GALLIUM AND NITROGEN CONTAINING LASER DEVICE HAVING CONFINEMENT REGION
    157.
    发明申请
    GALLIUM AND NITROGEN CONTAINING LASER DEVICE HAVING CONFINEMENT REGION 有权
    含有配位区域的激光装置的玻璃和氮化物

    公开(公告)号:US20150111325A1

    公开(公告)日:2015-04-23

    申请号:US14480398

    申请日:2014-09-08

    Abstract: In an example, the present invention provides a method for fabricating a laser diode device. The method includes providing a gallium and nitrogen containing substrate member comprising a surface region, a release material overlying the surface region, an n-type gallium and nitrogen containing material; an active region overlying the n-type gallium and nitrogen containing material, a p-type gallium and nitrogen containing material; and a first transparent conductive oxide material overlying the p-type gallium and nitrogen containing material, and an interface region overlying the first transparent conductive oxide material. The method includes bonding the interface region to a handle substrate and subjecting the release material to an energy source to initiate release of the gallium and nitrogen containing substrate member.

    Abstract translation: 在一个实例中,本发明提供一种制造激光二极管器件的方法。 该方法包括提供包含表面区域,覆盖表面区域的剥离材料,含n型镓和氮的材料的含镓和氮的衬底构件; 覆盖n型含镓和氮的材料的有源区,p型含镓和氮的材料; 以及覆盖所述p型含镓和氮的材料的第一透明导电氧化物材料以及覆盖所述第一透明导电氧化物材料的界面区域。 该方法包括将界面区域结合到手柄基板上,并将释放材料经受能量源以引发含镓和氮的衬底构件的释放。

    Manufacturable laser diode formed on c-plane gallium and nitrogen material

    公开(公告)号:US10903625B2

    公开(公告)日:2021-01-26

    申请号:US16586100

    申请日:2019-09-27

    Abstract: A method for manufacturing a laser diode device includes providing a substrate having a surface region and forming epitaxial material overlying the surface region, the epitaxial material comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active layer region. The epitaxial material is patterned to form a plurality of dice, each of the dice corresponding to at least one laser device, characterized by a first pitch between a pair of dice, the first pitch being less than a design width. Each of the plurality of dice are transferred to a carrier wafer such that each pair of dice is configured with a second pitch between each pair of dice, the second pitch being larger than the first pitch.

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