公开(公告)号：US5317479A

公开(公告)日：1994-05-31

申请号：US130532

申请日：1993-10-01

Applicant: Deepak K. Pai ,  Terrance A. Krinke

Inventor： Deepak K. Pai ,  Terrance A. Krinke

IPC: H01L23/043 ,  H01L23/498 ,  H01R12/57 ,  H05K1/02 ,  H05K3/34 ,  H05K3/36 ,  H05K13/00 ,  H05K13/04 ,  H01R9/00

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L23/49861 ,  H05K13/0092 ,  H05K13/0465 ,  H05K3/3426 ,  H01F2027/295 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10727 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2201/10946 ,  H05K2201/10984 ,  H05K2203/107 ,  H05K3/36 ,  Y02P70/613 ,  Y10T29/49126

Abstract: A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit board, to a chip carrier or to a multiple-chip module. The curved lead is substantially entirely plated with solder and is formed of a single piece of conductive material. The curved lead has a first surface for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact. The first and second surfaces are connected by at least one curved portion and are arranged to mount the circuit chip to the circuit board with the solder in a compliant, generally parallel arrangement substantially free of stress.

Abstract translation: 弯曲的引线提供电路板上的电路板触点与与电路芯片相关联的芯片触点之间的机械和电连接。 芯片可以安装到电路板，芯片载体或多芯片模块。 弯曲的引线基本上完全用焊料电镀并且由单片导电材料形成。 弯曲引线具有用于连接到芯片触点的第一表面和大致平行于第一表面的第二表面，用于连接到板触点。 第一表面和第二表面通过至少一个弯曲部分连接，并且被布置成将电路芯片安装到电路板上，焊料以基本上没有应力的顺从的大致平行布置。

公开(公告)号：US5294039A

公开(公告)日：1994-03-15

申请号：US061842

申请日：1993-05-14

Applicant: Deepak K. Pai ,  Terrance A. Krinke

Inventor： Deepak K. Pai ,  Terrance A. Krinke

IPC: H01L23/043 ,  H01L23/498 ,  H01R12/57 ,  H05K1/02 ,  H05K3/34 ,  H05K3/36 ,  H05K13/00 ,  H05K13/04

CPC classification number: H01R12/57 ,  H01L23/49811 ,  H01L23/49861 ,  H05K13/0092 ,  H05K13/0465 ,  H05K3/3426 ,  H01F2027/295 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10727 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2201/10946 ,  H05K2201/10984 ,  H05K2203/107 ,  H05K3/36 ,  Y02P70/613 ,  Y10T29/49126

Abstract: A curved lead provides a mechanical and electrical connection between a board contact on a circuit board and a chip contact associated with a circuit chip. The chip can be mounted to the circuit board, to a chip carrier or to a multiple-chip module. The curved lead is substantially entirely plated with solder and is formed of a single piece of conductive material. The curved lead has a first surf ace for connection to the chip contact and a second surface, generally parallel to the first surface, for connection to the board contact. The first and second surfaces are connected by at least one curved portion and are arranged to mount the circuit chip to the circuit board with the solder in a compliant, generally parallel arrangement substantially free of stress.

Abstract translation: 弯曲的引线提供电路板上的电路板触点与与电路芯片相关联的芯片触点之间的机械和电连接。 芯片可以安装到电路板，芯片载体或多芯片模块。 弯曲的引线基本上完全用焊料电镀并且由单片导电材料形成。 弯曲引线具有用于连接到芯片触点的第一冲浪和大体平行于第一表面的第二表面，用于连接到板触点。 第一表面和第二表面通过至少一个弯曲部分连接，并且布置成将电路芯片安装到电路板上，其中焊料以基本上没有应力的顺从的大致平行布置。

公开(公告)号：US5199907A

公开(公告)日：1993-04-06

申请号：US900644

申请日：1992-06-18

Applicant: Ronald P. Jansen ,  Mark R. Thumma

Inventor： Ronald P. Jansen ,  Mark R. Thumma

IPC: H01R4/02 ,  H01R12/58 ,  H05K3/30

CPC classification number: H01R12/58 ,  H05K3/308 ,  H01R4/028 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10878

