公开(公告)号：US08253041B2

公开(公告)日：2012-08-28

申请号：US12783792

申请日：2010-05-20

Applicant: Da-Jung Chen ,  Chi-Feng Huang ,  Yi-Tsung Chen ,  Huei-Ren You ,  Jeng-Jen Li

Inventor： Da-Jung Chen ,  Chi-Feng Huang ,  Yi-Tsung Chen ,  Huei-Ren You ,  Jeng-Jen Li

IPC: H01L23/495

CPC classification number: H01L23/49861 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48145 ,  H01L2924/00012

Abstract: An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.

Abstract translation: 提供了一种包括引线框架，绝缘层和至少一个电子元件的电子元件封装模块。 引线框架是图案化金属片，并且具有第一表面，与其相对的第二表面和从第一表面延伸到第二表面的通孔。 通过沟槽限定引线框架的基板部分周围的基板部分和多个引线部分。 引线框架的第二表面暴露在电子元件封装模块的外部。 布置在通孔中的绝缘层分别具有与第一表面和第二表面大致共面的第三表面和第四表面。 布置在第一表面上的电子元件连接到引线框架。

公开(公告)号：US08212641B2

公开(公告)日：2012-07-03

申请号：US12709912

申请日：2010-02-22

Applicant: Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh

Inventor： Tsung-Chan Wu ,  Roger Hsieh ,  Yi-Min Huang ,  Lan-Chin Hsieh

IPC: H01F27/02 ,  H01F27/28

CPC classification number: H01F17/045 ,  H01F2017/048

Abstract: An electronic device including a core, at least a wire and a magnetic material is provided. The core includes a pillar, a top board and a bottom board. The pillar is disposed between the top board and the bottom board. An area of the top board is smaller than an area of the bottom board. A winding space is fanned among the top board, the bottom board and the pillar. The wire is winded around the pillar and located in the winding space. The magnetic material fills the winding space to encapsulate the wire. The magnetic material includes a resin and a metallic powder, wherein an average particle diameter of the magnetic powder is smaller than 20 μm.

Abstract translation: 提供了包括芯，至少线和磁性材料的电子设备。 核心包括柱子，顶板和底板。 支柱设置在顶板和底板之间。 顶板的面积小于底板的面积。 在顶板，底板和支柱之间蜿蜒的空间。 电线缠绕在支柱上并位于绕组空间中。 磁性材料填充绕组空间以封装电线。 磁性材料包括树脂和金属粉末，其中磁粉的平均粒径小于20μm。

公开(公告)号：US20120069529A1

公开(公告)日：2012-03-22

申请号：US13180292

申请日：2011-07-11

Applicant: Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

Inventor： Da-Jung Chen ,  Kaipeng Chiang ,  Yu-Chao Fang ,  Yi-Cheng Lin

IPC: H05K7/00

CPC classification number: H01L23/645 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1904 ,  H01L2924/19042 ,  H01L2924/19102 ,  H01L2924/19105 ,  H01L2924/3025 ,  H02M3/155 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power conversion module includes a circuit carrier board, a semiconductor module and an inductor module. The circuit carrier board has plural bonding pads. The semiconductor module is disposed on a first surface of the circuit carrier board. The inductor module has plural pins. The pins are extended from the inductor module along a first direction and connected with corresponding bonding pads on the circuit carrier board, so that a receptacle is defined between the inductor module and the circuit carrier board for accommodating the semiconductor module.

