COMPOSITION, MAGNETIC PARTICLE-CONTAINING CURED SUBSTANCE, MAGNETIC PARTICLE-INTRODUCED SUBSTRATE, AND ELECTRONIC MATERIAL

    公开(公告)号:US20230220231A1

    公开(公告)日:2023-07-13

    申请号:US18187743

    申请日:2023-03-22

    Inventor: Tetsushi MIYATA

    CPC classification number: C09D133/08 H01F1/28 C08K2201/01 C08K3/11

    Abstract: A first object of the present invention is to provide a composition having excellent fluidity and capable of forming a cured substance having excellent magnetic properties and excellent filling suitability. A second object of the present invention is to provide a magnetic particle-containing cured substance formed of the composition. A third object of the present invention is to provide a magnetic particle-introduced substrate and an electronic material that contain the magnetic particle-containing cured substance.
    The composition according to an embodiment of the present invention is a composition containing



    magnetic particles,
    one or more components selected from the group consisting of a resin and a resin precursor,
    a solvent,
    in which a content of magnetic particles having a primary particle diameter of 4 m or more is 25% by mass or less with respect to a total mass of the magnetic particles,
    a content of the magnetic particles is 91% by mass or more with respect to a total solid content of the composition, and
    a content of the solvent is 3% to 24% by mass with respect to a total mass of the composition.

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