公开(公告)号：US20180101016A1

公开(公告)日：2018-04-12

申请号：US15693531

申请日：2017-09-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Roland Enzmann ,  Hubert Halbritter ,  Markus Arzberger ,  Andreas Ploessl ,  Roland Schulz ,  Georg Rossbach ,  Bernd Boehm ,  Frank Singer ,  Matthias Sabathil

IPC: G02B27/09 ,  G02B5/18 ,  G02B3/00

CPC classification number: G02B27/0916 ,  G02B3/0025 ,  G02B3/0068 ,  G02B3/0075 ,  G02B5/1814 ,  G02B5/1823 ,  G02B5/1857 ,  G02B5/1866 ,  G02B27/0944 ,  G02B27/0961 ,  G02B27/4272

Abstract: An optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure. A method of producing an optically effective element includes providing a carrier, forming a first optically effective structure on a top side of the carrier, and arranging a cover above the top side of the carrier and the first optically effective structure.

公开(公告)号：US09911719B2

公开(公告)日：2018-03-06

申请号：US15310428

申请日：2015-03-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Juergen Moosburger ,  Georg Bogner ,  Herbert Brunner ,  Matthias Sabathil ,  Norwin Von Malm

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L24/25 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/82 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a molded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the molded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.

公开(公告)号：US09887336B2

公开(公告)日：2018-02-06

申请号：US15525759

申请日：2015-10-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes a carrier having a carrier top side and an opposing carrier underside, wherein the carrier top sides each have a larger area than the associated carrier undersides, the carrier parts fixedly connect to one another via at least one potting body and the potting body together with the carrier parts represents a bearing component of the semiconductor component so that all carrier undersides end flush with the potting body, the light-emitting semiconductor chips electrically connect in series, the metal layer on the carrier top side is structured into conductor tracks and into electrical connection surfaces, and the electrical connection surfaces on the carrier top side are electrically insulated from the associated carrier underside so that the carrier underside of the carrier part the semiconductor chips are arranged on is potential-free and is completely covered with the metal layer.

公开(公告)号：US20170069800A1

公开(公告)日：2017-03-09

申请号：US15120457

申请日：2015-02-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Britta Göötz ,  Frank Singer ,  Lutz Höppel ,  Jürgen Moosburger

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/50

CPC classification number: H01L33/486 ,  H01L33/005 ,  H01L33/505 ,  H01L33/52 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0066

Abstract: A method for producing optoelectronic semiconductor components (100) is specified, wherein a carrier (1) having a carrier main side (11) is provided. Furthermore, a plurality of singulated optoelectronic semiconductor chips (2) are provided, wherein the semiconductor chips (2) each have a main emission side (21) and a contact side (22) opposite the main emission side (21). The singulated semiconductor chips (2) are then applied to the carrier main side (11), such that the contact side (22) in each case faces the carrier main side (11). In regions between the semiconductor chips, a mask frame (3) is applied, wherein the mask frame (3) is a grid of partitions (31). In a plan view of the carrier main side (11), each semiconductor chip (2) is surrounded all around by the partitions (31). The semiconductor chips (2) are potted with a conversion material (4) such that a conversion element is respectively formed on the semiconductor chips (2). In this case, the conversion element (41) at least partly cover's the main emission side (21) of the respective semiconductor chip (2). The carrier (1) is then removed. In a further step, the optoelectronic semiconductor components (100) are detached from the mask frame (3), the mask frame (3) being destroyed.

Abstract translation: 规定了制造光电子半导体部件（100）的方法，其中，设置有具有载体主侧（11）的载体（1）。 此外，提供了多个单独的光电半导体芯片（2），其中半导体芯片（2）各自具有主发射侧（21）和与主发射侧（21）相对的接触侧（22）。 然后将单片半导体芯片（2）施加到载体主侧（11），使得接触侧（22）各自面向载体主侧（11）。 在半导体芯片之间的区域中，应用掩模框架（3），其中掩模框架（3）是隔板格（31）。 在载体主侧（11）的俯视图中，每个半导体芯片（2）被隔板（31）围绕。 半导体芯片（2）用转换材料（4）封装，使得转换元件分别形成在半导体芯片（2）上。 在这种情况下，转换元件（41）至少部分覆盖相应的半导体芯片（2）的主发射侧（21）。 然后移除载体（1）。 在另一步骤中，将光电子半导体部件（100）从掩模框架（3）分离，掩模框架（3）被破坏。

公开(公告)号：US09551479B2

公开(公告)日：2017-01-24

申请号：US14418924

申请日：2013-07-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Groetsch ,  Frank Singer

IPC: H01L21/00 ,  H01L33/00 ,  H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  F21V19/00 ,  H01L33/48 ,  F21S8/10 ,  F21V29/70 ,  H01L25/075

CPC classification number: F21V19/0015 ,  F21S41/147 ,  F21S41/19 ,  F21S43/14 ,  F21S43/19 ,  F21S45/47 ,  F21V29/70 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/48 ,  H01L2924/0002 ,  Y10T29/41 ,  H01L2924/00

Abstract: A method for producing an illuminant is specified, in which a positioning device (3) holds an optoelectronic semiconductor component (1) inside a tolerance range (4) on the upper side of a connection carrier (2) during the mechanical fixation and electrical connecting of the optoelectronic semiconductor component (1) to the connection carrier (2).

