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    Inverted CSP stacking system and method
    101.
    发明申请
    Inverted CSP stacking system and method 有权
    倒置CSP堆垛系统及方法

    公开(公告)号：US20060157842A1

    公开(公告)日：2006-07-20

    申请号：US11039615

    申请日：2005-01-20

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: H01L23/02

    CPC classification number: H05K1/147 ,  H01L23/5387 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/73253 ,  H01L2225/107 ,  H01L2924/3011 ,  H05K1/141 ,  H05K2201/056 ,  H05K2201/10515 ,  H05K2201/10734

    Abstract: Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides a balanced electrical connection to two CSP integrated circuits. In another embodiment, the flexible circuit provides a balanced electrical connection to inter-flex contacts of additional flexible circuits on two submodules. The additional flexible circuits provide further balanced connections to CSP integrated circuits in each submodule.

    Abstract translation: 两个或多个集成电路堆叠成高密度电路模块。 下部IC倒置。 与集成电路的电连接由沿着模块的下部延伸的柔性电路上的模块触点进行。 在一个实施例中，柔性电路提供与两个CSP集成电路的平衡电连接。 在另一个实施例中，柔性电路提供与两个子模块上的附加柔性电路的相互柔性触点的平衡电连接。 额外的灵活电路提供了进一步平衡的连接到每个子模块中的CSP集成电路。

    Lens barrel and imaging apparatus
    103.
    发明授权
    Lens barrel and imaging apparatus 失效
    镜筒和成像装置

    公开(公告)号：US07057829B2

    公开(公告)日：2006-06-06

    申请号：US10959141

    申请日：2004-10-07

    Applicant: Kouichi Tanigawa ,  Tetsuo Hayashi

    Inventor： Kouichi Tanigawa ,  Tetsuo Hayashi

    IPC: G02B15/14

    CPC classification number: H05K1/189 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H05K3/0061 ,  H05K3/3442 ,  H05K2201/056 ,  H05K2201/09181 ,  H05K2201/10121 ,  H05K2201/10727

    Abstract: A lens barrel and an imaging apparatus is provided for securely connecting an imaging element with an imaging circuit and advantageous in terms of downsizing of devices. A plurality of first connecting terminals is provided to a bottom face of an imaging element package. A flexible circuit board is constituted by an imaging element mounting section, an extending section and a connecting section. The imaging element mounting section includes a flexible circuit board and a plurality of second connecting terminals provided on a surface of the flexible circuit board so that each of the second connecting terminals match with a corresponding first connecting terminal. A metal plate is mounted at a position where the outline of the metal plate matches the outline of the package or the outline of the package is placed in the outline of the metal plate as viewed from the thicknesswise direction of the package, on the rear face of the imaging-element mounting section.

    Abstract translation: 提供了镜头镜头和成像装置，用于将成像元件与成像电路牢固连接，并且在装置的小型化方面是有利的。 多个第一连接端子被提供到成像元件封装的底面。 柔性电路板由成像元件安装部，延伸部和连接部构成。 成像元件安装部分包括柔性电路板和设置在柔性电路板的表面上的多个第二连接端子，使得每个第二连接端子与相应的第一连接端子匹配。 金属板安装在金属板的轮廓与包装的轮廓相匹配的位置处，或者包装的轮廓从包装的厚度方向观察时放置在金属板的轮廓中，在后表面 的成像元件安装部。

    Mounting structure, electro-optical device, and electronic apparatus
    104.
    发明申请
    Mounting structure, electro-optical device, and electronic apparatus 有权
    安装结构，电光装置和电子设备

    公开(公告)号：US20060109394A1

    公开(公告)日：2006-05-25

    申请号：US11230253

    申请日：2005-09-19

    Applicant: Sakiko Miyagawa ,  Shinichi Kobayashi

    Inventor： Sakiko Miyagawa ,  Shinichi Kobayashi

    IPC: G02F1/1333

    CPC classification number: H05K3/361 ,  G02F1/13452 ,  G02F2001/13456 ,  H05K1/0281 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/2009

    Abstract: An electro-optical device includes: a first substrate having an end edge; a second substrate that has an edge crossing the end edge and a plurality of first wiring lines crossing the end edge, the second substrate having. flexibility and being connected to the first substrate so as to overlap the end edge; and first reinforcing members provided on the second substrate so as to cross the end edge, in a region between the plurality of first wiring lines and a portion where the end edge and the edge cross each other.

