公开(公告)号：US09324495B2

公开(公告)日：2016-04-26

申请号：US14044112

申请日：2013-10-02

Applicant: International Business Machines Corporation

Inventor： Robert E. Fontana, Jr. ,  William J. Gallagher ,  Philipp Herget ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang ,  Bucknell C. Webb

IPC: H01F27/24 ,  H01F41/04 ,  H01F3/10 ,  H01F17/06 ,  H01F41/14

CPC classification number: H01F41/04 ,  H01F3/10 ,  H01F17/06 ,  H01F41/14

Abstract: A planar closed-magnetic-loop inductor and a method of fabricating the inductor are described. The inductor includes a first material comprising a cross-sectional shape including at least four segments, at least one of the at least four segments including a first edge and a second edge on opposite sides of an axial line through the at least one of the at least four segments. The first edge and the second edge are not parallel.

Abstract translation: 描述了一种平面闭环磁环电感器和一种制造电感器的方法。 电感器包括第一材料，其包括包括至少四个段的横截面形状，所述至少四个段中的至少一个段包括通过所述至少一个的轴线的相对侧上的第一边缘和第二边缘 至少四个细分。 第一边缘和第二边缘不平行。

公开(公告)号：US09257137B2

公开(公告)日：2016-02-09

申请号：US14151494

申请日：2014-01-09

Applicant: International Business Machines Corporation

Inventor： Robert G. Biskeborn ,  Philipp Herget ,  Bucknell C. Webb

IPC: G11B5/23 ,  G11B5/265

CPC classification number: G11B5/3116 ,  G11B5/17 ,  G11B5/23 ,  G11B5/265 ,  G11B5/2652 ,  G11B5/59638

Abstract: A magnetic device according to one embodiment includes a source of flux; a magnetic pole having two or more gaps; and a low reluctance path positioned towards at least one of the gaps and riot positioned towards at least one other of the gaps for affecting a magnetic field formed at the at least one of the gaps when the source of flux is generating flux. Other disclosed embodiments include devices having coil turns with a non-uniform placement in the magnetic yoke for altering a magnetic field formed at the at least one of the gaps during writing. In further embodiments, a geometry of the magnetic pole near or at one of the gaps is different than a geometry of the magnetic pole near or at another of the gaps to help equalize fields formed at the gaps when the source of flux is generating flux.

Abstract translation: 根据一个实施例的磁性装置包括通量源; 具有两个或更多间隙的磁极; 以及朝向所述间隙中的至少一个定位的低磁阻路径，并且朝向所述间隙中的至少另一个定位的暴动，用于当所述通量源产生通量时，影响在所述至少一个所述间隙处形成的磁场。 其他公开的实施例包括具有在磁轭中具有不均匀布置的线圈匝的装置，用于在写入期间改变在至少一个间隙处形成的磁场。 在另外的实施例中，靠近或在其中一个间隙处的磁极的几何形状不同于磁极在靠近或另一个间隙处的几何形状，以帮助当磁通源产生磁通时在间隙处形成的场均衡。

公开(公告)号：US20150287960A1

公开(公告)日：2015-10-08

申请号：US14340253

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Joana Sofia Branquinho Teresa Maria ,  Bing Dang ,  Michael A. Gaynes ,  John U. Knickerbocker ,  Eric P. Lewandowski ,  Cornelia K. Tsang ,  Bucknell C. Webb

IPC: H01M2/02 ,  A61B5/145 ,  A61F9/00 ,  G02C7/08

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A system comprising a first dielectric element and a second dielectric element each having a first surface, wherein the first surface of the first dielectric element and the first surface of the second dielectric element are joined. The system further comprises one or more enclosed voids within the joined first and second dielectric elements. The system further comprises a flexible battery in a first enclosed void of the one or more enclosed voids, the flexible battery having a thickness of less than about 150 microns.

Abstract translation: 一种包括第一介电元件和第二介电元件的系统，每个第一介质元件和第二介质元件均具有第一表面，其中第一介电元件的第一表面和第二介电元件的第一表面被接合。 该系统还包括在所接合的第一和第二介电元件内的一个或多个封闭的空隙。 该系统还包括在一个或多个封闭空隙的第一封闭空间中的柔性电池，柔性电池具有小于约150微米的厚度。

公开(公告)号：US20150255529A1

公开(公告)日：2015-09-10

申请号：US14200503

申请日：2014-03-07

Applicant: International Business Machines Corporation

Inventor： Naigang Wang ,  Bucknell C. Webb

IPC: H01L49/02 ,  H01L23/522 ,  H01L21/768

CPC classification number: H01L28/10 ,  H01L21/31 ,  H01L21/31111 ,  H01L21/3205 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5226 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A mechanism is provided for integrating an inductor into a semiconductor. A circular or other closed loop trench is formed in a substrate with sidewalls connected by a bottom surface in the substrate. A first insulator layer is deposited on the sidewalls of the trench so as to coat the sidewalls and the bottom surface. A conductor layer is deposited on the sidewalls and the bottom surface of the trench so as to coat the first insulator layer in the trench such that the conductor layer is on top of the first insulator layer in the trench. A first magnetic layer is deposited on the sidewalls and bottom surface of the trench so as to coat the first insulator layer in the trench without filling the trench. The first magnetic layer deposited on the sidewalls forms an inner closed magnetic loop and an outer closed magnetic loop within the trench.