Abstract translation: 电力转换模块包括电路载板，半导体模块和电感模块。 电路载板具有多个接合焊盘。 半导体模块设置在电路承载板的第一表面上。 电感器模块具有多个引脚。 引脚沿着第一方向从电感器模块延伸并与电路载体板上的对应焊盘连接，使得在电感器模块和电路载体板之间限定容纳半导体模块的插座。

公开(公告)号：US20120019343A1

公开(公告)日：2012-01-26

申请号：US13179884

申请日：2011-07-11

Applicant: Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu

Inventor： Roger Hsieh ,  Cheng-Chang Lee ,  Chun-Tiao Liu

IPC: H01F5/04 ,  H01F5/00

CPC classification number: B65D83/206 ,  H01F17/0013 ,  H01F17/04

Abstract: A coil device includes a first coil pattern, a second coil pattern, an insulating layer, a magnetic covering element and a number of conductive pillars. The second coil pattern is disposed above the first coil pattern, and is spaced apart from the first coil pattern. The insulating layer covers the first coil pattern and the second coil pattern and defines an opening surrounded by the first coil pattern and the second coil pattern. The magnetic covering element covers the insulating layer and extends into the opening. The conductive pillars are disposed within the magnetic covering element and are exposed from a bottom side of the magnetic covering element. A portion of the conductive pillars are electrically connected to the first coil pattern, and another portion of the conductive pillars are connected to the second coil pattern. The coil device can be easily manufactured.

Abstract translation: 线圈装置包括第一线圈图案，第二线圈图案，绝缘层，磁性覆盖元件和多个导电柱。 第二线圈图案设置在第一线圈图案之上，并且与第一线圈图案间隔开。 绝缘层覆盖第一线圈图案和第二线圈图案，并且限定由第一线圈图案和第二线圈图案包围的开口。 磁性覆盖元件覆盖绝缘层并延伸到开口中。 导电柱设置在磁性覆盖元件内并从磁性覆盖元件的底侧露出。 导电柱的一部分电连接到第一线圈图案，并且导电柱的另一部分连接到第二线圈图案。 线圈装置可以容易地制造。

公开(公告)号：US20120014079A1

公开(公告)日：2012-01-19

申请号：US13185573

申请日：2011-07-19

Applicant: Da-Jung CHEN ,  Chau-Chun WEN ,  Chun-Tiao LIU

Inventor： Da-Jung CHEN ,  Chau-Chun WEN ,  Chun-Tiao LIU

IPC: H05K7/00 ,  H05K7/18

CPC classification number: H05K1/181 ,  H01F27/027 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract translation: 提供了包括至少一个第一电子元件，第二电子元件和引线框架的电子封装结构。 第二电子元件包括具有空腔的主体。 第一电子元件设置在空腔中。 引线框架具有多个引线。 每个引线具有第一端和第二端。 至少一个引线的第一端延伸到腔体以电连接第一电子元件。

公开(公告)号：US20100182115A1

公开(公告)日：2010-07-22

申请号：US12564245

申请日：2009-09-22

Applicant: Yi-Min Huang ,  Roger Hsieh ,  Lan-Chin Hsieh ,  Tsung-Chan Wu

Inventor： Yi-Min Huang ,  Roger Hsieh ,  Lan-Chin Hsieh ,  Tsung-Chan Wu

IPC: H01F27/02

CPC classification number: H01F17/045 ,  H01F3/10

Abstract: A choke coil including a drum-core and at least one wire is provided. The drum-core includes a pillar, a first board and a second board. Two ends of the pillar are respectively connected to the first board and the second board. A material of the drum-core includes ferrous alloy. The wire has a winding portion wrapped around the pillar.

Abstract translation: 提供包括鼓芯和至少一根线的扼流线圈。 鼓芯包括支柱，第一板和第二板。 柱的两端分别连接到第一板和第二板。 鼓芯的材料包括铁合金。 电线具有缠绕在支柱上的缠绕部分。

公开(公告)号：US20100134937A1

公开(公告)日：2010-06-03

申请号：US12509484

申请日：2009-07-26

Applicant: CHUNG-HSIUNG WANG ,  Hung-Ming LIN ,  Kuo-Shu CHEN ,  Wen-Shiang LUO

Inventor： CHUNG-HSIUNG WANG ,  Hung-Ming LIN ,  Kuo-Shu CHEN ,  Wen-Shiang LUO

IPC: H02H9/00 ,  B44C1/22 ,  C25D5/02

CPC classification number: C25D5/022

Abstract: An over-voltage protection device and a method for manufacturing the over-voltage protection device are provided. The over-voltage protection device includes a substrate, a pair of electrode layers, a mask layer, and a sealing layer. The electrode layers are disposed on the substrate, and a gap is formed between the electrode layers. The mask layer is disposed over the gap and a portion of the electrode layers. The sealing layer covers the mask layer and the gap.

