公开(公告)号：US07485594B2

公开(公告)日：2009-02-03

申请号：US11799413

申请日：2007-05-01

Applicant: Chandan Saha ,  Sharon Allen ,  Chan Han ,  Robert T. Nilsson ,  Arthur R. Prunier, Jr. ,  Aleksander J. Pyzik ,  Sten A. Wallin ,  Robin Ziebarth ,  Timothy J. Gallagher

Inventor： Chandan Saha ,  Sharon Allen ,  Chan Han ,  Robert T. Nilsson ,  Arthur R. Prunier, Jr. ,  Aleksander J. Pyzik ,  Sten A. Wallin ,  Robin Ziebarth ,  Timothy J. Gallagher

IPC: C04B35/00

CPC classification number: B01J23/10 ,  B01D39/2093 ,  B01J23/63 ,  B01J35/04 ,  B01J37/0215 ,  C04B35/185 ,  C04B35/6365 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/322 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3229 ,  C04B2235/3409 ,  C04B2235/349 ,  C04B2235/449 ,  C04B2235/604 ,  C04B2235/658 ,  C04B2235/661 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/96 ,  C04B2235/9607 ,  F01N2330/06 ,  F01N2510/06 ,  F01N2510/0682

Abstract: A porous mullite composition is made by forming a mixture of one or more precursor compounds having the elements present in mullite (e.g., clay, alumina, silica) and a property enhancing compound. The property enhancing compound is a compound having an element selected from the group consisting of Mg, Ca, Fe, Na, K, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, B, Y, Sc, La and combination thereof. The mixture is shaped and to form a porous green shape which is heated under an atmosphere having a fluorine containing gas to a temperature sufficient to form a mullite composition comprised substantially of acicular mullite grains that are essentially chemically bound.

Abstract translation: 通过形成具有莫来石（例如粘土，氧化铝，二氧化硅）和性能增强化合物中存在的元素的一种或多种前体化合物的混合物来制备多孔莫来石组合物。 性质增强化合物是具有选自Mg，Ca，Fe，Na，K，Ce，Pr，Nd，Sm，Eu，Gd，Tb，Dy，Ho，Er，Tm，Yb， Lu，B，Y，Sc，La及其组合。 混合物成型并形成多孔绿色形状，其在具有含氟气体的气氛下加热到足以形成基本上化学结合的基本上由针状莫来石颗粒组成的莫来石组合物的温度。

公开(公告)号：US20080136580A1

公开(公告)日：2008-06-12

申请号：US11947422

申请日：2007-11-29

Applicant: Hyo-Jae BANG ,  Dong-Chun LEE ,  Seong-Chan HAN ,  Jung-Hyeon KIM ,  Hyun-Seok CHOI

Inventor： Hyo-Jae BANG ,  Dong-Chun LEE ,  Seong-Chan HAN ,  Jung-Hyeon KIM ,  Hyun-Seok CHOI

IPC: H01C1/01

CPC classification number: H01C1/144 ,  H01C1/01 ,  H01C7/18 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09172 ,  H05K2201/10045 ,  Y02P70/613

Abstract: Provided are a chip network resistor contacting a printed circuit board (PCB) through solder balls and a semiconductor module having the chip network resistor. The chip network resistor includes: a body formed of an insulating material; a resistor formed on the body; external electrodes connected to the resistor and disposed on a lower surface of the body so as to have solder ball pad shapes; and conductive balls adhered on the external electrodes.

Abstract translation: 提供了通过焊球与印刷电路板（PCB）接触的芯片网络电阻器和具有芯片网络电阻器的半导体模块。 芯片网络电阻器包括：由绝缘材料形成的主体; 形成在体上的电阻; 外部电极连接到电阻器并且设置在主体的下表面上以具有焊球形状; 并且导电球附着在外部电极上。

公开(公告)号：US20080123909A1

公开(公告)日：2008-05-29

申请号：US11744238

申请日：2007-05-04

Applicant: Hak Il Kim ,  Young Chan Han ,  Ji Hyeon Jang

Inventor： Hak Il Kim ,  Young Chan Han ,  Ji Hyeon Jang

IPC: G06K9/00

CPC classification number: G06K9/00073 ,  G06K9/42

Abstract: A method of transforming minutiae using the Taylor series for interoperable fingerprint recognition between disparate fingerprint sensors, which parses the fields of a Standard Interchange Format (SIF) template having the level of minutiae proposed in SC37, extract information fields corresponding to resolution, image size, and minutiae, corrects the locations of minutiae constituting the template, and standardizes the minutiae, thus increasing a recognition rate for fingerprint matching, and which applies transformation parameters using the Taylor series to a golden template that is generated using a plurality of samples for the same fingerprint which are input from a plurality of disparate fingerprint recognition sensors, thus improving recognition performance and reliability of matching between the disparate sensors that use the transformation of minutiae merely by correcting the locations of the minutiae, without correcting resolution or distortion characteristics. In the minutiae transformation method, a golden template, which is a template including visible minutiae, is created. Transformation parameters are calculated using the Taylor series. A location of minutiae data calculated from the SIF templates is corrected using the transformation parameters.

