公开(公告)号：US20070199926A1

公开(公告)日：2007-08-30

申请号：US11709728

申请日：2007-02-23

Applicant: Hirofumi Watanabe ,  Daisuke Yasukawa ,  Masaaki Suzuku

Inventor： Hirofumi Watanabe ,  Daisuke Yasukawa ,  Masaaki Suzuku

IPC: B23K26/22

CPC classification number: H05K3/328 ,  B23K26/244 ,  B23K2101/42 ,  H01R43/0221 ,  H05K3/202 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/1084 ,  H05K2203/107

Abstract: The invention stabilizes a quality of a laser welding in a terminal in which an outer appearance characteristic is not stabilized, and achieves an improvement of a positioning characteristic at a time of executing the laser welding without generating a cost increase. A hole is formed in a terminal of an integrated circuit sealed by a plastic molding. At a time of welding, a welding operation position is positioned by recognizing the hole in accordance with an image recognition, and a laser welding is executed by irradiating a laser beam to a portion of a terminal and a bus bar positioned near an edge portion of the hole. The hole is preferably formed in a circular shape or a similar shape thereto.

Abstract translation: 本发明稳定了外观特性不稳定的端子中的激光焊接的质量，并且在执行激光焊接时实现了定位特性的提高，而不会导致成本增加。 在由塑料模制件密封的集成电路的端子中形成孔。 在焊接时，通过根据图像识别来识别孔来定位焊接操作位置，并且通过将激光束照射到位于端子的边缘部分附近的端子和母线的一部分来执行激光焊接 那个洞。 该孔优选形成为圆形或类似形状。

公开(公告)号：US07005311B2

公开(公告)日：2006-02-28

申请号：US10723928

申请日：2003-11-26

Applicant: Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

Inventor： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC: H01L21/00

CPC classification number: H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

公开(公告)号：US20040188502A1

公开(公告)日：2004-09-30

申请号：US10803884

申请日：2004-03-19

Applicant: SANYO ELECTRIC CO., LTD. ,  SANYO TUNER INDUSTRIES CO., LTD.

Inventor： Takayuki Mori ,  Shuichi Komamizu ,  Kazumi Makino

IPC: B23K031/00

CPC classification number: H05K3/3484 ,  B41N1/248 ,  H05K3/1225 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3463 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10818 ,  H05K2203/0545

Abstract: A lead-free solder paste printing method is practiced with use of a metal mask of the invention by placing the metal mask 1 on a circuit board 2 having an electrode 21 formed in a predetermined pattern to join an end portion of a lead member 6, and moving a printing squeegee along the upper surface of the metal mask 1 to thereby print a lead-free solder paste on the surface of the electrode 21 on the circuit board 2. The method produces on the electrode 21 of the circuit board 2 two lead-free solder paste patterns 30a, 30a each circular or elliptical in shape and arranged in a direction in which the lead member 6 is to extend from the electrode.

Abstract translation: 使用本发明的金属掩模，通过将金属掩模1放置在具有以预定图案形成的电极21的电路板2上以连接引线构件6的端部来实现无铅焊膏印刷方法， 并且沿着金属掩模1的上表面移动印刷刮板，从而在电路板2上的电极21的表面上印刷无铅焊膏。该方法在电路板2的电极21上产生两个引线 - 各种圆形或椭圆形形状的焊膏图形30a，30a，其沿引线部件6从电极延伸的方向排列。

公开(公告)号：US06739044B2

公开(公告)日：2004-05-25

申请号：US10197395

申请日：2002-07-16

Applicant: John W. Abouchar

Inventor： John W. Abouchar

IPC: H05K330

CPC classification number: C23C2/08 ,  B23K1/08 ,  B23K3/0646 ,  B23K35/224 ,  B23K35/262 ,  B23K2101/38 ,  B23K2103/14 ,  C23C2/02 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10818 ,  H05K2201/1084 ,  H05K2201/2081 ,  Y10T29/49139

Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

公开(公告)号：US6395982B2

公开(公告)日：2002-05-28

申请号：US20934598

申请日：1998-12-11

Applicant: NELSON WILLIAM JOHN ,  TSENG ALICE ,  LEE K. R. ,  LAI STANLEY

Inventor： NELSON WILLIAM JOHN ,  TSENG ALICE ,  LEE K R ,  LAI STANLEY

IPC: H01L23/48 ,  H01L21/48 ,  H01L23/495 ,  H05K3/30 ,  H01L23/02

CPC classification number: H05K3/308 ,  H01L21/4842 ,  H01L23/49555 ,  H01L2924/0002 ,  H05K2201/10818 ,  H01L2924/00

Abstract: A leaded semiconductor device package for nonsoldering assembling is disclosed. In the package of the invention, both leads of a semiconductor device package are flattened, cut and bent by automatic machines on the bais of conventional packaging process. Unlike a conventional semiconductor device package which is electrically connected to a circuit by soldering, the flattened and bent parts of both leads of the semiconductor device package can be electrically connected to a circuit by elastically contacting and directly assembling without soldering.

Abstract translation: 公开了一种用于非焊接组装的引线半导体器件封装。 在本发明的封装中，半导体器件封装的两个引线通过常规封装工艺的自动机械被平坦化，切割和弯曲。 与通过焊接电连接到电路的常规半导体器件封装不同，半导体器件封装的两个引线的扁平和弯曲部分可以通过弹性接触并直接组装而不被焊接而电连接到电路。

公开(公告)号：US06259022B1

公开(公告)日：2001-07-10

申请号：US09174755

申请日：1998-10-19

Applicant: Francis Steffen

Inventor： Francis Steffen

IPC: H01L23043

CPC classification number: H05K3/3436 ,  G06K19/07745 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01094 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10818 ,  H05K2201/2081 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A micromodule is used as a surface-mounted package on a substrate of interconnections. In one embodiment of the invention, barriers to the expansion of solder are formed between contact zones of the micromodule and corresponding contact pads of the substrate. A mechanical stopping device is planned to keep the thickness of the interface of solder. In another embodiment of the invention, contact zones are extended by tongues. A cambering operation enables the formation of the surface-mounting pins.

Abstract translation: 微型组件用作互连衬底上的表面安装封装。 在本发明的一个实施例中，在微型组件的接触区域和衬底的相应接触焊盘之间形成焊料膨胀的障碍。 计划一种机械停止装置来保持焊料界面的厚度。 在本发明的另一个实施例中，接触区域用舌头延伸。 弯曲操作使得能够形成表面安装销。

公开(公告)号：US5917706A

公开(公告)日：1999-06-29

申请号：US655197

申请日：1996-05-28

Applicant: Francis Steffen

Inventor： Francis Steffen

IPC: H05K1/18 ,  G06K19/077 ,  H01L23/24 ,  H01L23/31 ,  H01L23/498 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K3/3436 ,  G06K19/07745 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49855 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01094 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10818 ,  H05K2201/2081 ,  H05K3/3426 ,  Y02P70/613

Abstract: A micromodule is used as a surface-mounted package on a substrate of interconnections. In one embodiment of the invention, barriers to the expansion of solder are formed between contact zones of the micromodule and corresponding contact pads of the substrate. A mechanical stopping device is planned to keep the thickness of the interface of solder. In another embodiment of the invention, contact zones are extended by tongues. A cambering operation enables the formation of the surface-mounting pins.

