公开(公告)号：US5239447A

公开(公告)日：1993-08-24

申请号：US760038

申请日：1991-09-13

Applicant: Paul W. Cotues ,  Paul A. Moskowitz ,  Philip Murphy ,  Mark B. Ritter ,  George F. Walker

Inventor： Paul W. Cotues ,  Paul A. Moskowitz ,  Philip Murphy ,  Mark B. Ritter ,  George F. Walker

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/20

CPC classification number: H05K3/366 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H05K2201/0314 ,  H05K2201/10484 ,  H05K3/325 ,  H05K3/3442

Abstract: An electronic device packaging structure is described wherein an electronic device is electrically connected to a substrate wherein the electronic device subtends a non-normal angle with respect to the substrate. In a more specific embodiment, a plurality of electronic devices are stacked at offset with respect to each other to expose contact locations on the surface of each electronic device at an edge of each electronic device to form a stepped surface exposing a plurality of electronic device contact locations. This surface is disposed against a substrate having a plurality of contact locations thereon. The electronic device contact locations can be electrically interconnected to the substrate contact locations by solder mounds or alternatively by a cylindrical shaped elastomeric body having metallization bands with a spacing corresponding to the electronic device contact locations. The elastomeric body is pressed between the edge of the stacked electronic devices having the contact locations thereon and substrate surface to form electrical interconnections between electronic device contact locations and substrate contact locations through the electrically conducting bands. The stacked electronic devices can be thermally connected to a heat dissipation member. The stacked electronic devices can have a stepped surface embodying an enhanced area for transfer of heat from the electronic device stack to the heat dissipation member.

公开(公告)号：US4984064A

公开(公告)日：1991-01-08

申请号：US310563

申请日：1989-02-15

Applicant: Sugano Toshio ,  Tsukui Seiichirou ,  Suzuki Shigeru

Inventor： Sugano Toshio ,  Tsukui Seiichirou ,  Suzuki Shigeru

IPC: H01L27/10 ,  H01L23/04 ,  H01L23/32 ,  H01L23/50 ,  H01L25/10 ,  H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/14

CPC classification number: H05K1/141 ,  H01L23/50 ,  H01L25/105 ,  H01R12/721 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H05K1/0289 ,  H05K1/181 ,  H05K2201/09336 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10484 ,  H05K2201/10689 ,  H05K2203/1572 ,  H05K3/366

Abstract: In an SIP type module of the type wherein memory ICs are mounted to both surfaces of a substrate, the present invention provides a face package type memory module wherein packaging is made in an inclined direction in place of vertical packaging of the prior art technique and only the memory ICs mounted to the upper surface side of the substrate are deviated to the position closer to the end portion of the substrate in order to drastically reduce the packaging height.

Abstract translation: 在其中存储器IC被安装到基板的两个表面的类型的SIP型模块中，本发明提供一种面包装型存储模块，其中以倾斜方向制造包装，代替现有技术的垂直包装，并且仅仅 安装到基板的上表面侧的存储器IC偏离到更靠近基板的端部的位置，以显着降低封装高度。

公开(公告)号：US4862400A

公开(公告)日：1989-08-29

申请号：US055183

申请日：1987-05-28

Applicant: Martin G. Selbrede

Inventor： Martin G. Selbrede

IPC: H05K1/14 ,  H05K3/30 ,  H05K7/14

CPC classification number: H05K7/1429 ,  H05K1/141 ,  H05K2201/10189 ,  H05K2201/10484 ,  H05K3/301

Abstract: A bus assembly for a microcomputer comprising a motherboard having a data bus of the standard type, which bus assembly comprises means for mounting a plurality of daughtercards at an acute angle with respect to the motherboard. The bus assembly further comprises a bus extension card adapted to plug into the edge card connectors of the motherboard data bus so as to be retained parallel to the motherboard. The bus extension card is provided with a plurality of edge card connectors disposed at an acute angle with respect to the card and thus at an acute angle with respect to the motherboard.