Abstract translation: 一种使用泰勒序列转换细节的方法，用于解析在SC37中提出的具有细节级别的标准交换格式（SIF）模板的字段之间的不同指纹传感器之间的互操作指纹识别，提取与分辨率对应的信息字段，图像大小， 细节，纠正构成模板的细节的位置，并对细节进行标准化，从而提高指纹匹配的识别率，并将使用泰勒级数的变换参数应用于使用多个样本生成的金色模板 指纹，其从多个不同的指纹识别传感器输入，从而仅通过校正细节的位置来改善使用细节转换的不同传感器之间的匹配的识别性能和可靠性，而无需校正分辨率或失真特性。 在细节转换方法中，创建了包含可视细节的模板的金色模板。 转换参数使用泰勒级数计算。 使用变换参数校正从SIF模板计算的细节数据的位置。

公开(公告)号：US20080079128A1

公开(公告)日：2008-04-03

申请号：US11855951

申请日：2007-09-14

Applicant: Hyo-Jae BANG ,  Seong-Chan HAN ,  Hun HAN ,  Dong-Chun LEE

Inventor： Hyo-Jae BANG ,  Seong-Chan HAN ,  Hun HAN ,  Dong-Chun LEE

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49582 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lead frame type stack package in which a lead of the package is well connected to a semiconductor module, and a method of fabricating the same are provided. A lead of an upper package and a lead of a lower package are connected using laser soldering. Since leads of the upper and lower packages are connected by solder balls without the use of a soldering pot, loss of a plating layer of the lead due to solder dipping is prevented and the leads are well connected without soldering defects when connecting the lead of the lower package to a connection pad of a semiconductor module substrate.

Abstract translation: 一种引线框架型堆叠封装，其中封装的引线与半导体模块良好连接，并提供其制造方法。 使用激光焊接连接上封装的引线和下封装的引线。 由于上，下封装的引线通过焊锡球连接而不使用焊锡锅，因此防止了由焊料浸渍引起的引线的镀层损失，并且当连接引线 下封装到半导体模块基板的连接焊盘。

公开(公告)号：US20060197265A1

公开(公告)日：2006-09-07

申请号：US10551728

申请日：2004-04-23

Applicant: Chandan Saha ,  Sharon Allen ,  Chan Han ,  Robert Nilsson ,  Arthur Prunier ,  Aleksander Pyzik ,  Sten Wallin ,  Robin Ziebarth ,  Timothy Gallagher

Inventor： Chandan Saha ,  Sharon Allen ,  Chan Han ,  Robert Nilsson ,  Arthur Prunier ,  Aleksander Pyzik ,  Sten Wallin ,  Robin Ziebarth ,  Timothy Gallagher

IPC: C04B35/18 ,  C04B35/64 ,  C01B33/26 ,  B01J21/12 ,  C01B15/12

CPC classification number: B01D53/885 ,  B01D53/944 ,  B01D71/02 ,  B01J21/12 ,  B01J21/16 ,  B01J23/002 ,  B01J23/02 ,  B01J23/10 ,  B01J23/63 ,  B01J23/78 ,  B01J35/002 ,  B01J35/1033 ,  B01J37/0018 ,  B01J37/0027 ,  B01J37/08 ,  B01J37/26 ,  B01J2523/00 ,  C04B35/185 ,  C04B35/64 ,  C04B38/00 ,  C04B2111/00793 ,  C04B2111/0081 ,  C04B2235/3201 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3229 ,  C04B2235/3272 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/3445 ,  C04B2235/349 ,  C04B2235/449 ,  C04B2235/658 ,  C04B2235/661 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/78 ,  C04B2235/85 ,  C04B2235/96 ,  C04B2235/9607 ,  F01N3/022 ,  F01N3/0222 ,  F01N3/035 ,  F01N2330/06 ,  F01N2370/02 ,  C04B38/0022 ,  C04B38/0074 ,  C04B38/0645 ,  B01J2523/22 ,  B01J2523/31 ,  B01J2523/41 ,  B01J2523/842 ,  B01J2523/3725

Abstract: A porous mullite composition is made by Forming a mixture of one or more precursor compounds having the elements present in mullite (e.g., clay, alumina, silica) and a property enhancing compound. The property enhancing compound is a compound having an element selected from the group consisting of Mg, Ca, Fe, Na, K, Ce, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er, Tm, Yb, Lu, B, Y, Sc, La and combination thereof. The mixture is shaped and to form a porous green shape which is heated under an atmosphere having a fluorine containing gas to a temperature sufficient to form a mullite composition comprised substantially of acicular mullite grains that are essentially chemically bound.

