公开(公告)号：US20090309206A1

公开(公告)日：2009-12-17

申请号：US12484491

申请日：2009-06-15

Applicant: Young-Lyong KIM ,  Jong-Ho LEE ,  Cheul-Joong YOUN ,  Eun-Chul AHN

Inventor： Young-Lyong KIM ,  Jong-Ho LEE ,  Cheul-Joong YOUN ,  Eun-Chul AHN

IPC: H01L25/11

CPC classification number: H01L25/105 ,  H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package includes a first package that a first semiconductor chip is mounted on a front side of a first substrate and a redistributed pad including a first redistributed pad electrically connected to the first substrate and a second redistributed pad electrically connected to the first redistributed pad is disposed on the first semiconductor chip and a second package that a second semiconductor chip is mounted on a front side of a second substrate, the second package including a connection member electrically connected to the second redistributed pad. The connection member electrically connected to the redistributed pad electrically connects the first and second packages to each other.

Abstract translation: 半导体封装以及半导体封装的制造方法。 半导体封装包括第一封装，第一半导体芯片安装在第一基板的前侧，以及重新分布的焊盘，其包括电连接到第一基板的第一再分布焊盘和电连接到第一再分布焊盘的第二再分布焊盘 设置在第一半导体芯片上的第二封装以及第二半导体芯片安装在第二基板的正面上的第二封装，所述第二封装包括与第二再分布焊盘电连接的连接部件。 电连接到再分布垫的连接构件将第一和第二封装彼此电连接。

公开(公告)号：US20090156214A1

公开(公告)日：2009-06-18

申请号：US12316727

申请日：2008-12-16

Applicant: Joo-Hyun Lee ,  Jin-Ghoo Choi ,  Sang-Boh Yun ,  Jong-Ho Lee ,  Yong-Soo Cho ,  Jae-Kwon Kim ,  Yeong-Jun Kim ,  Kyung-Soo Woo ,  Hyun-Il Yoo

Inventor： Joo-Hyun Lee ,  Jin-Ghoo Choi ,  Sang-Boh Yun ,  Jong-Ho Lee ,  Yong-Soo Cho ,  Jae-Kwon Kim ,  Yeong-Jun Kim ,  Kyung-Soo Woo ,  Hyun-Il Yoo

IPC: H04W36/00

CPC classification number: H04W36/30 ,  H04B7/2606 ,  H04W16/26

Abstract: Provided is a handover method of a wireless communication system using a hierarchical cellular scheme. In the method, signal quality of a serving node is measured, so that whether to start scanning for a handover is determined. When the scanning for the handover starts, signal qualities of a serving cell including the serving node and one or more neighbor cells are measured through a first preamble including a first identifier for distinguishing a cell. An intra-cell handover or an inter-cell handover is selected using the signal qualities of the serving cell and the neighbor cells. Therefore, a terminal can easily distinguish between the inter-cell handover and the intra-cell handover, and an overhead during a handover can be reduced because an intra-cell handover procedure is simplified.

Abstract translation: 提供了使用分层蜂窝方案的无线通信系统的切换方法。 在该方法中，测量服务节点的信号质量，从而确定是否开始扫描切换。 当切换的扫描开始时，包括服务节点和一个或多个相邻小区的服务小区的信号质量通过包括用于区分小区的第一标识符的第一前同步码进行测量。 使用服务小区和相邻小区的信号质量来选择小区内切换或小区间切换。 因此，终端可以容易地区分小区间切换和小区内切换，并且可以减少切换期间的开销，因为小区内切换过程被简化。

公开(公告)号：US20090086840A1

公开(公告)日：2009-04-02

申请号：US12284922

申请日：2008-09-26

Applicant: Sung-Yoon Jung ,  Sang-Boh Yun ,  Sung-Soo Hwang ,  Jong-Ho Lee

Inventor： Sung-Yoon Jung ,  Sang-Boh Yun ,  Sung-Soo Hwang ,  Jong-Ho Lee

IPC: H04L5/12 ,  H04L27/28

CPC classification number: H04L25/03343 ,  H04L5/0053 ,  H04L2025/03414 ,  H04L2025/03802

Abstract: Disclosed is a system and method for transmitting feedback information in a communication system. A receiver calculates a minimum distance of each two symbol vectors among all symbol vectors which can be received through a kth subcarrier among a plurality of subcarriers, in which a channel state of the kth subcarrier and a jth precoder among precoders included in a codebook set are applied; calculates sums of minimum distances by adding minimum distances calculated for the plurality of subcarriers according to each precoder; determines a precoder corresponding to a value greatest among the sums of minimum distances calculated according to the precoders, as a precoder representing the plurality of subcarriers; and feeds the feedback information including a precoder index of the determined precoder back to a transmitter.

