公开(公告)号：US20060216854A1

公开(公告)日：2006-09-28

申请号：US10548457

申请日：2004-04-01

申请人： Kazuhiro Nishikawa

发明人： Kazuhiro Nishikawa

IPC分类号： H01L21/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/92 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K2201/0129 ,  H05K2203/1189 ,  H01L2224/96 ,  H01L2224/82

摘要： A method for manufacturing a circuit board (7); in which, an electronic component is injected into a resin substrate at a low temperature, and then the resin substrate is improved in its heat withstanding property. The manufacturing method comprises the steps of softening by heat a resin substrate which contains a thermoplastic component and a chemical cross-link component and then injecting an electronic component (1) into the resin substrate; curing the resin substrate by bridging the chemical cross-link component of the resin substrate, making the resin substrate into a heat-withstanding substrate (70); and forming an electric wiring pattern (6) on the heat-withstanding substrate (70) for connection with a protruding electrode (2) of the electronic component (1). The circuit board (7) maintains the high dimensional accuracy throughout the manufacturing process. Thus, the present invention offers a superior circuit board, which is thin and compact in size and has a small thermal deformation rate.

摘要翻译： 一种电路板（7）的制造方法。 其中，电子部件在低温下被注入到树脂基板中，然后提高树脂基板的耐热性能。 该制造方法包括以下步骤：将含有热塑性成分的树脂基材和化学交联成分加热软化，然后将电子部件（1）注入树脂基板; 通过桥接树脂基板的化学交联部件固化树脂基板，使树脂基板成为耐热基板（70）; 以及在所述耐热基板（70）上形成用于与所述电子部件（1）的突出电极（2）连接的电布线图案（6）。 电路板（7）在整个制造过程中保持高尺寸精度。 因此，本发明提供了一种优良的电路板，其尺寸薄且紧凑，并且具有小的热变形率。

公开(公告)号：US20060038274A1

公开(公告)日：2006-02-23

申请号：US11196269

申请日：2005-08-04

申请人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

发明人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida

IPC分类号： H01L23/02

CPC分类号： H05K1/183 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/1627 ,  H01L2924/3511 ,  H05K2201/0382 ,  H05K2201/10674 ,  H05K2201/2018 ,  H05K2203/0278

摘要： A 3D circuit module which is highly reliable, easily layered and able to mount electronic components in high density is obtained by providing a support member having a frame in the periphery thereof and a recess; a coating layer for coating the frame and filling in the recess, the coating layer being made of resin material which is adhesive and has a softening temperature lower than the softening temperature of the support member; a wiring pattern formed on the coating layer, the wiring pattern including a first land on the frame, a second land on the recess, and a wiring part for connecting between the first land and the second land; and an electronic component having a projecting electrode formed on a side thereof, the electronic component being bonded to the coating layer and accommodated in the recess, with the projecting electrode connected to the second land.

摘要翻译： 通过在其周边设置具有框架的支撑构件和凹部，获得高度可靠，容易分层并能够以高密度安装电子部件的3D电路模块; 用于涂覆所述框架并填充所述凹部的涂层，所述涂层由粘合剂并且具有低于所述支撑构件的软化温度的软化温度的树脂材料制成; 形成在所述涂层上的布线图案，所述布线图案包括所述框架上的第一平台，所述凹部上的第二平台，以及用于连接所述第一平台和所述第二平台之间的布线部分; 以及电子部件，其具有在其一侧形成的突出电极，所述电子部件被接合到所述涂层并容纳在所述凹部中，所述突出电极连接到所述第二焊盘。

公开(公告)号：US20050260867A1

公开(公告)日：2005-11-24

申请号：US11118403

申请日：2005-05-02

申请人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida ,  Hiroyuki Inoue ,  Osamu Miyazaki ,  Hiroshi Takeda ,  Tsuneyuki Ejima

发明人： Masahiro Ono ,  Shigeru Kondou ,  Kazuhiro Nishikawa ,  Kazuto Nishida ,  Hiroyuki Inoue ,  Osamu Miyazaki ,  Hiroshi Takeda ,  Tsuneyuki Ejima

IPC分类号： H01R12/00 ,  H01R13/24 ,  H01R33/76 ,  H05K1/14

CPC分类号： H05K1/144 ,  H01L2224/16225 ,  H01L2924/19105 ,  H01R12/52 ,  H05K3/3426 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/2018

摘要： The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.

