Process for planarizing patterned metal structures for magnetic thin film heads
    105.
    发明授权
    Process for planarizing patterned metal structures for magnetic thin film heads 失效
    用于平面化用于磁性薄膜头的图案化金属结构的方法

    公开(公告)号:US06660640B1

    公开(公告)日:2003-12-09

    申请号:US09614062

    申请日:2000-07-11

    IPC分类号: H01L21463

    摘要: A process for planarizing a patterned metal structure for a magnetic thin film head includes the steps of applying an encapsulation/planarizing material on a substrate, spinning the substrate in a photoresist spinner or similar machine, curing the encapsulation/planarizing layer by energetic particles such as an electron beam. The planarizing process further comprises the step of polishing the entire structure using a conventional chemical-mechanical polishing step. The curing step takes place at the substrate temperature less than 200° C., which prevents the damages of the thin film head structures such as MR and GMR sensors. This process is cheap, efficient and easy to apply.

    摘要翻译: 用于平坦化用于磁性薄膜头的图案化金属结构的方法包括以下步骤:在衬底上施加封装/平面化材料,将衬底旋转在光致抗蚀剂旋涂器或类似机器中,通过高能粒子固化封装/平坦化层,例如 电子束。 平面化处理还包括使用常规化学机械抛光步骤对整个结构进行抛光的步骤。 固化步骤在低于200℃的基板温度下进行,这防止了诸如MR和GMR传感器的薄膜头结构的损坏。 这个过程便宜,高效,易于应用。