公开(公告)号：US6062799A

公开(公告)日：2000-05-16

申请号：US103518

申请日：1998-06-23

Applicant: Seong Chan Han ,  Dong Chun Lee ,  Kwang Su Yu ,  O Kyung Kwon

Inventor： Seong Chan Han ,  Dong Chun Lee ,  Kwang Su Yu ,  O Kyung Kwon

IPC: H05K7/14 ,  B65G49/05

CPC classification number: H05K7/1415

Abstract: An apparatus for automatic loading or unloading printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus employs an elastic jig carrier into which the PCBs are loaded. The jig carrier includes movable clamps for fixing the PCBs by elastic force. A jig opener of the apparatus applies opening force, in the reverse direction of the elastic force, to the movable clamps so that the PCBs can be loaded into or unloaded from the jig carrier by a picker. The jig carrier is transferred along a conveyor belt, while the PCBs are supplied from a PCB stage such as a tray to the jig carrier. The apparatus may further comprise a gripper and a rotator. The gripper grips the upright PCBs and the rotator rotates them to be horizontal, so that the picker can pick up the horizontal PCBs. The apparatus may also comprise an aligner for exact alignment of the PCBs in the jig carrier. A method for loading or unloading the PCBs into or from the jig carrier is also disclosed in connection with the apparatus.

Abstract translation: 公开了用于半导体模块的用于自动装载或卸载印刷电路板（PCB）的装置。 该装置采用弹性夹具载体，PCB被加载到其中。 夹具载体包括用于通过弹性力固定PCB的可移动夹具。 该装置的夹具开启装置将弹性力的相反方向的打开力施加到可移动夹具上，使得PCB可以通过拾取器装载到夹具或卸载。 夹具托架沿传送带传送，而PCB从PCB台（如托盘）供应到夹具托架。 该装置还可以包括夹持器和旋转器。 夹具夹住直立PCB，旋转器将它们旋转成水平，以便拾取器可以拾取水平PCB。 该装置还可以包括用于准确对准夹具载体中的PCB的对准器。 结合该装置还公开了将PCB加载到夹具载体或从夹具载体卸载的方法。

公开(公告)号：US5820965A

公开(公告)日：1998-10-13

申请号：US868217

申请日：1997-06-03

Applicant: Aleksander J. Pyzik ,  Chan Han ,  Uday V. Deshmukh ,  Kevin J. Nilsen ,  Donald J. Perettie ,  Arthur R. Prunier, Jr.

Inventor： Aleksander J. Pyzik ,  Chan Han ,  Uday V. Deshmukh ,  Kevin J. Nilsen ,  Donald J. Perettie ,  Arthur R. Prunier, Jr.

IPC: C04B41/88 ,  C22C1/10 ,  C22C29/00 ,  C22C29/06 ,  C22C32/00 ,  G11B5/596 ,  G11B5/62 ,  G11B5/73 ,  G11B5/82 ,  G11B5/84 ,  G11B23/00 ,  H01L23/15 ,  B32B3/10 ,  B32B5/02 ,  C04B35/503

CPC classification number: G11B5/7315 ,  C22C1/1036 ,  C22C29/062 ,  C22C32/0057 ,  G11B23/0064 ,  G11B5/731 ,  G11B5/82 ,  G11B5/8404 ,  H01L23/15 ,  B22F2998/00 ,  G11B5/596 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/12069 ,  Y10T428/249994 ,  Y10T428/256

Abstract: A hard drive disk substrate is formed of a multi-phase ceramic-based material having at least two phases with amorphous phases being present in an amount less than about 1 volume percent based on the volume of the ceramic-based material or at least one phase being free metal. A process for producing the ceramic-based disk substrate is produced by forming a flat disk of a porous ceramic and then infiltrating the porous ceramic with a metal whereby a multi-phase ceramic-based computer hard drive disk is produced. Additionally, a step of passivating the porous ceramic by elevating it to a temperature of about 1300.degree. to about 1800.degree. C. before the infiltrating step may be performed, such that the surfaces are passivated and the reaction kinetics can be controlled during the infiltrating step. A preferred composite material is made of a multi-phase boron carbide composite material including grains having peaks with an average roughness value, Ra, of between about 1 to about 200.ANG., the roughness value being formed in situ by causing a micro hardness gradient of between about 19 and about 3200 Kg/mm.sup.2 in the various phases of the multi-phase boron carbide composite material.