Abstract: An electrical connector (10) wherein the contacts (32, 34) have tail portions (40, 46) extending into respective holes (18) of a printed circuit board (16). The tail portions are gently curved, which provides a centering of the distal ends (48, 56) of the tail portions over the respective circuit board holes and also results in a low insertion force. Retention is provided by friction of the tail portions against the walls of the holes. The gentle curve of the tail portions keeps them close to the walls of the respective holes so that when a surface mount solder process is utilized, each tail portion provides a wicking action to concentrate the small amount of solder which is available in the region where the tail portion is close to the wall, resulting in a strong mechanical and electrical solder joint without requiring the hole to filled with solder. Also, minimum vibration is generated when the tail portions are inserted into the holes so that other temporarily retained components on the board are not displaced.

Abstract translation: 一种电连接器（10），其中所述触头（32,34）具有延伸到印刷电路板（16）的相应孔（18）中的尾部（40,46）。 尾部（40,46）轻轻地弯曲，其提供尾部（40,46）的远端（48,66）的中心位于相应的电路板孔（18）上并且还导致低插入 力。 通过尾部（40,46）抵靠孔（18）的壁的摩擦来提供保持力。 尾部（40,46）的平缓曲线使它们靠近相应孔（18）的壁，使得当使用表面贴装焊料进料时，每个尾部（40,46）提供芯吸作用以集中 在尾部（40,46）靠近壁的区域中可获得的少量焊料，导致强的机械和电焊接，而不需要孔填充焊料。

公开(公告)号：US5177326A

公开(公告)日：1993-01-05

申请号：US779909

申请日：1991-10-21

Applicant: Kurt R. Goldhammer

Inventor： Kurt R. Goldhammer

IPC: H01L21/48 ,  H01L21/68 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L21/6835 ,  H01L21/4842 ,  H01L21/4853 ,  H01L23/49811 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10727 ,  H05K2201/10757 ,  H05K2201/10924 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49147

Abstract: A lead wire array for a leadless chip carrier which functions to mount and electrically interconnect a leadless chip carrier to a printed wiring board. The array is formed from a length of bare wire which is appropriately folded and bent to provide interconnections between the contact pads on the leadless chip carrier and contact pads on the printed wiring board, which are then separated by removing portions of the lead wire array after its attachment to the leadless chip carrier.

Abstract translation: 一种用于无引线芯片载体的引线阵列，其用于将无引线芯片载体安装并电连接到印刷线路板。 阵列由裸线形成，其被适当地折叠和弯曲，以在无引线芯片载体上的接触焊盘和印刷线路板上的接触焊盘之间提供互连，然后通过去除引线阵列的部分之后被去除 其连接到无引线芯片载体。

公开(公告)号：US4897051A

公开(公告)日：1990-01-30

申请号：US167050

申请日：1988-03-11

Applicant: Donald J. Kasprzyk

Inventor： Donald J. Kasprzyk

IPC: H01H1/58 ,  H01H71/16 ,  H01H73/30 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30

CPC classification number: H01H1/5822 ,  H05K3/308 ,  H01H71/164 ,  H01H73/30 ,  H05K1/0271 ,  H05K1/115 ,  H05K2201/068 ,  H05K2201/10295 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: A flexible electrical connection for use in mounting electrical components to provide three dimensional flexiblity without allowing short circuiting or adverse temperature response which comprises thin and flat conductor leads shaped and bent to form relatively long flat extension portions which are bendable and twistable to permit flexibility in each of the desired directions.

Abstract translation: 用于安装电气部件以提供三维柔性的柔性电连接，以提供短路或不利的温度响应，其包括成形和弯曲的扁平和扁平的导体引线，以形成相对较长的扁平延伸部分，该扁平延伸部分可弯曲和可扭曲，以允许每个 的所需方向。

公开(公告)号：US4785990A

公开(公告)日：1988-11-22

申请号：US891557

申请日：1986-07-29

Applicant: Kunikazu Nakahara ,  Kazuhiro Yasuda

Inventor： Kunikazu Nakahara ,  Kazuhiro Yasuda

IPC: H01G4/228 ,  H05K3/30 ,  B23K31/02

CPC classification number: H01G4/228 ,  H05K3/308 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  Y10T29/49121

Abstract: An electronic component with lead terminals, includes an electronic component element, electrodes respectively formed on opposite end faces of the electronic component element, and lead terminals respectively connected to the electrodes for electrical conduction, and each of the lead terminals having a large width portion formed at one end of its small width tip portion, and the large width portions of the lead terminals being conductively connected to the electrodes of the electronic component element. The disclosure is also directed to a method of manufacturing such electronic component.