Abstract translation: 一种用于微计算机的总线组件，包括具有标准类型的数据总线的母板，该总线组件包括用于相对于母板以锐角安装多个子卡的装置。 总线组件还包括适于插入主板数据总线的边缘卡连接器以便平行于主板的总线扩展卡。 总线扩展卡设置有多个边缘卡连接器，其相对于卡以锐角设置，并因此相对于主板呈锐角。

公开(公告)号：US4118757A

公开(公告)日：1978-10-03

申请号：US793705

申请日：1977-05-04

Applicant: Kenneth D. Rinaldo

Inventor： Kenneth D. Rinaldo

IPC: H01R12/55 ,  H05K3/30 ,  H05K3/34 ,  H05K7/10 ,  H05K1/04

CPC classification number: H05K7/1053 ,  H05K3/301 ,  H05K3/308 ,  H05K2201/09709 ,  H05K2201/10128 ,  H05K2201/10295 ,  H05K2201/10446 ,  H05K2201/10454 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10696 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K3/3447

Abstract: A mounting arrangement is provided whereby an electronic display device with contact pins accessible on one side is mounted on a printed circuit board by means of a plurality of elongated pin extender elements connected between individual ones of the contact pins and points of contact on associated ones of the conductive leads on the printed circuit board, the elements having pin receiving means for receiving the pins and being oriented at an off-orthogonal angle with respect to said printed circuit board and the pin extender elements form a triangulated structural support for the display device.

Abstract translation: 提供了一种安装装置，借此通过连接在各个接触针之间的多个细长的针延伸元件将一个具有可在一侧接触的接触销的电子显示装置安装在印刷电路板上， 印刷电路板上的导电引线，元件具有用于接收引脚并且相对于所述印刷电路板以非正交角度定向的销接收装置，并且扩展器元件形成用于显示装置的三角形结构支撑。

公开(公告)号：US3780430A

公开(公告)日：1973-12-25

申请号：US3780430D

申请日：1972-09-25

Applicant: BOWMAR ALI INC

Inventor： FEENEY J

IPC: G06F15/02 ,  G09G3/14 ,  H05K3/30

CPC classification number: H05K3/308 ,  G06F15/02 ,  G09G3/14 ,  H05K2201/10128 ,  H05K2201/10303 ,  H05K2201/10484 ,  H05K2201/10757 ,  H05K2203/1446 ,  Y10T29/49131 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: In a small hand-held calculator the electroluminescent display is in the form of a series of light emitting diodes (''''chips'''') which are received on a printed circuit board. The electric signal output of the calculator circuit is communicated to the display through a series of pins which are stake mounted on a printed circuit board and the projected ends of these pins serve the dual purpose of communicating electric signals which determine the display and also serve to mount the printed circuit board of the display and its associated components. The pins are inclined so that the display can be disposed at whatever viewing angle is desired. Thus, although the small calculator may lie flat on a desk or other support surface, the plane of the display is disposed at an angle making viewing much more convenient, that is, at an angle approaching perpendicularity to the line of vision of the viewer. By utilizing the pins both as electrical signal communicating means as well as mounting means it is possible to locate the display at whatever angle is desired and in a much more convenient and economical manner.

Abstract translation: 在小型手持式计算器中，电致发光显示器是一系列被接收在印刷电路板上的发光二极管（“芯片”）的形式。 计算器电路的电信号输出通过一系列引脚传送到显示器，这些引脚安装在印刷电路板上，并且这些引脚的投射端用于传达确定显示器的电信号的双重目的，并且还用于 安装显示器的印刷电路板及其相关组件。 这些销是倾斜的，使得显示器可以以任何视角来设置。 因此，虽然小的计算器可以平放在桌子或其他支撑表面上，但是显示器的平面以一定的角度设置，使观看更加方便，即，以与观看者的视线垂直的角度接近。