Abstract:
The present invention relates to a register cell comprising one output node, at least two power supply nodes, and a first flash transistor and a second flash transistor, wherein the register cell is configured so that the output node can be driven by at least one of the power supply nodes as a function of the value stored in at least one of the flash transistors. The invention further relates to an FPGA comprising the register cell.
Abstract:
The present invention relates to a multiplexer comprising at least a first input and a second input and one output connected to the first input via a first pass gate and to the second input via a second pass gate, wherein the first pass gate comprises at least a first double-gate transistor, and the second pass gate comprises at least a second double-gate transistor, and each of the first and second double-gate transistors has a first gate controlled based on a first control signal and a second gate controlled based on a second control signal. The invention further relates to a look-up table and a and an FPGA based on the multiplexer.
Abstract:
The present disclosure relates to a method for manufacturing a multi-junction solar cell device comprising the steps of: providing a first substrate, providing a second substrate having a lower surface and an upper surface, forming at least one first solar cell layer on the first substrate to obtain a first wafer structure, forming at least one second solar cell layer on the upper surface of the second substrate to obtain a second wafer structure, and bonding the first wafer structure to the second wafer structure, wherein the at least one first solar cell layer is bonded to the lower surface of the second substrate and removing the first substrate.
Abstract:
The present invention relates to a look-up table comprising a plurality of register signals (r0-r3); a plurality of inputs signals (A, A′, B, B′); and at least one output signal (Y); and a plurality of pass gates, wherein at least a first pass gate of the plurality of pass gates is controlled by at least a first input signal of the plurality of input signals, and by at least a first register signal, of the plurality of register signals, such that the register signal has priority over the input signal on the operation of the first pass gate.
Abstract:
A device for back-scattering an incident light ray, including: a host substrate; a structured layer; a first face in contact with a front face of the host substrate; a second flat face parallel to the first face; a first material and a second material which form, in a mixed plane, alternating surfaces at least one of whose dimensions is between 300 nm and 800 nm, the mixed plane is between the first and second face of the structured layer; wherein the refractive index of the first and of the second material are different, the structured layer is covered by a specific layer, the specific layer is made of a material which is different from the first and second materials of the structured layer, and the specific layer is crystalline and semi-conductive.
Abstract:
The invention relates to a process for manufacturing a semiconductor substrate, characterized in that it comprises providing at least one donor semiconductor substrate comprising at least one useful silicon layer; inspecting the donor substrate via an inspecting machine in order to detect whether the useful layer contains emerging cavities of a size larger than or equal to a critical size, said critical size being strictly smaller than 44 nm; and manufacturing a semiconductor substrate comprising at least part of the useful layer of the donor substrate if, considering cavities of a size larger than or equal to the critical size, the density or number of cavities in the useful layer of the donor substrate is lower than or equal to a critical defect density or number.
Abstract:
Apparatus for the industrial wiring and final testing of photovoltaic concentrator modules, consisting of a module frame, a lens disc, a sensor carrier disc and an electrical line routing arrangement, comprising the following features: a) a laser contact-making device for the contactless connection of connecting lines between the individual sensors and of connecting elements and of collective contact plates, wherein the line routing arrangement on the sensor carrier disc as basic structure has in each case 5 CPV sensors connected in parallel, and these parallel circuits are connected in series, b) a device for testing electrical properties, wherein a specific voltage is applied to CPV sensors themselves, and the light emitted by them via the lenses is detected and assessed, c) a device for testing tightness of finished concentrator modules, wherein compressed air is applied to the modules in the interior and the emission of compressed air is checked.
Abstract:
A substrate comprises a base wafer, an insulating layer over the base wafer, and a top semiconductor layer over the insulating layer on a side thereof opposite the base wafer. The insulating layer comprises a charge-confining layer confined on one or both sides with diffusion barrier layers, wherein the charge-confining layer has a density of charges in absolute value higher than 1010 charges/cm2. Alternatively, the insulating layer comprises charge-trapping islands embedded therein, wherein the charge-trapping islands have a total density of charges in absolute value higher than 1010 charges/cm2.
Abstract translation:衬底包括基底晶片,在基底晶片上方的绝缘层,以及在与基底晶片相对的一侧上的绝缘层上的顶部半导体层。 绝缘层包括限制在具有扩散阻挡层的一侧或两侧的电荷限制层,其中电荷限制层的绝对值的电荷密度高于1010电荷/ cm 2。 或者,绝缘层包括嵌入其中的电荷捕获岛,其中电荷捕获岛具有高于1010电荷/ cm 2的绝对值的电荷的总密度。
Abstract:
Methods of forming ternary III-nitride materials include epitaxially growing ternary III-nitride material on a substrate in a chamber. The epitaxial growth includes providing a precursor gas mixture within the chamber that includes a relatively high ratio of a partial pressure of a nitrogen precursor to a partial pressure of one or more Group III precursors in the chamber. Due at least in part to the relatively high ratio, a layer of ternary III-nitride material may be grown to a high final thickness with small V-pit defects therein. Semiconductor structures including such ternary III-nitride material layers are fabricated using such methods.
Abstract:
The invention relates to a method for transferring a layer from a donor substrate onto a handle substrate wherein, after detachment, the remainder of the donor substrate is reused. To get rid of undesired protruding edge regions that are due to the chamfered geometry of the substrates, the invention proposes to carry out an additional etching process before detachment occurs.