摘要翻译： 本发明包括由具有弹性弹性的导电材料制成的多个引线端子; 绝缘壳体，其埋设引线端子区域的一部分，并且在预先设置的布置中固定地保持多个引线端子。 引线端子由掩埋在壳体中的引线端子的一部分构成; 从埋藏部分的一端延伸的底端接头通过壳体的底端表面暴露，并在底端表面的宽度方向上提取; 以及通过与底端表面正交的一个壁面暴露于埋藏部分的另一端的柔性变化部分，并且沿着该壁表面延伸到面向底端表面的顶端表面，与壁表面和顶端表面间隔开 。

公开(公告)号：US20050093172A1

公开(公告)日：2005-05-05

申请号：US10959324

申请日：2004-10-07

申请人： Norihito Tsukahara ,  Kazuhiro Nishikawa ,  Kazuto Nishida

发明人： Norihito Tsukahara ,  Kazuhiro Nishikawa ,  Kazuto Nishida

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H05K3/28 ,  H01L21/48 ,  H01L23/52

CPC分类号： G06K19/07718 ,  G06K19/07728 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/83192 ,  H01L2224/8388 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H05K3/281 ,  H05K3/284 ,  H01L2924/00

摘要： An electronic circuit device has a substrate having a wiring pattern, an electronic component electrically connected to a terminal section of the wiring pattern by contacting a projection electrode with it, a cover that is disposed at a position facing the substrate and grapples the electronic component between it and the substrate, and a resin layer made of thermoplastic resin filled in a gap between the substrate and the cover. The gap includes a space in a connection region except an electric connection part between the projection electrode and the terminal section. The electronic component is adhered to the substrate and the substrate is adhered to the cover through the resin layer. Thus, the electronic circuit device having high connection reliability and high mass productivity, and a method and apparatus for manufacturing the electronic circuit device can be provided.

摘要翻译： 电子电路器件具有布线图案的基板，通过与突起电极接触而与布线图案的端子部分电连接的电子部件，设置在面向基板的位置并且将电子部件与第二电路部件之间抓握的盖 以及填充在基板和盖之间的间隙中的由热塑性树脂制成的树脂层。 间隙包括除了突起电极和端子部之间的电连接部分以外的连接区域中的空间。 电子部件粘附到基板上，并且基板通过树脂层粘附到盖上。 因此，可以提供具有高连接可靠性和高质量生产率的电子电路装置，以及用于制造电子电路装置的方法和装置。

公开(公告)号：US20050087363A1

公开(公告)日：2005-04-28

申请号：US10951620

申请日：2004-09-29

申请人： Norihito Tsukahara ,  Kazuhiro Nishikawa

发明人： Norihito Tsukahara ,  Kazuhiro Nishikawa

IPC分类号： H05K1/09 ,  H05K3/20 ,  H05K3/24 ,  H05K3/40

CPC分类号： H05K3/249 ,  H05K1/095 ,  H05K3/207 ,  H05K2201/035

摘要： A wiring board comprises a patterned wiring formed of electrically conductive resin composed primarily of silver and embedded into a substrate in a manner that a surface thereof is exposed above the substrate, and a covering conductor formed primarily of carbon covering the surface of the patterned wiring. The wiring board of this structure is superior in resistance to moisture absorption and water, prevents silver migration attributable to the moisture, and reduces a contact resistance in the connection between a terminal portion of the wiring board and an external apparatus.

摘要翻译： 布线板包括由主要由银构成并以其表面暴露在基板上方的方式嵌入到基板中的导电树脂形成的图案布线，以及主要由覆盖图案化布线表面的碳形成的覆盖导体。 该结构的布线基板具有优异的耐吸湿性和防水性，防止由于水分引起的银迁移，并且降低了布线板的端子部分与外部设备之间的连接中的接触电阻。

公开(公告)号：US20050017373A1

公开(公告)日：2005-01-27

申请号：US10860653

申请日：2004-06-04

申请人： Kazuhiro Nishikawa ,  Norihito Tsukahara ,  Masayuki Okano

发明人： Kazuhiro Nishikawa ,  Norihito Tsukahara ,  Masayuki Okano

IPC分类号： H05K3/34 ,  H01L21/60 ,  H05K1/09 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/46 ,  H05K1/00 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/321 ,  H01L2224/16225 ,  H01L2224/29012 ,  H01L2224/32225 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01322 ,  H05K1/095 ,  H05K3/305 ,  H05K3/4664 ,  H05K2201/09881 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012

摘要： It comprises circuit board 10 with circuit pattern 2 formed by conductive resin paste on resin substrate 1, surface-mounted type electronic components 30, 40 arranged with electrode terminals with respect to the connecting region of circuit pattern 2, connecting member 3 formed from conductive resin paste for connecting the connecting region to the electrode terminal, and insulating adhesive 6 for bonding the electronic components 30, 40 and circuit board 10, which is lower in curing temperature than conductive resin paste and disposed in a space between circuit board 10 and electronic components 30, 40 between connecting regions.