Abstract translation: 微型组件用作互连衬底上的表面安装封装。 在本发明的一个实施例中，在微型组件的接触区域和衬底的相应接触焊盘之间形成焊料膨胀的障碍。 计划一种机械停止装置来保持焊料界面的厚度。 在本发明的另一个实施例中，接触区域用舌头延伸。 弯曲操作使得能够形成表面安装销。

公开(公告)号：US5516297A

公开(公告)日：1996-05-14

申请号：US314915

申请日：1994-09-28

Applicant: Koyoshi Atoh ,  Etsuro Doi ,  Shoichi Mochizuki ,  Mazakazu Koiso

Inventor： Koyoshi Atoh ,  Etsuro Doi ,  Shoichi Mochizuki ,  Mazakazu Koiso

IPC: H01R12/55 ,  H01R43/02 ,  H05K3/34 ,  H01R9/09

CPC classification number: H05K3/3426 ,  H01R12/712 ,  H01R43/0256 ,  H01R12/57 ,  H05K2201/09709 ,  H05K2201/10818 ,  Y02P70/613

Abstract: A surface mount electrical connector having lead portions of first and second series of terminals extending in alternating closely spaced parallel relation across a circuit board from a rear face of a connector housing. The lead portions have transverse soldering portions on respective free ends and the lead porions of the second series are longer than those of the first series and the lead portion of each series are of equal length so that the soldering portions of the first and second series are located in first and second rows with the first row being closer to the housing than the second row. The soldering potions of the first row have respective upstanding heater engaging portions so that the heater can be brought into engagement therewith without interfering with adjacent lead portions or with soldering portions of the other row.

Abstract translation: 表面安装电连接器，其具有从连接器壳体的后表面跨越电路板以交替紧密间隔的平行关系延伸的第一和第二串联端子的引线部分。 引线部分在相应的自由端上具有横向焊接部分，并且第二系列的引线部分比第一系列的引线部分长，并且每个串联的引线部分具有相等的长度，使得第一和第二系列的焊接部分 位于第一排和第二排中，第一排比第二排更靠近壳体。 第一排的焊接部分具有各自直立的加热器接合部分，使得加热器可以与其接合而不与相邻的引线部分或另一排的焊接部分相干扰。

公开(公告)号：US5351393A

公开(公告)日：1994-10-04

申请号：US913880

申请日：1992-07-15

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01L23/495 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H05K1/141 ,  H01L2924/0002 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49135 ,  Y10T29/4914

Abstract: A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.

Abstract translation: 具有布置的引脚格栅阵列的表面贴装集成电路转换器板组件能够安装常规的表面安装引线装置以便随后附接到印刷电路板。 转换器板组件包括排列成行和列的用于安装的间隔开的销的阵列，以及与之连接的多个间隔开的销垫。 引脚垫足够间隔开以避免干扰。 一组表面安装引线焊盘是转换器板的一部分，并通过多个引线与引脚阵列互连。 制造具有表面贴装集成电路器件的转换器板的方法包括将器件的引线形成或重整以与表面安装焊盘对准。

公开(公告)号：US4955820A

公开(公告)日：1990-09-11

申请号：US447350

申请日：1989-12-07

Applicant: Shoji Yamada ,  Tomoo Yamada

Inventor： Shoji Yamada ,  Tomoo Yamada

IPC: H01R33/76 ,  H01R4/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01R12/57 ,  H01R4/02 ,  H05K3/3426 ,  H01R12/737 ,  H05K2201/10818 ,  Y02P70/613

Abstract: Disclosed is a surface-mounted component's contact having an inverted "T"-shaped soldering portion. The contact is to be mounted to the surface of a printed circuit board, and is to be electrically connected to a conductor on the printed circuit board by soldering its soldering portion to the conductor. The soldering portion comprises a flat foot and a leg, which is integrally connected to and rising from the midportion of said foot. The relatively large foot has an effect of causing substantial reduction of the load per unit of solder upon application of an undesired force to the terminal, and of increasing the resistivity of the solder against removal from the conductor of the printed circuit board.

Abstract translation: 公开了具有倒置的“T”形焊接部分的表面安装部件的触头。 接触件将被安装到印刷电路板的表面，并且通过将其焊接部分焊接到导体而与印刷电路板上的导体电连接。 焊接部分包括平脚和脚，其一体地连接到所述脚的中部并从其起升。 相对较大的脚具有在对端子施加不期望的力时使单位焊料的负荷显着降低的效果，并且增加焊料的电阻率以防止从印刷电路板的导体移除。