公开(公告)号：US20150229295A1

公开(公告)日：2015-08-13

申请号：US14178791

申请日：2014-02-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC: H03K3/012 ,  H02M3/156 ,  H02M1/08

CPC classification number: H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

Abstract translation: 公开了一种集成电路中的开关电源，包括开关电源的集成电路和集成电路中的开关电源的组装方法。 在一个实施例中，本发明提供了一种包括器件层的集成电路中的三维开关电源。 开关电源包括与器件层串联布置的三个不同的层，三个不同的层包括包括开关电路的开关层，包括电容器组的电容器层和包括电感器的电感器层。 该开关电源还包括将器件层，开关层，电容层和电感层电连接和机械连接在一起的大量连接器。 开关电路，电容器和电感器形成用于向器件层供电的开关电源。

公开(公告)号：US20150064362A1

公开(公告)日：2015-03-05

申请号：US14044112

申请日：2013-10-02

Applicant: International Business Machines Corporation

Inventor： Robert E. Fontana, JR. ,  William J. Gallagher ,  Philipp Herget ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang ,  Bucknell C. Webb

IPC: H01F41/04

CPC classification number: H01F41/04 ,  H01F3/10 ,  H01F17/06 ,  H01F41/14

Abstract: A planar closed-magnetic-loop inductor and a method of fabricating the inductor are described. The inductor includes a first material comprising a cross-sectional shape including at least four segments, at least one of the at least four segments including a first edge and a second edge on opposite sides of an axial line through the at least one of the at least four segments. The first edge and the second edge are not parallel.

公开(公告)号：US08670210B2

公开(公告)日：2014-03-11

申请号：US13734838

申请日：2013-01-04

Applicant: International Business Machines Corporation

Inventor： Robert G. Biskeborn ,  Philipp Herget ,  Bucknell C. Webb

IPC: G11B5/265

CPC classification number: G11B5/3116 ,  G11B5/17 ,  G11B5/23 ,  G11B5/265 ,  G11B5/2652 ,  G11B5/59638

Abstract: A magnetic device according to one embodiment includes a source of flux; a magnetic pole coupled to the source of flux, the magnetic pole having two or more gaps; and a low reluctance path positioned towards at least one of the gaps and not positioned towards at least one other of the gaps for affecting a magnetic field formed at the at least one of the gaps when the source of flux is generating flux. Other disclosed embodiments include devices having coil turns with a non-uniform placement in the magnetic yoke for altering a magnetic field formed at the at least one of the gaps during writing. In further embodiments, a geometry of the magnetic pole near or at one of the gaps is different than a geometry of the magnetic pole near or at another of the gaps to help equalize fields formed at the gaps when the source of flux is generating flux.

Abstract translation: 根据一个实施例的磁性装置包括通量源; 耦合到磁通源的磁极，所述磁极具有两个或更多个间隙; 以及朝向所述间隙中的至少一个定位的低磁阻路径，并且朝向所述间隙中的至少另一个定位，以在所述通量源产生磁通时影响形成在所述至少一个间隙处的磁场。 其他公开的实施例包括具有在磁轭中具有不均匀布置的线圈匝的装置，用于在写入期间改变在至少一个间隙处形成的磁场。 在另外的实施例中，靠近或在其中一个间隙处的磁极的几何形状不同于磁极附近或在另一个间隙处的几何形状，以帮助当磁通源产生磁通时在间隙处形成的场均衡。

公开(公告)号：US20140026431A1

公开(公告)日：2014-01-30

申请号：US14043137

申请日：2013-10-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jae-Woong Nah ,  Katsuyuki Sakuma ,  Bucknell C. Webb

IPC: H01L21/50

CPC classification number: H01L21/50 ,  H01L21/561 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2224/32145 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/81 ,  H01L2924/014

Abstract: A template having tapered openings can be employed to enable injection of underfill material through gaps having a width less than a lateral dimension of an injector needle for the underfill material. Each tapered opening has a first lateral dimension on an upper side and a second lateral dimension on a lower side. Compliant material portions can be employed to accommodate variations in distance between the template and stacked semiconductor chips and/or an injector head. Optionally, another head can be employed to apply compressed gas to push out the underfill material after the underfill material is applied to the gaps. Multiple injector heads can be employed to simultaneously inject the underfill material at different sites. An adhesive layer can be substituted for the at least one lower compliant material portion.