摘要翻译： 它包括具有由树脂基板1上的导电树脂膏形成的电路图案2的电路板10，相对于电路图案2的连接区域布置有电极端子的表面安装型电子部件30,4，由导电树脂形成的连接部件3 用于将连接区域连接到电极端子的粘合剂以及用于粘合固化温度低于导电树脂浆料并且设置在电路板10和电子部件之间的空间中的电子部件30,40和电路板10的绝缘粘合剂6 30，40连接区域之间。

公开(公告)号：US06777362B2

公开(公告)日：2004-08-17

申请号：US10239305

申请日：2002-10-21

申请人： Tomoki Fukagawa ,  Kazuhiro Nishikawa

发明人： Tomoki Fukagawa ,  Kazuhiro Nishikawa

IPC分类号： C04B35465

CPC分类号： C04B35/475 ,  C04B35/462 ,  C04B35/465 ,  C04B35/50 ,  C04B35/6262 ,  C04B2235/3201 ,  C04B2235/3203 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3224 ,  C04B2235/3227 ,  C04B2235/3232 ,  C04B2235/3298

摘要： A dielectric ceramic composition wherein the dielectric constant ∈ is large, the temperature coefficient &tgr;f of the resonance frequency is close to 0, and which as a large Q value, is obtained by adding to and blending with a ceramic composition whose &tgr;f of the resonance frequency is large on the plus side a ceramic composition whose temperature coefficient &tgr;f is large on the minus side. In an Li2O—R2O3—TiO2-based composition, an improved dielectric constant ∈ can be achieved by introducing a specific quantity of Bi2O3, and &tgr;f can be shifted to the plus side and in addition a considerable improvement in Qf achieved by introducing a specific quantity of MO, where M is one or two of Ca and Sr. Furthermore, by introducing a specific quantity of Na2O together with the MO (where M is one or two of CA and Sr), in particular in the case of material of ∈r>150, it is possible to control &tgr;f to the vicinity of 0 while maintaining Qf at an high value.

摘要翻译： 介电常数ε大的介电陶瓷组合物，谐振频率的温度系数τf接近于0，并且通过将共振频率的τf加到并掺合陶瓷组合物作为大的Q值， 在正面上较大的是在负侧的温度系数τf大的陶瓷组合物。 在Li 2 O-R 2 O 3 -TiO 2基组合物中，通过引入特定量的Bi 2 O 3可以实现改进的介电常数ε，并且tauf可以转移到正面，另外通过引入特定量可以实现Qf的显着改善 的MO，其中M是Ca和Sr的一种或两种。此外，通过将特定量的Na 2 O与MO（其中M是CA和Sr的一个或两个）一起引入，特别是在∈r的材料的情况下 > 150时，可以将τf控制在0附近，同时将Qf保持在高值。

公开(公告)号：US06734126B2

公开(公告)日：2004-05-11

申请号：US10168689

申请日：2002-07-25

申请人： Shugo Ohtsuki ,  Takeshi Shimada ,  Kazuhiro Nishikawa ,  Kazuya Toji ,  Kazuhiro Kura

发明人： Shugo Ohtsuki ,  Takeshi Shimada ,  Kazuhiro Nishikawa ,  Kazuya Toji ,  Kazuhiro Kura

IPC分类号： C04B3547

CPC分类号： C04B35/47 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3227 ,  C04B2235/3236 ,  C04B2235/3286 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/80

摘要： A dielectric ceramic composition for microwave use having a relative permittivity &egr;r of 35 to 45, Qf0 value of more than 50,000 GHz (at 7 GHz), and dielectric characteristic of &tgr;f=0±10 ppm/° C includes an La2O3.Al2O3.SrO.TiO2 based ceramic composition and a specific quantity of Ga2O3 to increase the Qf0 value and a specific amount of Pr2O3to control the &tgr;f value.