Abstract translation: 硬盘驱动器盘基板由具有至少两相的多相陶瓷基材料形成，其中无定形相以基于陶瓷基材料的体积或至少一相的量存在的量小于约1体积％ 是免费金属。 通过形成多孔陶瓷的平板，然后用金属渗透多孔陶瓷来制造陶瓷基盘基板的方法，由此制造多相陶瓷基计算机硬盘驱动盘。 此外，可以在渗透步骤之前将其升高至约1300℃至约1800℃的温度来钝化多孔陶瓷的步骤，使得表面被钝化，并且可以在渗透步骤期间控制反应动力学 。 优选的复合材料由多相碳化硼复合材料制成，其包括具有平均粗糙度值Ra的峰值在约1至约200之间的晶粒，该粗糙度值通过使原位形成的微观硬度梯度 在多相碳化硼复合材料的各个相中约19至约3200Kg / mm 2。

公开(公告)号：US08871676B2

公开(公告)日：2014-10-28

申请号：US13059990

申请日：2009-09-18

Applicant: Daniel Grohol ,  Chan Han ,  Aleksander J. Pyzik

Inventor： Daniel Grohol ,  Chan Han ,  Aleksander J. Pyzik

IPC: B01J23/00 ,  B01J21/00 ,  C04B35/195 ,  C04B41/50 ,  C04B35/185

CPC classification number: C04B35/195 ,  C04B35/185 ,  C04B41/5025 ,  C04B2235/3463 ,  C04B2235/3481

Abstract: Porous composites of mullite and cordierite are formed by firing an acicular mullite body in the presence of a magnesium source and a silicon source. In some variations of the process, the magnesium and silicon sources are present when the acicular mullite body is formed. In other variations, the magnesium source and the silicon source are applied to a previously-formed acicular mullite body. Surprisingly, the composites have coefficients of linear thermal expansion that are intermediate to those of mullite and cordierite alone, and have higher fracture strengths than cordierite at a similar porosity. Some of the cordierite forms at grain boundaries and/or points of intersection between mullite needles, rather than merely coating the needles. The presence of magnesium and silicon sources during acicular mullite formation does not significantly affect the ability to produce a highly porous network of mullite needles.

Abstract translation: 莫来石和堇青石的多孔复合材料是通过在镁源和硅源的存在下焙烧针状莫来石体形成的。 在该方法的一些变型中，当形成针状莫来石体时，存在镁和硅源。 在其它变型中，将镁源和硅源施加到预先形成的针状莫来石体上。 令人惊奇的是，复合材料的线性热膨胀系数与莫来石和堇青石单体的中间相似，并且具有比类似孔隙率的堇青石更高的断裂强度。 在莫来石针之间的晶界和/或交叉点处的一些堇青石形式，而不仅仅是涂覆针。 在针状莫来石形成过程中镁和硅源的存在并不会显着影响产生莫来石针的高度多孔网络的能力。

公开(公告)号：US08815348B2

公开(公告)日：2014-08-26

申请号：US13651938

申请日：2012-12-17

Applicant: Chan Han ,  Aleksander J. Pyzik ,  Jia Liu

Inventor： Chan Han ,  Aleksander J. Pyzik ,  Jia Liu

IPC: B05D3/02

CPC classification number: C09D1/00 ,  C04B20/1074 ,  C04B28/006 ,  C09D1/04 ,  Y02P40/165 ,  Y10T428/31931 ,  Y10T428/31938

Abstract: The present invention relates to modified geopolymer compositions, geopolymer-coated organic polymer substrates, and methods of manufacturing and articles comprising same.

公开(公告)号：US08587946B2

公开(公告)日：2013-11-19

申请号：US12987552

申请日：2011-01-10

Applicant: Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

Inventor： Joo-Han Lee ,  Jung-Hoon Kim ,  Seong-Chan Han

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F1/183 ,  H05K7/1431

Abstract: A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

Abstract translation: 一种半导体模块插座装置，包括形成有与半导体模块相对应的插座槽的插座主体; 插座销安装在插座主体的插座槽中，以电连接到半导体模块的模块销; 以及散热构件，其安装在插座主体中，以便外部辐射在半导体模块中产生的热量，然后从插座槽和插座销传送。 根据半导体模块插座装置，可以防止半导体模块中产生的热量被传送到主板，从而提高散热效率，显着地节省安装空间，降低安装成本，并且 实现半导体模块插座装置的无噪声和无振动。