Abstract translation: 提供了一种过电压保护装置和用于制造过电压保护装置的方法。 过电压保护装置包括基板，一对电极层，掩模层和密封层。 电极层设置在基板上，并且在电极层之间形成间隙。 掩模层设置在间隙和电极层的一部分之上。 密封层覆盖掩模层和间隙。

公开(公告)号：US20090207574A1

公开(公告)日：2009-08-20

申请号：US12143143

申请日：2008-06-20

Applicant: Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

Inventor： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H01F27/027 ,  H01F27/29 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H05K3/30 ,  H05K3/3421 ,  H05K9/00 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49071 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract translation: 提供了包括至少一个第一电子元件，第二电子元件和引线框架的电子封装结构。 第二电子元件包括具有空腔的主体。 第一电子元件设置在空腔中。 引线框架具有多个引线。 每个引线具有第一端和第二端。 至少一个引线的第一端延伸到腔体以电连接第一电子元件。

公开(公告)号：US07411278B2

公开(公告)日：2008-08-12

申请号：US11336973

申请日：2006-01-23

Applicant: Chau Chun Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

Inventor： Chau Chun Wen ,  Da-Jung Chen ,  Chun-Liang Lin ,  Chih-Chan Day

IPC: H01L23/552

CPC classification number: H01L23/3107 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: The present invention provides a package device for reducing the electromagnetic/radio frequency interference, which includes a first substrate with a shielding structure on the under surface of the first substrate, and an insulating layer on the shielding structure. The first substrate includes a through hole that is filled with the conductor therein. A plurality of lead-frames located on the bottom surface of the first substrate. A second substrate located above between the two lead-frames. Then, the molding compound encapsulated to cover the above structures to form a package device. Therefore, the shielding path of the package device is constructed of the plurality of lead-frames, the conductor within the first substrate, the shielding structure, and the grounded to discharge the electromagnetic/radio frequency out of the package device, thus, the electromagnetic/radio frequency interference for the package device can be reduced.

Abstract translation: 本发明提供了一种用于减小电磁/射频干扰的封装装置，其包括在第一基板的下表面上具有屏蔽结构的第一基板和屏蔽结构上的绝缘层。 第一基板包括在其中填充有导体的通孔。 位于第一基板的底表面上的多个引线框架。 位于两个引线框之间的第二基板。 然后，封装以覆盖上述结构的模塑料形成包装装置。 因此，封装器件的屏蔽路径由多个引线框架，第一基板内的导体，屏蔽结构构成，并且接地以将电磁/射频放出封装器件，因此，电磁 可以减少封装器件的射频干扰。

公开(公告)号：US20040228097A1

公开(公告)日：2004-11-18

申请号：US10437183

申请日：2003-05-14

Applicant: Cyntec Co., Ltd.

Inventor： Da-Jung Chen ,  Chin-Hsiung Liao

IPC: H05K007/20

CPC classification number: H01L23/3735 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A high-density power module package wherein the circuits and a part of chips of the power module are formed on respective substrates such that the circuit patterns are not influenced by the chips. Accordingly, the density of the circuit can be improved so as to save the required area of substrate and production cost.

Abstract translation: 一种高密度功率模块封装，其中电路和功率模块的芯片的一部分形成在各个基板上，使得电路图案不受芯片的影响。 因此，可以提高电路的密度，以节省基板所需的面积和生产成本。