摘要:
An insulated gate thyristor (IGTH) (40,80) that is built on IGBT technology rather than SCR or thyristor technology. The device provides the low on-resistance of a thyristor with the gate turn-on and turn-off capability of an IGBT. The device may be fabricated in a somewhat modified IGBT process, in a cellular (40) or stripe (80) configuration. First the process is modified (by reduced doping) in order to promote (rather than inhibit) latch-up. Second, certain regions (52) are formed without source diffusions to create a lateral MOSFET (T.sub.5) that can turn off the latched IGBT.
摘要:
A thyristor of the present invention turns on by applying a specified voltage to a first control electrode and turns off by applying a specified voltage to a second control electrode. These first and second control electrodes are independent of each other, so that the turning-on and turning-off conditions can be determined independently. When a transistor having the second control electrode is turned on by applying the specified voltage to the second control electrode until just before the turning-on, a first main electrode and a first semiconductor region can be electrically connected, so that the back gate potential of the transistor having the first control electrode can be fixed at the potential of the first main electrode.
摘要:
The present invention discloses a semiconductor manufacturing apparatus comprising a wafer supply unit including a tray on which a plurality of wafers are placed, a positioning unit for detecting specific points on the wafers prior to molding of a resin and compensating for the position of the wafers, a molding unit for molding the resin on the peripheries of the wafers which have been compensated for position, an injecting unit for supplying the resin to the molding unit, a storage unit for storing resin-molded wafers, a wafer carrying unit for carrying wafers between the supply unit and the positioning unit, between the positioning unit and the molding unit and between the molding unit and the storage unit, and a control unit for controlling the operation of the supply unit, the positioning unit, the molding unit, the injecting unit, the storage unit and the carrying unit.
摘要:
In a high-reverse-voltage GTO thyristor, a negative beveling (6) with comparatively high beveling angle (.alpha.) is possible as edge contouring as a result of separating the p-type base layer into a central p-type base layer (4) of small depth and high edge concentration and a p-type base edge layer (5) of greater depth and lower edge concentration.The production of the two p-type base layers (4, 5) is preferably carried out by simultaneous diffusion of two acceptors with different diffusion constants.
摘要:
A semiconductor element is formed in a composite substrate constructed by fixing two semiconductor substrates in close contact with each other, and crystal defects are formed in that portion of at least one of the two semiconductor substrates which lies near the junction plane of the two semiconductor substrates. The crystal defects act as the center of the recombination of excess minority carriers accumulated in an active region of the semiconductor element.
摘要:
In a high-reverse-voltage GTO thyristor, a negative beveling (6) with comparatively high beveling angle (.alpha.) is possible as edge contouring as a result of separating the p-type base layer into a central p-type base layer (4) of small depth and high edge concentration and a p-type base edge layer (5) of greater depth and lower edge concentration.The production of the two p-type base layers (4, 5) is preferably carried out by simultaneous diffusion of two acceptors with different diffusion constants.
摘要:
A multi-cellular power field effect semiconductor device includes a tungsten silicide/polysilicon/oxide gate electrode stack with low sheet resistance. Preferably, a layer of tungsten is also disposed in intimate contact with the source region of the device. This tunsten layer is self-aligned with respect to the aperture in the gate electrode through which the source region is diffused. The presence of this tungsten layer greatly reduces the resulting ohmic contact resistance to the region. If desired, a tunsten layer can also be disposed in contact with the drain region of the device, again, to lower ohmic contact resistance. The device has substantially improved operating characteristics. Novel processes for producing the device are also described.
摘要:
A MOSFET is provided between a main thyristor and an auxiliary thyristor for controlling the main thyristor. The source and drain regions of the MOSFET are also used as a first N-type emitter region of the main thyristor and a second N-type emitter region of the auxiliary thyristor. The MOSFET and the auxiliary thyristor are controlled by an output of a gate energization circuit. When the MOSFET is turned on by an output of the gate energization circuit, the main thyristor is connected to the auxiliary thyristor. At this time, the auxiliary thyristor is turned on by the output of the gate energization circuit, and the main thyristor is also turned on due to the turn-on operation of the auxiliary thyristor. When the MOSFET is in the OFF state, the main thyristor is electrically isolated from the auxiliary thyristor.
摘要:
The invention relates to a symmetrical power semiconductor device having peripheral connection slabs and to a method of fabricating such a device. An essentially polycrystalline P/N epitaxial layer (23) lies flush with a main face (S1) of the device by virture of grooves (21) obtained by etching and overlaid with a peripheral P/N zone (25). A P/N layer (22) is diffused between the epitaxial layer (23) and a monocrystalline N/P layer (20) in order to establish a junction (J2) which the grooves (21) and the peripheral zone (25) serve to bring out on the main face (S1). The invention is applicable to symmetrical bipolar devices, and in particular to gate-triggered thyristors.
摘要:
A self aligned method of fabricating a self aligned semiconductor device employs an initial step in which a first window having an inner perimeter and outer perimeter is opened through a first protective layer situated atop a semiconductor substrate, to divide the substrate into three separate zones. The window exposes a first surface portion of the semiconductor substrate and circumferentially defines or encompasses a second central portion of the protective layer as well as a second unexposed surface portion of the substrate. A third surface portion of the substrate lies beyond the outer perimeter of the first window. Precisely aligned substrate regions of the same or different conductivity type can be established by using differentially etchable materials to mask designated surface portions of the substrate.