    Abstract translation: 电光装置包括：具有端边缘的第一基板; 具有与所述端缘交叉的边缘的第二基板和与所述端边缘交叉的多个第一布线，所述第二基板具有。 柔性并且连接到第一基板以与端边缘重叠; 以及第一加强构件，其设置在所述第二基板上，以跨越所述端边缘，在所述多个第一布线之间的区域中以及所述端边缘和所述边缘彼此交叉的部分。

    Magnetic head device having magnetic head and base plate interconnected by folding flexible wiring board
    105.
    发明授权
    Magnetic head device having magnetic head and base plate interconnected by folding flexible wiring board 失效
    具有通过折叠柔性布线板互连的磁头和底板的磁头装置

    公开(公告)号：US07042679B2

    公开(公告)日：2006-05-09

    申请号：US10326793

    申请日：2002-12-19

    Applicant: Shigeto Yamada

    Inventor： Shigeto Yamada

    IPC: G11B21/16

    CPC classification number: G11B5/4853 ,  H05K3/0058 ,  H05K3/363 ,  H05K3/403 ,  H05K2201/056

    Abstract: A magnetic head device includes terminal pads formed on a side surface of a magnetic head, the magnetic head being installed on the edge of one surface side of a base plate; and a flexible wiring board comprising a connection terminal portion connected to each of the terminal pads of the magnetic head, a wiring extension portion extended from the connection terminal portion, and an extension terminal portion extended from the wiring extension portion. Herein, the connection terminal portion is disposed on the one surface of the base plate adjacently to the terminal pads of the magnetic head on the base plate; the wiring extension portion is folded back toward the other surface side of the base plate; the extension terminal portion is mounted on the other surface of the base plate; and the connection terminal portion and each of the terminal pads of the magnetic head are electrically interconnected.

    Abstract translation: 磁头装置包括形成在磁头的侧表面上的端子焊盘，磁头安装在基板的一个表面侧的边缘上; 以及柔性布线板，包括连接到磁头的每个端子焊盘的连接端子部分，从连接端子部分延伸的布线延伸部分和从布线延伸部分延伸的延伸端子部分。 这里，连接端子部与基板的磁头的端子垫相邻配置在基板的一个面上， 布线延伸部向基板的另一个表面侧折回; 延伸端子部分安装在基板的另一个表面上; 并且磁头的连接端子部分和每个端子焊盘电互连。

    High capacity thin module system and method
    106.
    发明申请
    High capacity thin module system and method 有权
    大容量薄模块系统及方法

    公开(公告)号：US20060091529A1

    公开(公告)日：2006-05-04

    申请号：US11231418

    申请日：2005-09-21

    Applicant: James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H01L23/34

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

    Thin module system and method
    108.
    发明申请
    Thin module system and method 审中-公开
    薄模块系统和方法

    公开(公告)号：US20060053345A1

    公开(公告)日：2006-03-09

    申请号：US11123721

    申请日：2005-05-06

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: G06F11/00

    CPC classification number: H05K1/189 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

    Abstract: A thin profile memory module is provided which, in a variety of modes, can supplant traditional DIMM constructions of a variety of types such as, for example, registered and fully-buffered. In preferred modes, a memory module is provided that can meet or exceed the interconnective and capacity requirements for SO-DIMMs yet can simultaneously meet or exceed the profile requirements for such devices. In preferred modes, a flex circuit is populated along each of its first and second major sides with a plurality of array type (CSP) devices. Insertion contacts are disposed in two sets on the first side of the flex circuit and disposed proximal to a long edge area of the flex circuit. A substrate with first and second major sides provides a form for the module. The flex circuit is wrapped about an edge of the substrate to place one set of the insertion contacts along the first side of the substrate and the other set of the insertion contacts along the second side of the substrate while the ICs populated along the second side of the flex circuitry are disposed between the flex circuit and the substrate.

    Abstract translation: 提供了薄型存储器模块，其以各种模式可以取代各种类型的传统DIMM构造，例如，已注册和完全缓冲。 在优选模式中，提供可满足或超过SO-DIMM的互连和容量需求的存储器模块，但是可以同时满足或超过这些设备的配置文件要求。 在优选的模式中，柔性电路沿着其第一和第二主要侧面以多个阵列型（CSP）装置填充。 插入触头在柔性电路的第一侧上设置成两组，并且设置在柔性电路的长边缘区域附近。 具有第一和第二主要侧面的基板提供了用于模块的形式。 柔性电路围绕衬底的边缘缠绕，以沿着衬底的第一侧沿着衬底的第一侧放置一组插入触点，并且沿衬底的第二侧放置另一组插入触点，同时沿着衬底的第二侧填充IC 柔性电路设置在柔性电路和基板之间。

    Thin module system and method
    110.
    发明申请
    Thin module system and method 有权

    公开(公告)号：US20060050496A1

    公开(公告)日：2006-03-09

    申请号：US11005992

    申请日：2004-12-07

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: H05K1/14

    CPC classification number: H01L25/0652 ,  G11C5/04 ,  G11C5/143 ,  H01L25/105 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2924/00

    Abstract: A flexible circuit is populated with integrated circuits. Integrated circuits populated on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. In a preferred embodiment, the overall module profile does not, consequently, include the thickness of the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flex circuit may be aligned using tooling holes in the flex circuit and substrate. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers. Other embodiments may stagger or offset the ICs.

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