Abstract translation: 公开了一种用于在通信系统中发送反馈信息的系统和方法。 接收机计算在多个子载波中可以通过第k个子载波接收的所有符号向量中的每两个符号向量的最小距离，其中包括在码本集中的预编码器中的第k个副载波和第j个预编码器的信道状态是 应用; 通过根据每个预编码器添加针对多个子载波计算的最小距离来计算最小距离的和; 确定对应于根据预编码器计算的最小距离之和中最大值的预编码器作为表示多个子载波的预编码器; 并将包括所确定的预编码器的预编码器索引的反馈信息反馈给发射机。

公开(公告)号：US20090039293A1

公开(公告)日：2009-02-12

申请号：US12219547

申请日：2008-07-23

Applicant: Meo Youn Park ,  Jin Ha Kim ,  Soo Ryong Hwang ,  Il Hyung Jung ,  Jong Ho Lee

Inventor： Meo Youn Park ,  Jin Ha Kim ,  Soo Ryong Hwang ,  Il Hyung Jung ,  Jong Ho Lee

IPC: G21K5/04

CPC classification number: G03F7/70408 ,  G02B5/1857

Abstract: The present invention relates to an apparatus for forming a nano pattern capable of fabricating the uniform nano pattern at a low cost including a laser for generating a beam; a beam splitter for splitting the beam from the laser into two beams with the same intensity; variable mirrors for reflecting the two beams split by the beam splitter to a substrate; beam expansion units for expanding diameters of the beams by being positioned on paths of the two beams traveling toward the substrate; and a beam blocking unit, installed on an upper part of the substrate, transmitting only a specific region expanded through the beam expansion unit and blocking regions a remaining region, and a method for forming the nano pattern using the same.

Abstract translation: 本发明涉及一种用于形成能够以低成本制造均匀纳米图案的纳米图案的装置，包括用于产生光束的激光; 用于将来自激光束的光束分成具有相同强度的两个光束的分束器; 用于将由分束器分裂的两束光反射到基板的可变镜; 光束扩展单元，用于通过定位在朝向基板行进的两个光束的路径上来扩展光束的直径; 以及安装在基板的上部的光束阻挡单元，仅透射通过光束扩展单元扩展的特定区域和阻挡区域的剩余区域，以及使用其形成纳米图案的方法。

公开(公告)号：US20090011307A1

公开(公告)日：2009-01-08

申请号：US12167318

申请日：2008-07-03

Applicant: Jong Ho LEE ,  Hae Weon Lee ,  Hue Sup Song ,  Joo Sun Kim ,  Ji Won Son ,  Hae Ryoung Kim ,  Hwa Young Jung

Inventor： Jong Ho LEE ,  Hae Weon Lee ,  Hue Sup Song ,  Joo Sun Kim ,  Ji Won Son ,  Hae Ryoung Kim ,  Hwa Young Jung

IPC: H01M8/02 ,  H01M4/86 ,  H01M4/88

CPC classification number: H01M4/8621 ,  B82Y30/00 ,  C01G45/1264 ,  C01P2002/72 ,  C01P2006/12 ,  C01P2006/40 ,  C04B35/01 ,  C04B35/486 ,  C04B35/62805 ,  C04B35/62815 ,  C04B35/62823 ,  C04B35/62886 ,  C04B35/62892 ,  C04B35/632 ,  C04B35/63488 ,  C04B2235/3213 ,  C04B2235/3224 ,  C04B2235/3227 ,  C04B2235/3229 ,  C04B2235/3246 ,  C04B2235/3267 ,  C04B2235/5409 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/77 ,  H01M4/8885 ,  H01M4/9025 ,  H01M4/9033 ,  H01M2008/1293 ,  Y10T29/1194

Abstract: The present invention provides electrode-electrolyte composite particles for a fuel cell, which have either electrode material particles uniformly dispersed around electrolyte material particles or electrolyte material particles uniformly dispersed around electrode material particles, to enhance the electrode performance characteristics and electrode/electrolyte bonding force, as well as thermal, mechanical and electrochemical properties of the fuel cell, in a simple method without using expensive starting materials and a high temperature process.

