Apertures for flat optical devices
    154.
    发明授权

    公开(公告)号:US12044821B2

    公开(公告)日:2024-07-23

    申请号:US16877158

    申请日:2020-05-18

    CPC classification number: G02B1/002 G03F7/0002

    Abstract: Embodiments described herein relate to methods for fabricating optical devices. The methods described herein enable the fabrication of one or more optical devices on a substrate with apertures surrounding each of the optical devices having a plurality of structures. One embodiment of the methods described herein includes disposing an aperture material layer on a surface of a substrate, disposing a structure material layer over the apertures and the surface of the substrate, disposing a hardmask over the apertures and the structure material layer, disposing a patterned photoresist over the hardmask, the patterned photoresist defining exposed hardmask portions, removing the exposed hardmask portions to expose structure portions of the structure material layer, and removing the structure portions to form a plurality of structures between the apertures over regions of the surface of the substrate.

    Full-field metrology tool for waveguide combiners and meta-surfaces

    公开(公告)号:US12019242B2

    公开(公告)日:2024-06-25

    申请号:US17876195

    申请日:2022-07-28

    CPC classification number: G02B27/0172 G02B27/0176

    Abstract: Embodiments described herein provide for metrology tools and methods of obtaining a full-field optical field of an optical device to determine multiple metrology metrics of the optical device. A metrology tool is utilized to split a light beam into a first light path and a second light path. The first light path and the second light path are combined into a combined light beam and delivered to the detector. The detector measures the intensity of the combined light beam. A first equation and second equation are utilized in combination with the intensity measurements to determine an amplitude and phase ψ at a reference point directly adjacent to a second surface of the at least one optical device.

    Fabrication of diffractive optic element having a variable refractive index profile by inkjet printing deposition

    公开(公告)号:US11867931B2

    公开(公告)日:2024-01-09

    申请号:US17448619

    申请日:2021-09-23

    CPC classification number: G02B5/1857 G03F7/0005 G03F7/16

    Abstract: Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to optical devices and methods of manufacturing optical devices having optical device structures with at least one of varying depths or refractive indices across the surface of a substrate. According to certain embodiments, an inkjet process is used to deposit a volumetrically variable optical device that is etched to form a diffractive optic element (DOE). Volumetrically variable can relate to the thickness of the optical device, or the relative volume of two or more diffractive materials deposited in combination. According to other embodiments, a single-profile DOE is deposited on a substrate and an inkjet process deposits a volumetrically variable organic material over the DOE. The DOE and organic material are etched to modify the profile of the structure, after which the organic material is removed, leaving the modified-profile DOE.

    Maskless lithography method to fabricate topographic substrate

    公开(公告)号:US11669012B2

    公开(公告)日:2023-06-06

    申请号:US16798261

    申请日:2020-02-21

    CPC classification number: G03F7/0005 G03F7/0043 G03F7/038 G03F7/2022

    Abstract: In one embodiment, a method of fabricating a device having at least two features of differing heights comprises: depositing a resist over a substrate; determining a topography pattern for the at least two features of the device; determining an exposure pattern for the at least two features of the device; exposing a first area of the resist with a first dose of light, the first area corresponding to a first feature of the at least two features; exposing a second area of the resist with a second dose of light that is different from the first dose of light, the second area corresponding to a second feature of the at least two features; and developing the resist.

    Minimal contact gripping of thin optical devices

    公开(公告)号:US11524392B2

    公开(公告)日:2022-12-13

    申请号:US17237533

    申请日:2021-04-22

    Abstract: Embodiments described herein provide for devices and methods for retaining optical devices. The devices and methods described herein provide for retention of the substrate without contacting sensitive portions of the substrate. The devices and methods utilize retention pads or vacuum pins to contact the exclusion zones i.e., inactive areas of the substrate to retain the substrate and prevent the substrate from moving laterally. Additionally, a holding force retains the substrate in the vertical direction, without contacting the substrate. The methods provide for adjusting the devices to account for multiple geometries of the substrate. The methods further provide for adjusting the devices, such as adjusting a gap between the optical device and a suction pad, to alter the holding force of the devices on the optical devices.

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