公开(公告)号：US20080105558A1

公开(公告)日：2008-05-08

申请号：US11927680

申请日：2007-10-30

Applicant: Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

Inventor： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC: C25D5/10

CPC classification number: B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Abstract translation: 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20070045121A1

公开(公告)日：2007-03-01

申请号：US11435809

申请日：2006-05-16

Applicant: Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

Inventor： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC: C25D5/02

CPC classification number: B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Abstract translation: 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20060283710A1

公开(公告)日：2006-12-21

申请号：US10272254

申请日：2002-10-15

Applicant: Adam Cohen ,  Gang Zhang ,  Qui Le

Inventor： Adam Cohen ,  Gang Zhang ,  Qui Le

IPC: C25D5/02

CPC classification number: B81C1/0038 ,  B33Y10/00 ,  B81C1/00619 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14 ,  H01L21/2885 ,  H01L21/76885 ,  H05K3/241

Abstract: Various embodiments of the invention provide techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the electrochemical extrusion process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of a multi-layer electrochemical fabrication process.

Abstract translation: 本发明的各种实施例提供了通过电化学挤出方法形成结构（例如HARMS型结构）的技术。 优选的实施方案通过沉积通过无阳极适应的接触掩模进行挤出过程，其最初被压在基底上，然后随着沉积增厚逐渐拉开或分离。 沉积图案可以通过在掩模和衬底元件之间包括更复杂的相对运动而在沉积过程中变化。 这种复杂运动可以包括旋转分量或具有不与分离轴平行的分量的平移运动。 可以通过将电化学挤出工艺与多层电化学制造工艺的选择性沉积，覆盖沉积，平坦化，蚀刻和多层操作组合来形成更复杂的结构。

公开(公告)号：US20060282065A1

公开(公告)日：2006-12-14

申请号：US11444999

申请日：2006-05-31

Applicant: Adam Cohen

Inventor： Adam Cohen

IPC: A61B17/29

CPC classification number: C25D1/00 ,  A61B2017/00345 ,  C25D1/003 ,  C25D5/02

Abstract: Embodiments of the present invention provide mesoscale or microscale three-dimensional devices, structures, instruments, and the like. In particular, instruments that are useable in minimally invasive surgery are described that include multiple tools that are deployable from a distal end of one or more housings or retractable into a distal end of one or more housings via the applying of tension to either end of one or more chain or chain-like elements that extend from the proximal end of the one or more housings.

Abstract translation: 本发明的实施例提供中尺度或微尺寸的三维装置，结构，仪器等。 特别地，描述了可在微创手术中使用的器械，其包括可从一个或多个壳体的远端展开的多个工具，或者可以通过向一个或多个外壳的任一端施加张力而缩回到一个或多个外壳的远端 或更多的链条或链状元件，其从一个或多个外壳的近端延伸。

公开(公告)号：US20050199583A1

公开(公告)日：2005-09-15

申请号：US11029218

申请日：2005-01-03

Applicant: Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

Inventor： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  C25D5/02 ,  C25D5/10 ,  H01L21/44 ,  H01L21/4763

CPC classification number: C25D1/003 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1653 ,  C25D5/022 ,  C25D5/10

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US20050181315A1

公开(公告)日：2005-08-18

申请号：US11028943

申请日：2005-01-03

Applicant: Adam Cohen ,  Jeffrey Thompson

Inventor： Adam Cohen ,  Jeffrey Thompson

IPC: C25D5/02 ,  C25D5/10 ,  G03C5/38 ,  H01L21/8236

CPC classification number: C25D5/02 ,  B33Y10/00 ,  B33Y50/00 ,  B33Y50/02 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10

Abstract: Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

Abstract translation: 本发明的一些实施例涉及用于电化学制造多层三维结构的技术，其中至少一个或多个层的选择性图案化通过掩模发生，该掩模使用表示具有三维结构的横截面的数据形成，该三维结构具有 被修改为将其定义为仅限定正面积区域的多边形形式。 根据是否使用掩模，例如选择性地沉积结构材料或牺牲材料，正面积的区域是结构材料要被定位的区域或者结构材料不被定位的区域。 修改的数据可以采取相邻或稍微重叠的相对窄的矩形结构的形式，其中结构的宽度与期望的地层分辨率相关。 相邻矩形的中心之间的间距可以是均匀的或可以是变量。 数据修改还可以包括形成原始结构，缩放副本，镜像副本，旋转副本，补充副本等的重复副本。