Abstract translation: 具有引线端子的电子部件包括电子部件元件，分别形成在电子元件的相对端面上的电极和分别与电极连接的导电端子，导电端子形成为宽度大的部分 在其小宽度尖端部分的一端处，并且引线端子的大宽度部分导电地连接到电子元件的电极。 本公开还涉及制造这种电子部件的方法。

公开(公告)号：US4769908A

公开(公告)日：1988-09-13

申请号：US58101

申请日：1987-06-04

Applicant: Billy E. Olsson

Inventor： Billy E. Olsson

IPC: H01R43/16 ,  H05K1/14

CPC classification number: H01R43/16 ,  H05K1/148 ,  H05K1/144 ,  H05K2201/10386 ,  H05K2201/10424 ,  H05K2201/10757 ,  Y10T29/49121 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: A method of producing a plurality of electrical terminals (28) which are in the form of a continuous strip is disclosed. At least one web of insulation material (20) is molded over the terminals (28), so that the insulation material (20) completely surrounds and tightly engages each terminal (28). This method insures that the terminals (28) will be accurately and precisely maintained in position by the insulation material (10). Consequently, the web of insulation material (10) can act as a carrier strip as other operations are performed on terminals (28).

Abstract translation: 公开了一种制造多个电连接带形式的电端子（28）的方法。 在端子（28）上模制绝缘材料（20）的至少一个腹板，使得绝缘材料（20）完全包围并紧密接合每个端子（28）。 该方法确保端子（28）将被绝缘材料（10）准确且精确地保持在适当的位置。 因此，当在端子（28）上执行其它操作时，绝缘材料（10）的腹板可以用作载体带。

公开(公告)号：US4739125A

公开(公告)日：1988-04-19

申请号：US907006

申请日：1986-09-15

Applicant: Yutaka Watanabe ,  Fumiyuki Kobayashi ,  Masao Sekibata ,  Shigeo Kuroda ,  Akio Yasukawa ,  Shigejiro Sekine

Inventor： Yutaka Watanabe ,  Fumiyuki Kobayashi ,  Masao Sekibata ,  Shigeo Kuroda ,  Akio Yasukawa ,  Shigejiro Sekine

IPC: H01L23/50 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01L23/49555 ,  H01L23/49811 ,  H05K3/3426 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10757 ,  H05K2201/10946 ,  Y02P70/613

Abstract: An electric component part has its lead terminals bent in thickness directions in a middle section thereof at least two positions so that a step section virtually in parallel to the bottom of a circuit substrate is formed with the intention of absorbing the external force applied to the part by chaging the shape of the lead terminals. Increase in the part layout area due to the formation of the horizontal step section can be avoided, when necessary, by shifting the terminal lead out position on the component part inward thereby to minimize the jetty dimensions.

Abstract translation: 电气部件的导线端子在其中间部分的至少两个位置处具有在厚度方向上弯曲的引线端子，从而形成与电路基板的底部实际上平行的台阶部分，其目的是吸收施加到部件的外力 通过跟踪引线端子的形状。 当需要时，可以避免由于形成水平台阶部而导致的部件布局区域的增加，通过将部件部件上的端子引出位置向内移位，从而使喷射尺寸最小化。

公开(公告)号：US3524108A

公开(公告)日：1970-08-11

申请号：US3524108D

申请日：1967-12-26

Applicant: CTS CORP

Inventor： ENGLISH JACK A

IPC: H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K7/06 ,  H05K7/12

CPC classification number: H05K3/306 ,  H05K3/308 ,  H05K3/32 ,  H05K3/3447 ,  H05K2201/09827 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2201/10757 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/2036

公开(公告)号：US3058037A

公开(公告)日：1962-10-09

申请号：US79380459

申请日：1959-02-17

Applicant: BURROUGHS CORP

Inventor： NAAB GERARD A ,  SARLO JR FRANK J

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K1/0271 ,  H05K1/18 ,  H05K3/3447 ,  H05K2201/068 ,  H05K2201/10522 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/1446