公开(公告)号：US09986650B2

公开(公告)日：2018-05-29

申请号：US14528527

申请日：2014-10-30

申请人： Heraeus Precious Metals North America Conshohocken LLC

发明人： Samson Shahbazi ,  Steven Grabey

IPC分类号： H01B1/22 ,  H05K3/34 ,  B23K35/30 ,  B23K35/362 ,  B23K35/36 ,  B23K35/02 ,  B23K1/00 ,  B23K35/32 ,  B23K35/365

CPC分类号： H05K3/3457 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/322 ,  B23K35/3613 ,  B23K35/362 ,  B23K35/365 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/12 ,  Y10T428/31678

摘要： A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.

公开(公告)号：US09982332B2

公开(公告)日：2018-05-29

申请号：US14797344

申请日：2015-07-13

申请人： Roland D. Seals

发明人： Roland D. Seals

IPC分类号： C23C4/10 ,  C23C16/38 ,  B23K35/32 ,  B23K35/34 ,  C01B35/04 ,  C23C10/30 ,  C23C12/02 ,  C23C18/08 ,  C23C18/12 ,  C23C4/134 ,  C23C24/08 ,  C23C4/067 ,  C22F1/18

CPC分类号： C23C4/10 ,  B23K35/325 ,  B23K35/327 ,  B23K35/34 ,  C01B35/04 ,  C22F1/183 ,  C23C4/067 ,  C23C4/134 ,  C23C10/30 ,  C23C12/02 ,  C23C16/38 ,  C23C18/08 ,  C23C18/1204 ,  C23C18/1241 ,  C23C18/1275 ,  C23C24/085

摘要： The present disclosure relates generally to hardface coating systems and methods for metal alloys and other materials for wear and corrosion resistant applications. More specifically, the present disclosure relates to hardface coatings that include a network of titanium monoboride (TiB) needles or whiskers in a matrix, which are formed from titanium (Ti) and titanium diboride (TiB2) precursors by reactions enabled by the inherent energy provided by the process heat associated with coating deposition and, optionally, coating post-heat treatment. These hardface coatings are pyrophoric, thereby generating further reaction energy internally, and may be applied in a functionally graded manner. The hardface coatings may be deposited in the presence of a number of fluxing agents, beta stabilizers, densification aids, diffusional aids, and multimode particle size distributions to further enhance their performance characteristics.

公开(公告)号：US09909428B2

公开(公告)日：2018-03-06

申请号：US14090871

申请日：2013-11-26

申请人： General Electric Company

发明人： Srikanth Chandrudu Kottilingam ,  Surinder Singh Pabla ,  Brian Lee Tollison

IPC分类号： F01D5/14 ,  F01D5/20 ,  B23K35/32 ,  F01D5/28 ,  F01D11/12 ,  B23K26/342 ,  B23K26/0622 ,  C23C28/00 ,  B22F3/105 ,  B22F5/04 ,  B29C64/153 ,  B23K101/00 ,  B23K103/08 ,  B23K101/34 ,  B23K103/16 ,  B23K103/18 ,  C22C32/00

CPC分类号： F01D5/20 ,  B22F3/1055 ,  B22F5/04 ,  B23K26/0622 ,  B23K26/342 ,  B23K35/327 ,  B23K2101/001 ,  B23K2101/34 ,  B23K2103/08 ,  B23K2103/16 ,  B23K2103/26 ,  B29C64/153 ,  C22C32/0047 ,  C22C32/0057 ,  C23C28/30 ,  F01D5/28 ,  F01D5/288 ,  F01D11/12 ,  F05D2300/175 ,  F05D2300/226 ,  F05D2300/2282 ,  F05D2300/506 ,  Y02P10/295 ,  Y10T29/49337

摘要： Turbine buckets include a pressure side, a suction side opposite the pressure side, and a bucket squealer tip attached to the pressure side and the suction side. The bucket squealer tip includes a plurality of high hot hardness shroud-cutting deposits deposited on its exterior surface that have a hardness of at least about 1100 kg mm−2 and a melting temperature of at least about 1500° C.