Abstract translation: 本发明提供了一种用于燃料电池的电极 - 电解质复合颗粒，其中电极材料颗粒均匀分散在围绕电极材料颗粒均匀分散的电解质材料颗粒或电解质材料颗粒周围，以增强电极性能特性和电极/电解质结合力， 以及燃料电池的热，机械和电化学性能，以简单的方法，而不使用昂贵的起始材料和高温工艺。

公开(公告)号：US20080311544A1

公开(公告)日：2008-12-18

申请号：US12159974

申请日：2007-01-02

Applicant: Jong Ho Lee

Inventor： Jong Ho Lee

IPC: A61C3/02 ,  A61C8/00

CPC classification number: A61C8/0089 ,  A61C1/12 ,  A61C8/005 ,  A61C8/0068

Abstract: In case of straight driver (100), The entrance of screw inserting hole of Implant prosthesis is on the same line with implant fixture's axis. Due to this position of the hole, final prosthesis has many difficulties. Thus. I invented the free angled driver (301). For maxillay anterior teeth, we can move the screw hole to lingual surface of prosthesis (511). we can make esthetic and convenient prosthesis with capability of easy screwing and unscrewing. Also. I invented the free angled hole abutment (300) for the free angled implant driver (301), so we can move occlusal hole to the ideal position. It is an epoch-making change to solve many problems in the contemporary dental implant prosthetics.

Abstract translation: 在直线驱动器（100）的情况下，植入物假体的螺钉插入孔的入口与植入物夹具的轴线在同一条线上。 由于孔的这种位置，最终假体有很多困难。 从而。 我发明了自由角度驱动（301）。 对于maxillay前牙，我们可以将螺钉孔移动到假体的舌侧（511）。 我们可以使美容和方便的假体具有容易的拧紧和拧松的能力。 也。 我发明了用于自由倾斜的植入物驱动器（301）的自由倾斜孔基座（300），因此我们可以将咬合孔移动到理想位置。 解决当代牙科植入假体中的许多问题是一个划时代的变革。

公开(公告)号：US20080298491A1

公开(公告)日：2008-12-04

申请号：US12154954

申请日：2008-05-28

Applicant: Sung-Yoon Jung ,  Sang-Boh Yun ,  Young-Hoon Kwon ,  Sung-Soo Hwang ,  Jong-Ho Lee ,  Hyun-Cheol Park ,  Hyoun-Kuk Kim ,  Ki-Hwan Jeon

Inventor： Sung-Yoon Jung ,  Sang-Boh Yun ,  Young-Hoon Kwon ,  Sung-Soo Hwang ,  Jong-Ho Lee ,  Hyun-Cheol Park ,  Hyoun-Kuk Kim ,  Ki-Hwan Jeon

IPC: H04L27/28

CPC classification number: H04L25/0206

Abstract: An apparatus and a method are provided for detecting N number of TX signals in a MIMO wireless communication system. The apparatus includes an RF processor, a channel estimator, and a signal detector. The RF processor converts signals, received through multiple antennas, into baseband signals. The channel estimator estimates channel information of the respective antennas by using the received signals. The signal detector arranges the baseband signals of the respective antennas on the basis of the channel information, calculates a threshold value of each stage, and selects symbols with a cumulative metric smaller than or equal to the threshold value as candidates at each stage, to detect a TX signal vector with N number of symbols.

Abstract translation: 提供了一种用于在MIMO无线通信系统中检测N个TX信号的装置和方法。 该装置包括RF处理器，信道估计器和信号检测器。 RF处理器将通过多个天线接收的信号转换为基带信号。 信道估计器通过使用所接收的信号来估计各个天线的信道信息。 信号检测器基于信道信息布置各个天线的基带信号，计算每一级的阈值，并且选择具有小于或等于阈值的累积度量的符号作为每个级的候选，以检测 具有N个符号的TX信号向量。

公开(公告)号：US07459359B2

公开(公告)日：2008-12-02

申请号：US11556804

申请日：2006-11-06

Applicant: Tai-Su Park ,  Eui-Joon Yoon ,  U-In Chung ,  Si-Young Choi ,  Jong-Ho Lee

Inventor： Tai-Su Park ,  Eui-Joon Yoon ,  U-In Chung ,  Si-Young Choi ,  Jong-Ho Lee

IPC: H01L21/336 ,  H01L21/8234

CPC classification number: H01L29/7851 ,  H01L29/66795 ,  H01L29/7854

Abstract: A method of forming a field effect transistor includes forming a vertical channel protruding from a substrate including a source/drain region junction between the vertical channel and the substrate, and forming an insulating layer extending on a side wall of the vertical channel toward the substrate to beyond the source/drain region junction. The method may also include forming a nitride layer extending on the side wall away from the substrate to beyond the insulating layer, forming a second insulating layer extending on the side wall that is separated from the channel by the nitride layer, and forming a gate electrode extending on the side wall toward the substrate to beyond the source/drain region junction.

