WIRING CIRCUIT SUBSTRATE, SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE WIRING CIRCUIT SUBSTRATE, AND METHOD OF PRODUCING THE SEMICONDUCTOR DEVICE

    公开(公告)号:US20180166354A1

    公开(公告)日:2018-06-14

    申请号:US15835637

    申请日:2017-12-08

    Inventor: Koji IMAYOSHI

    Abstract: A wiring circuit substrate includes a glass base, insulating resin layers, wire groups, a first inorganic adhesive layer, a through electrode, and second conductive layers. The glass base has a through-hole. The insulating resin layers are laminated to the glass base and each have a conductive via formed therein. The wire groups are laminated to the insulating resin layers. The first inorganic adhesive layer is laminated to the inner surface of the through-hole. The through electrode is formed of a first conductive layer laminated to the first inorganic adhesive layer. The second conductive layers are formed on the through electrode and the glass base and electrically connected to the upper and lower ends of the through electrode. The glass base has a surface roughness Ra of 100 nm or less, and the second conductive layers each have an amount of dishing of 5 μm or less above the through electrode.

    ELECTROPLATING SOLUTION ANALYZER AND ELECTROPLATING SOLUTION ANALYSIS METHOD

    公开(公告)号:US20180106757A1

    公开(公告)日:2018-04-19

    申请号:US15843579

    申请日:2017-12-15

    CPC classification number: G01N27/42 C25D21/12 G01N27/28

    Abstract: An electroplating solution analyzer includes an analysis container for housing an electroplating solution containing additives including an accelerator and a suppressor, a working electrode that is immersed in the electroplating solution housed in the analysis container to exchange electrons therewith, a reference electrode immersed in the electroplating solution and serves as a reference for determining a potential of the working electrode, a counter electrode immersed in the electroplating solution, a rotation drive unit for rotating the working electrode at a constant speed, a current-generating unit for supplying a current with a constant current density between the working electrode and the counter electrode, a potential measuring unit for measuring a potential between the working electrode and the reference electrode, and an analyzing unit for determining a condition of the electroplating solution in one or more measurement sections at an elapsed time after the current starts to be supplied.

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