公开(公告)号：US09849532B2

公开(公告)日：2017-12-26

申请号：US14303205

申请日：2014-06-12

申请人： Qingjun Zheng ,  Robert J. Vasinko ,  Yixiong Liu

发明人： Qingjun Zheng ,  Robert J. Vasinko ,  Yixiong Liu

IPC分类号： B32B15/01 ,  C22C19/05 ,  B23K1/19 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/32 ,  B23K35/36 ,  B22F7/08 ,  C22C1/10 ,  C22C32/00 ,  C22C29/04 ,  C22C29/14 ,  C22C29/16 ,  C22C33/02

CPC分类号： B23K1/0008 ,  B22F7/08 ,  B22F2998/10 ,  B22F2999/00 ,  B23K1/19 ,  B23K35/0222 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/0255 ,  B23K35/30 ,  B23K35/3033 ,  B23K35/3046 ,  B23K35/3053 ,  B23K35/3066 ,  B23K35/327 ,  B23K35/36 ,  B32B15/01 ,  B32B15/013 ,  C22C1/1036 ,  C22C29/04 ,  C22C29/14 ,  C22C29/16 ,  C22C32/0047 ,  C22C33/0228 ,  C22C33/0242 ,  C22C33/0292 ,  Y10T428/12104 ,  B22F1/0062 ,  C22C1/1015

摘要： A composite wear pad includes a substrate that is selected from the group of iron based alloys, steel, nickel based alloys, and cobalt based alloys. A hard particle-matrix alloy layer is bonded at a surface to the substrate. The hard particle-matrix alloy layer has a plurality of hard particles dispersed in a matrix alloy. The hard particle-matrix alloy layer has a thickness ranging between greater than about 13 millimeters and about 20 millimeters.

公开(公告)号：US09812421B2

公开(公告)日：2017-11-07

申请号：US15105707

申请日：2014-12-04

申请人： NIPPON STEEL & SUMIKIN MATERIALS CO., LTD. ,  NIPPON MICROMETAL CORPORATION

发明人： Tomohiro Uno ,  Yoshiaki Hagiwara ,  Tetsuya Oyamada ,  Daizo Oda

IPC分类号： H01L23/48 ,  H01L23/00 ,  C22C5/06 ,  C22C5/08 ,  C22C9/06 ,  B23K35/30 ,  B23K35/32

CPC分类号： H01L24/45 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/322 ,  C22C5/06 ,  C22C5/08 ,  C22C9/06 ,  H01L24/43 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45005 ,  H01L2224/45015 ,  H01L2224/45032 ,  H01L2224/45101 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45541 ,  H01L2224/45572 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/4809 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85444 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/013 ,  H01L2924/10253 ,  H01L2924/206 ,  H01L2924/386 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/2076 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01004 ,  H01L2924/01204 ,  H01L2924/01033 ,  H01L2924/01203

摘要： Provided is a bonding wire capable of reducing the occurrence of defective loops. The bonding wire includes: a core material which contains more than 50 mol % of a metal M; an intermediate layer which is formed over the surface of the core material and made of Ni, Pd, the metal M, and unavoidable impurities, and in which the concentration of the Ni is 15 to 80 mol %; and a coating layer formed over the intermediate layer and made of Ni, Pd and unavoidable impurities. The concentration of the Pd in the coating layer is 50 to 100 mol %. The metal M is Cu or Ag, and the concentration of Ni in the coating layer is lower than the concentration of Ni in the intermediate layer.

公开(公告)号：US20170296832A1

公开(公告)日：2017-10-19

申请号：US15638056

申请日：2017-06-29

申请人： MEDTRONIC, INC.

发明人： MARK BREYEN ,  TOM MILTICH ,  GORDON MUNNS

IPC分类号： A61N1/375 ,  B23K35/30 ,  B23K35/32 ,  B23K101/38

CPC分类号： A61N1/3754 ,  B23K35/3013 ,  B23K35/322 ,  B23K2101/38 ,  Y10T29/49149

摘要： A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 μm. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof

公开(公告)号：US09724524B2

公开(公告)日：2017-08-08

申请号：US13196698

申请日：2011-08-02

申请人： Mark Breyen ,  Tom Miltich ,  Gordon Munns

发明人： Mark Breyen ,  Tom Miltich ,  Gordon Munns

IPC分类号： A61N1/00 ,  A61N1/375 ,  B23K35/30 ,  B23K35/32 ,  B23K101/38

CPC分类号： A61N1/3754 ,  B23K35/3013 ,  B23K35/322 ,  B23K2101/38 ,  Y10T29/49149

摘要： A method of interconnecting a conductor and a hermetic feedthrough of an implantable medical device includes welding a lead to a pad on a feedthrough. The feedthrough includes a ceramic insulator and a via hermetically bonded to the insulator. The via includes platinum. The pad is bonded to the insulator and electrically connected to the via, includes platinum, and has a thickness of at least 50 μm. The lead includes at least one of niobium, platinum, titanium, tantalum, palladium, gold, nickel, tungsten, and oxides and alloys thereof.