Abstract translation: 规定了用于制造发光体的方法，其中定位装置（3）在机械固定和电连接期间将光电子半导体部件（1）保持在连接载体（2）的上侧的公差范围（4）内 的光电子半导体部件（1）连接到连接载体（2）。

公开(公告)号：US20160276545A1

公开(公告)日：2016-09-22

申请号：US15033157

申请日：2014-10-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Johannes Mueller ,  Christoph Koller ,  Thomas Schwarz ,  Frank Singer

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/24 ,  H01L33/005 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: In various embodiments, a method for producing an electronic component is provided. The method includes applying an adhesive layer to a carrier, initially curing the adhesive layer applied to the carrier, providing a chip, wherein the chip has a substrate and a layer sequence arranged on the substrate, laying the chip onto the initially cured adhesive layer by way of a top side of the layer sequence, embedding the chip into a shaped body, wherein the top side of the layer sequence and a first side of the shaped body lie substantially in a plane, separating the embedded chip from the adhesive layer and the carrier, and applying an electrically conductive structure to the first side of the shaped body, the shaped body forming a vertical electrical insulation between the electrically conductive structure and the substrate.

Abstract translation: 在各种实施例中，提供了一种用于制造电子部件的方法。 该方法包括将粘合剂层施加到载体上，最初固化施加到载体上的粘合剂层，提供芯片，其中芯片具有衬底和布置在衬底上的层序列，将芯片铺设在初始固化的粘合剂层上 层序列的顶侧的方式，将芯片嵌入成形体中，其中层序列的顶侧和成形体的第一侧基本上位于平面中，将嵌入的芯片与粘合剂层分离，并且 载体，并且将导电结构施加到成形体的第一侧，成形体在导电结构和基板之间形成垂直的电绝缘。

公开(公告)号：US20160218261A1

公开(公告)日：2016-07-28

申请号：US15021091

申请日：2014-08-25

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Jürgen Moosburger ,  Ion Stoll ,  Thomas Schwarz ,  Frank Singer ,  Georg Dirscherl ,  Lutz Höppel

IPC: H01L33/60 ,  H01L33/56

CPC classification number: H01L33/60 ,  H01L24/24 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0091 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip including a light-transmissive carrier, a semiconductor layer sequence on the light-transmissive carrier and electrical connection points on a bottom portion remote from the light-transmissive carrier of the semiconductor layer sequence, a light-transmissive encapsulating material enclosing the optoelectronic semiconductor chip in places, and particles of a light-scattering and/or light-reflecting material, wherein the bottom of the semiconductor layer sequence is at least in places free of the light-transmissive encapsulating material, and the particles cover the bottom of the semiconductor layer sequence and an outer face of the encapsulating material in places.

Abstract translation: 光电子半导体部件包括：光电子半导体芯片，其包含透光性载体，透光性载体上的半导体层序列和远离半导体层序列的透光性载体的底部的电连接点; 封装光电子半导体芯片的透射性封装材料，以及光散射和/或光反射材料的颗粒，其中半导体层序列的底部至少在没有透光封装材料的位置，并且 颗粒在位置覆盖半导体层序列的底部和封装材料的外表面。

公开(公告)号：US20160146434A1

公开(公告)日：2016-05-26

申请号：US14902995

申请日：2014-07-03

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Wolfgang Mönch ,  Frank Singer

IPC: F21V9/16 ,  H01S5/00 ,  F21S8/10

CPC classification number: F21V9/30 ,  C09K11/7774 ,  F21S41/14 ,  F21S41/16 ,  F21S41/285 ,  F21V9/08 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/507 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01S5/005 ,  H01S5/4025 ,  H01L2924/00

Abstract: A conversion element includes a separating structure and a multiplicity of conversion regions, wherein each conversion region is at least partly enclosed by a part of the separating structure, and each conversion region converts electromagnetic primary radiation at least partly into a secondary radiation having a longer wavelength.

Abstract translation: 转换元件包括分离结构和多个转换区域，其中每个转换区域至少部分地被分离结构的一部分包围，并且每个转换区域将电磁一次辐射至少部分地转换成具有较长波长的二次辐射 。

公开(公告)号：US20150228873A1

公开(公告)日：2015-08-13

申请号：US14426072

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knörr ,  Klaus Müller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L21/56 ,  H01L21/48 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

Abstract translation: 在各种实施例中提供了用于光学部件的壳体。 壳体具有引线框架部分和模具复合体。 引线框架部分由导电材料形成，并且具有背离第一侧的第一侧和第二侧。 在第一侧，引线框架部分具有用于接收光学部件的至少一个第一接收区域和/或用于电接触光学部件的至少一个接触区域。 引线框架部分具有沿着接收区域和/或接触区域在其第一侧上的引线框架部分中形成的至少一个沟槽。 引线框架部分嵌入模具化合物中。 模具化合物具有至少一个容纳凹槽，其中布置有第一接收区域和/或接触区域和沟槽。