摘要翻译： 包括相对介电常数ε为35至45，Qf0值大于50,000GHz（7GHz）的介电陶瓷组合物和tauf = 0±10ppm /℃的介电特性包括La 2 O 3·Al 2 O 3·S .TiO2基陶瓷组合物和一定量的Ga2O3以增加Qf0值和一定量的Pr2O3来控制tau值。

公开(公告)号：US06331498B1

公开(公告)日：2001-12-18

申请号：US09581569

申请日：2000-06-23

申请人： Takeshi Shimada ,  Kazuhiro Nishikawa ,  Kazuya Toji

发明人： Takeshi Shimada ,  Kazuhiro Nishikawa ,  Kazuya Toji

IPC分类号： C04B35495

CPC分类号： C04B35/495

摘要： A dielectric ceramic composition for electronic devices, which exhibits &tgr;f and ∈r characteristics equivalent or superior to those of the dielectric ceramic composition of the prior art, can inhibit the evaporation of Zn from the composition to thereby facilitate the control of makeup of the composition, can give homogeneous ceramics through short-time sintering more stably, is improved particularly in permittivity (Qf) and controllability of temperature characteristics, and permits downsizing of the dielectric elements. This composition is a solid solution of XBa(Zn⅓.Ta⅔)O3—Y(BaZ.Sr1−Z)(Ga½.Ta½)O3 which contains a specific trivalent metal ion and has a Zn content adjusted to a predetermined level, wherein part of Ta contained in the XBa(Zn⅓.Ta⅔)O3 moiety has been replaced by Nb. The composition is improved not only in permittivity by virtue of the above replacement but also in the degree of sintering by virtue of the above trivalent metal, i.e., Ga contained in the Y(BaZ.Sr1−Z)(Ga½.Ta½)O3 moiety, thus attaining the effects of improvement in permittivity and control of temperature characteristics simultaneously.

摘要翻译： 具有与现有技术的介电陶瓷组合物相当或优于现有技术的电介质陶瓷组合物的电子器件的电介质陶瓷组合物可以抑制Zn从组合物的蒸发，从而有助于控制组合物的组成 组合物可以通过短时间烧结得到均匀的陶瓷，特别是在介电常数（Qf）和温度特性的可控性方面得到改善，并且允许电介质元件的小型化。 该组合物是含有特定的三价金属离子并且Zn含量调节至预定水平的XBa（Zn1/3.Ta⅔）O 3-Y（BaZ.Sr 1 -Z）（Ga 1/2.T a 1/2）O 3的固溶体，其中部分 包含在XBa（Zn 1/3 Ta）O 3部分中的Ta已被Nb替代。 通过上述替代，组合物不仅在介电常数方面得到改善，而且由于上述三价金属，即包含在Y（BaZ.Sr 1 -Z）（Ga 1/2 .Ta 1/2）O 3部分中的Ga ，从而达到提高介电常数和同时控制温度特性的效果。

公开(公告)号：US6141983A

公开(公告)日：2000-11-07

申请号：US302736

申请日：1999-04-30

申请人： Kazuhiro Nishikawa ,  Hirozumi Ito ,  Noriya Asada ,  Chiaki Morimoto ,  Hirokazu Sakai ,  Shigeki Tomita

发明人： Kazuhiro Nishikawa ,  Hirozumi Ito ,  Noriya Asada ,  Chiaki Morimoto ,  Hirokazu Sakai ,  Shigeki Tomita

IPC分类号： F24F1/00 ,  F24F3/00

CPC分类号： F24F1/0033 ,  F24F1/0011 ,  F24F2001/0037 ,  F24F2001/0048

摘要： The constitution comprises a grille for sucking air, a heat exchanger for exchanging heat with the air, a blower for feeding the air exchanged of heat by the heat exchanger, and an air diffuser for blowing out the wind generated by the blower. The air diffuser has such a shape that the direction of the wind blown out from both ends in a horizontal direction may be the lower direction than the direction of the wind blown out from the center in the horizontal direction. The air diffuser has such a shape that the outer circumference of the section in the horizontal direction has a nearly arc shape. It can be installed at a corner of mutually adjacent walls of a room or on a wall. In this constitution, the heat exchanged wind reaches uniformly all parts of the room, and the comfort is notably enhanced. At the same time, generation of unusual sound is suppressed.

摘要翻译： 该构造包括用于吸入空气的格栅，用于与空气进行热交换的热交换器，用于将由热交换器交换的空气供给的鼓风机和用于吹出由鼓风机产生的风的空气扩散器。 空气扩散器具有这样的形状：从两端沿水平方向吹出的风的方向可以是比从水平方向中心吹出的风的方向更低的方向。 空气扩散器具有这样的形状，使得该部分在水平方向上的外周具有接近圆弧形状。 它可以安装在房间相互相邻的墙壁或墙上。 在这种结构中，热交换的风均匀地到达房间的所有部分，并且舒适性显着提高。 同时，异常声音的产生被抑制。