Abstract:
A system involving an active (i.e. electrical) technique for the verification of: 1) close tolerance mechanical alignment between two component, and 2) electrical contact between mating through an elastomeric interface. For example, the two components may be an alumina carrier and a printed circuit board, two mating parts that are extremely small, high density parts and require alignment within a fraction of a mil, as well as a specified interface point of engagement between the parts. The system comprises pairs of conductive structures defined in the surfaces layers of the alumina carrier and the printed circuit board, for example. The first pair of conductive structures relate to item (1) above and permit alignment verification between mating parts. The second pair of conductive structures relate to item (2) above and permit verification of electrical contact between mating parts.
Abstract:
A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact. One end of the contact is located at a via in the lower circuit board and soldered to a pad near the via. The top surface of the contact rests against a via of the facing printed circuit board.
Abstract:
An adapter for interfacing a tester with the leads of a dual-flatpack or quad-flatpack is disclosed herein. The adapter includes lengths of a conductive elastomer for making electrical contact with the rows of leads extending from the flatpack. The lengths of conductive elastomer are each located within a slot formed in a body of the adapter and are exposed within a depression in the adapter, where the width and length of the depression correspond to the width and length of the flatpack. The adapter is frictionally secured to the flatpack when the adapter is pressed onto the flatpack. The resilient conductive elastomer makes reliable contact to the leads of the flatpack.
Abstract:
There is provided a connecting structure for electronic equipment which is capable of preventing the destruction of on-board ICs and the like due to static electricity and capable of preventing the contamination of electrode pads to maintain a satisfactory conducting performance. The structure includes a groove provided on a holder section on a substrate housed in a card; a plurality of electrode pads provided at the bottom of the groove; and a rubber connector provided on a mating apparatus, which can be electrically connected to the plurality of electrode pads and which employs conductive rubber. The structure also comprises a plurality of projections projecting inwardly in the groove at fixed intervals on both side walls of the groove and at the positions facing each other on both side walls of the groove.
Abstract:
A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted on the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.
Abstract:
A conductive elastomeric element electronic connector assembly in which a plurality of conductive elastomeric connector elements are held in openings in a connector element carrier positioned between a pair of spaced substrates having contact pads which are to be connected together electrically. Each connector element has a volume within the confines of the opening in which it is held which is less than the volume of the opening, so that upon axial compression of the connector element, which occurs as the substrates are brought together to establish contact between the contact pads and the ends of the connector elements, the connector elements can deflect and expand into the extra space in the openings in which they are held.
Abstract:
A stepped multilayer Printed Wiring Board (PWB) (10), having an increased number of wiring paths in selected regions, is comprised of a main multilayer PWB (12) having a sufficient number of layers (12.sub.1,12.sub.2,12.sub.3 . . . 12.sub.n) to provide the lowest number of wiring paths required anywhere on the board. In regions where a larger number of wiring paths are required, a secondary, multilayer PWB section (22), having a sufficient number of layers (22.sub.1,22.sub.2,22.sub.3) to provide the required additional number of wiring paths, is connected to the main PWB by a layer of anisotropically conductive material (30) sandwiched therebetween. A plurality of mechanical fasteners (33,33'), typically bifurcated or heat-staked plastic pins, extends through the secondary PWB section and the main PWB to hold one to the other.
Abstract:
A conductive pattern board that comprises an electric insulation member and a plurality of electric conductive patterns. The patterns are formed on the insulation member. A recess is formed on the insulation member and between every two adjacent patterns.
Abstract:
A method of fabricating a printed wiring substrate board to have integral contacts over the thickness of a defined connector edge in order to allow for perpendicular mating to exposed conductors on the surface of a second substrate.
Abstract:
An integral composite structure having predetermined electrically conductive networks on a non-conductive planar or non-planar support structure produced by the combination of a slurry of electrically conductive materials having a fluid carrier which includes an evaporative fluid and an elastomeric substance in which particles of an electrically conductive material are contained, the fluid carrier being chemically reactive with the material forming the relatively non-conductive support structure to secure one to the other, and upon evaporation of the evaporative portion of the fluid carrier, the unevaporated portion of the slurry formed of the elastomeric substance and the electrically conductive particles form a solid which is both flexible and electrically conductive and a method for producing same, including the steps of introducing the slurry into a container, the container having at least a portion of the wall forming the container consisting of an elastomeric material having at least one normally closed orifice therein arranged in a desired pattern, which without the application of pressure to the slurry remains closed, juxtapositioning the wall having the orifice therein relative to the support structure upon which the slurry is desired to be deposited upon, pressurizing the slurry within the container to force the slurry through the normally closed orifice with sufficient pressure to force the slurry into inlet of the orifice passageway in the elastomeric material, displacing the elastomeric material surrounding the orifice and thereby opening the normally closed orifice and causing the slurry to flow through the orifice and to exit the orifice outlet, depositing the slurry exiting from the outlet of said at least one orifice onto the electrically non-conductive support structure in the desired pattern, allowing the slurry to chemically react with the material forming the support structure and to create a bond therebetween, and then evaporating the fluid carrier to leave a flexible, solid residue which is electrically conductive and is integrally secured to the support structure to form an integral composite structure having predetermined electrically conductive networks.