Abstract translation: 根据本发明的优选实施例的半导体器件是包括主衬底和一个或多个子衬底的半导体器件，并且半导体器件包括安装在子衬底上的第一发热器件，安装到第一衬底的子衬底散热器 发热装置和安装在主基板上的主衬底散热片，其中，辅助基板散热器和主衬底散热片彼此固定，使得在辅助衬底和主衬底之间存在预定的位置关系 。