公开(公告)号：US09707642B2

公开(公告)日：2017-07-18

申请号：US14071928

申请日：2013-11-05

申请人： David Peter Gerrard ,  Sayantan Roy

发明人： David Peter Gerrard ,  Sayantan Roy

IPC分类号： B23K35/02 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  B23K35/32 ,  B23K35/36

CPC分类号： B23K35/0244 ,  B23K35/26 ,  B23K35/266 ,  B23K35/268 ,  B23K35/286 ,  B23K35/302 ,  B23K35/3046 ,  B23K35/3053 ,  B23K35/32 ,  B23K35/325 ,  B23K35/3612 ,  B23K35/3613

摘要： Disclosed herein is a solder composition comprising a metal or a metal alloy; and an electrically conductive high temperature polymeric composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy. Disclosed herein too is a method comprising mixing an electrically conductive high temperature polymeric composition with a metal or a metal alloy to form the solder composition; where the electrically conductive high temperature polymeric composition is dispersed homogeneously in the metal; and where the electrically conductive high temperature polymeric composition has a higher glass transition temperature or a melting point than the flow temperature of the metal or metal alloy.

公开(公告)号：US09682531B2

公开(公告)日：2017-06-20

申请号：US14182327

申请日：2014-02-18

申请人： Consolidated Nuclear Security, LLC

发明人： Roland D. Seals ,  Edward B. Ripley ,  Russell L. Hallman

IPC分类号： B05D3/02 ,  B32B7/04 ,  B23K35/32 ,  B23K35/34 ,  C09D1/00 ,  C23C12/02 ,  C23C18/08 ,  C23C18/12 ,  C23C26/00 ,  B32B15/04

CPC分类号： B32B7/045 ,  B23K35/325 ,  B23K35/327 ,  B23K35/34 ,  B32B15/04 ,  C09D1/00 ,  C23C12/02 ,  C23C18/08 ,  C23C18/1204 ,  C23C18/1241 ,  C23C18/1275 ,  C23C26/00 ,  Y10T428/24802 ,  Y10T428/24826 ,  Y10T428/31678

摘要： Composite structures having a reinforced material interjoined with a substrate, wherein the reinforced material comprises a compound selected from the group consisting of titanium monoboride, titanium diboride, and combinations thereof.

公开(公告)号：US09673737B2

公开(公告)日：2017-06-06

申请号：US14723608

申请日：2015-05-28

申请人： Berliner Glas KGaA Herbert Kubatz GmbH & Co.

发明人： Oliver Baldus

IPC分类号： H02N13/00 ,  H01L21/683 ,  B23K35/30 ,  B23K1/00 ,  B23K35/32 ,  B23K1/19 ,  H01L21/687 ,  B23K35/40 ,  B23K35/00 ,  B23K35/02 ,  B23K35/22 ,  B23K35/24 ,  B23K101/20 ,  B23K101/40

CPC分类号： H02N13/00 ,  B23K1/00 ,  B23K1/0008 ,  B23K1/19 ,  B23K35/00 ,  B23K35/0205 ,  B23K35/0222 ,  B23K35/0238 ,  B23K35/222 ,  B23K35/24 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/325 ,  B23K35/402 ,  B23K2101/20 ,  B23K2101/40 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6875

摘要： A holding apparatus (100) for electrostatically holding a component (1), in particular a silicon wafer, includes at least one base body (10, 10A, 10B) which is composed of a first plate (11A) and a second plate (12), the first plate (11A) being arranged on an upper side (10A) of the base body (10, 10A, 10B) and the second plate are made of an electrically insulating material, a plurality of projecting, upper burls (13A) which are arranged on the upper side (10A) of the base body (10, 10A, 10B) and form a support surface for the component (1), and a first electrode which is arranged to receive a clamping voltage, wherein the first plate (11A) is made of an electrically conductive, silicon-including ceramic and forms the first electrode. A method for producing the holding apparatus (100) is also described.