公开(公告)号：US20050173374A1

公开(公告)日：2005-08-11

申请号：US11029014

申请日：2005-01-03

Applicant: Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

Inventor： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23C18/16 ,  C23F1/00 ,  C25D5/02 ,  C25D5/10 ,  C25D5/34 ,  H01L21/288 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/768

CPC classification number: B44C1/22 ,  B33Y10/00 ,  B81C1/00492 ,  C03C15/00 ,  C03C25/68 ,  C23C18/1605 ,  C23C18/161 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/405 ,  C23F1/00 ,  C25D1/003 ,  C25D5/02 ,  C25D5/10 ,  H01L21/2885 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/76885

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US06881558B1

公开(公告)日：2005-04-19

申请号：US09888860

申请日：2001-06-25

Applicant: David B. Weiner ,  Donghui Zhang ,  Adam Cohen

Inventor： David B. Weiner ,  Donghui Zhang ,  Adam Cohen

IPC: C12N15/72 ,  C12P21/06 ,  C07H21/04 ,  C12N1/12 ,  C12N15/00 ,  C12P21/04

CPC classification number: C12N15/72

Abstract: Methods of cloning and/or amplifying toxic genes in bacteria using a vector which amplifies the toxic gene in bacteria and also allows subsequent expression in mammalian systems is provided. A vector having an origin of replication, a first promoter, a polylinker, a second promoter in reverse orientation with respect to the first promoter, a poly adenylation signal, and a gene encoding a selectable marker, and optionally an enhancer operably connected to the first promoter, and/or a nucleotide sequence encoding a toxic protein is also provided.

Abstract translation: 使用扩增细菌中的毒性基因并允许随后在哺乳动物系统中表达的载体来克隆和/或扩增细菌中的有毒基因的方法。 具有复制起点的载体，第一启动子，多接头体，相对于第一启动子反向取向的第二启动子，多腺苷酸化信号和编码可选择标记的基因，以及任选地可增强的与第一启动子连接的增强子 启动子，和/或编码毒性蛋白质的核苷酸序列。

公开(公告)号：US20050054945A1

公开(公告)日：2005-03-10

申请号：US10658261

申请日：2003-09-10

Applicant: Adam Cohen ,  John Golden ,  Liem Vu

Inventor： Adam Cohen ,  John Golden ,  Liem Vu

IPC: A61B10/00 ,  A61B10/02 ,  A61B10/06 ,  A61B17/32 ,  A61B17/34 ,  A61B17/24

CPC classification number: A61B10/06 ,  A61B10/0096 ,  A61B17/3462 ,  A61B2010/0225 ,  A61B2017/320064

Abstract: The invention includes a forceps and collection assembly for acquiring and storing a plurality of tissue samples in a single pass, and accompanying mechanisms for use with the forceps and collection assembly. The accompanying mechanisms include an endoscope working channel cap assembly configured to minimize compression of a pouch of the forceps and collection assembly as it traverses a seal of the cap assembly, and a flush adapter configured to be coupled to the pouch so as to assist in removing tissue samples in the pouch by flowing fluid through the pouch.

Abstract translation: 本发明包括用于在单次通过中获取和存储多个组织样本的镊子和收集组件，以及与镊子和收集组件一起使用的伴随机构。 伴随的机构包括：内窥镜工作通道盖组件，其构造成当镊子和收集组件穿过盖组件的密封件时使压缩袋的压缩最小化;以及冲洗适配器，其被配置为联接到该小袋以协助去除 通过使流体流过袋子来在袋中组织样品。

公开(公告)号：US20050045585A1

公开(公告)日：2005-03-03

申请号：US10841382

申请日：2004-05-07

Applicant: Gang Zhang ,  Adam Cohen ,  Michael Lockard ,  Ananda Kumar ,  Ezekiel Kruglick ,  Kieun Kim

Inventor： Gang Zhang ,  Adam Cohen ,  Michael Lockard ,  Ananda Kumar ,  Ezekiel Kruglick ,  Kieun Kim

IPC: C25D1/00 ,  C25D5/02 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  C25D5/50 ,  H01L21/288 ,  H01L21/768 ,  H05K3/24 ,  C23F1/00

CPC classification number: C25D5/50 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  H01L21/2885 ,  H01L21/76879 ,  H05K3/241 ,  H05K3/243

Abstract: Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.