Abstract translation: 形成场效应晶体管的方法包括形成从包括垂直沟道和衬底之间的源极/漏极区域的衬底突出的垂直沟道，并且形成在垂直沟道的侧壁上朝向衬底延伸的绝缘层， 超出源/漏区结。 该方法还可以包括在侧壁上形成远离衬底延伸到绝缘层的氮化物层，形成在侧壁上延伸的第二绝缘层，所述第二绝缘层通过氮化物层从沟道分离，并形成栅电极 在侧壁上朝向衬底延伸超过源/漏区结。

公开(公告)号：US20080265432A1

公开(公告)日：2008-10-30

申请号：US12113009

申请日：2008-04-30

Applicant: Min-Ho O ,  Eun-Chul AHN ,  Jong-Ho LEE ,  Pyoung-Wan KIM ,  Hyeon HWANG ,  Teak-Hoon LEE

Inventor： Min-Ho O ,  Eun-Chul AHN ,  Jong-Ho LEE ,  Pyoung-Wan KIM ,  Hyeon HWANG ,  Teak-Hoon LEE

IPC: H01L23/49

CPC classification number: H01L24/85 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/27013 ,  H01L2224/29007 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: A multi-chip package includes a mounting substrate, a first semiconductor chip, a second semiconductor chip, a reinforcing member, conductive wires and an encapsulant. The first semiconductor chip is disposed on the mounting substrate. The second semiconductor chip is disposed on the first semiconductor chip. An end portion of the second semiconductor chip protrudes from a side portion of the first semiconductor chip. A reinforcing member is disposed on an overlapping region of the second semiconductor chip where the second semiconductor chip overlaps with the side portion of the first semiconductor chip such that the reinforcing member decreases downward bending of the second semiconductor chip from the side portion of the first semiconductor chip. The conductive wires electrically connect the first and second semiconductor chips to the mounting substrate. The encapsulant is disposed on the mounting substrate to cover the first and second semiconductor chips and the conductive wires.

Abstract translation: 多芯片封装包括安装基板，第一半导体芯片，第二半导体芯片，加强构件，导线和密封剂。 第一半导体芯片设置在安装基板上。 第二半导体芯片设置在第一半导体芯片上。 第二半导体芯片的端部从第一半导体芯片的侧部突出。 加强构件设置在第二半导体芯片的重叠区域上，其中第二半导体芯片与第一半导体芯片的侧部重叠，使得加强构件从第一半导体的侧部减小第二半导体芯片的向下弯曲 芯片。 导线将第一和第二半导体芯片电连接到安装基板。 密封剂设置在安装基板上以覆盖第一和第二半导体芯片和导线。

公开(公告)号：US20080258199A1

公开(公告)日：2008-10-23

申请号：US11736114

申请日：2007-04-17

Applicant: Jong-Ho Lee

Inventor： Jong-Ho Lee

IPC: H01L29/788 ,  H01L21/04

CPC classification number: H01L29/66833 ,  B82Y10/00 ,  H01L21/28273 ,  H01L21/28282 ,  H01L29/42332 ,  H01L29/42336 ,  H01L29/42348 ,  H01L29/42352 ,  H01L29/66825 ,  H01L29/785 ,  H01L29/7881 ,  H01L29/7887 ,  H01L29/792 ,  H01L29/7923

Abstract: The present invention relates to a flash memory device and its fabrication method, in more detail, it relates to a novel device structure for improving a scaling-down characteristic/performance and increasing memory capacity of the MOS-based flash memory device.A new device structure according to the present invention is compatible with existing fabrication process and is based on a recessed channel, which is capable of easily implementing highly-integrated/high-performance and 2-bit/cell. The proposed device has a structure suppressing the short channel effect while largely reducing the cell area and enabling 2-bit/cell by forming the charge storage node as a spacer inside the recessed channel. Moreover, if selectively removing the dielectric films around the recessed silicon surface, the sides as well as the surface of the recessed channel is exposed. A spacer can be also made in this situation and used for a storage node, thereby improving the channel controllability of the control electrode and the on-off characteristic of a device. The proposed structure also takes advantage of resolving the threshold voltage problem and improving the write/erase speeds.

Abstract translation: 本发明涉及闪速存储器件及其制造方法，更详细地说，涉及一种用于改善按比例缩小特性/性能并增加基于MOS的闪存器件的存储器容量的新型器件结构。 根据本发明的新器件结构与现有制造工艺兼容，并且基于能够容易地实现高度集成/高性能和2位/单元的凹陷通道。 所提出的装置具有抑制短信道效应的结构，同时通过在凹陷通道内形成作为间隔物的电荷存储节点，大大减小了单元面积并使得能够实现2位/单元。 此外，如果选择性地去除凹陷硅表面周围的电介质膜，则侧面以及凹槽的表面被暴露。 在这种情况下也可以制造间隔物，用于存储节点，从而提高控制电极的通道可控性和装置的开 - 关特性。 所提出的结构还利用解决阈值电压问题并提高写/擦除速度。