公开(公告)号：US20080135855A1

公开(公告)日：2008-06-12

申请号：US11567236

申请日：2006-12-06

Applicant: David T. Emerson

Inventor： David T. Emerson

IPC: H01L33/00

CPC classification number: H01L33/305 ,  H01L21/02378 ,  H01L21/0254 ,  H01L21/02576 ,  H01L21/0262 ,  H01L33/0075

Abstract: A light emitting diode is disclosed that is formed in the Group III nitride material system. The diode includes respective n-type and p-type layers for current injection and light emission. At least one n-type Group III nitride layer in the diode has dopants selected from the group consisting of elements with a larger atomic radius than silicon and elements with a larger covalent radius than silicon, with germanium and tellurium being exemplary.

Abstract translation: 公开了在III族氮化物材料体系中形成的发光二极管。 二极管包括用于电流注入和发光的各自的n型和p型层。 二极管中的至少一个n型III族氮化物层具有选自具有比硅更大的原子半径的元素和具有比硅更大的共价半径的元素的掺杂剂，其中锗和碲是示例性的。

公开(公告)号：US10439112B2

公开(公告)日：2019-10-08

申请号：US13554776

申请日：2012-07-20

Applicant: Joseph G. Clark ,  Jeffrey Carl Britt ,  Amber C. Abare ,  Raymond Rosado ,  Harsh Sundani ,  David T. Emerson ,  Jeremy Scott Nevins

Inventor： Joseph G. Clark ,  Jeffrey Carl Britt ,  Amber C. Abare ,  Raymond Rosado ,  Harsh Sundani ,  David T. Emerson ,  Jeremy Scott Nevins

IPC: H01L33/58 ,  F21V21/00 ,  F21V7/00 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  F21V29/74 ,  F21Y105/10 ,  F21K9/233 ,  F21Y115/10

Abstract: Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.

公开(公告)号：US09428688B2

公开(公告)日：2016-08-30

申请号：US12271945

申请日：2008-11-17

Applicant: Brian T. Collins ,  Christopher P. Hussell ,  David T. Emerson ,  Ronan P. Le Toquin

Inventor： Brian T. Collins ,  Christopher P. Hussell ,  David T. Emerson ,  Ronan P. Le Toquin

IPC: C09K11/79 ,  C09K11/08 ,  C04B35/58 ,  C04B35/581 ,  C04B35/584 ,  C04B35/591 ,  C04B35/593 ,  C04B35/597 ,  C09K11/77

CPC classification number: C09K11/7734 ,  C04B35/58 ,  C04B35/581 ,  C04B35/584 ,  C04B35/591 ,  C04B35/593 ,  C04B35/5935 ,  C04B35/597 ,  C04B2235/3224 ,  C04B2235/3852 ,  C04B2235/3865 ,  C04B2235/3869 ,  C04B2235/3873 ,  C04B2235/445 ,  C09K11/025 ,  C09K11/0883 ,  C09K11/7728

Abstract: A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.

Abstract translation: 公开了一种形成混合荧光粉组合物的方法。 该方法包括以下步骤：在耐火金属坩埚中，并且在气体存在下，将包含至少钙，锶和铝的铕和氮化物的前体组合物焙烧，以防止在氮化物起始材料和耐火材料之间形成氮化物组合物 形成坩埚的金属。 所得组合物可以包括将可见光谱的蓝色部分中的频率转换成可见光谱的红色部分中的频率的磷光体。

公开(公告)号：US09111778B2

公开(公告)日：2015-08-18

申请号：US13011609

申请日：2011-01-21

Applicant: David T. Emerson ,  Michael J. Bergmann ,  Christopher P. Hussell

Inventor： David T. Emerson ,  Michael J. Bergmann ,  Christopher P. Hussell

IPC: H01L33/08 ,  H01L25/075 ,  G02F1/1335 ,  H01L23/00 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L25/0753 ,  G02F1/133603 ,  G02F1/133608 ,  H01L24/48 ,  H01L24/49 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/29144 ,  H01L2224/2929 ,  H01L2224/29399 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/12032 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.

Abstract translation: 公开了发光二极管（LED）装置，系统和方法。 一方面，照明面板可以被配置为为液晶显示器（LCD）面板提供背光。 照明面板可以包括以阵列布置的一个或多个LED。 一个或多个LED可以使用金属对金属管芯附接方法安装在照明面板上，或者附接在设置在照明面板上的封装内。 在一个方面，可以使用本文公开的鲁棒金属 - 金属管芯附接技术和/或材料来连接一个或多个LED。

公开(公告)号：US08896013B2

公开(公告)日：2014-11-25

申请号：US13017502

申请日：2011-01-31

Applicant: Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

Inventor： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/58

Abstract: High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

公开(公告)号：USD707192S1

公开(公告)日：2014-06-17

申请号：US29412168

申请日：2012-01-31

Applicant: Christopher P. Hussell ,  Erin R. F. Welch ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

Designer： Christopher P. Hussell ,  Erin R. F. Welch ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

公开(公告)号：US08564000B2

公开(公告)日：2013-10-22

申请号：US13028972

申请日：2011-02-16

Applicant: Christopher P. Hussell ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

Inventor： Christopher P. Hussell ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

IPC: H01L33/40

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.

公开(公告)号：US20130141920A1

公开(公告)日：2013-06-06

申请号：US13312518

申请日：2011-12-06

Applicant: David T. Emerson ,  Justin Lydon ,  Raymond Rosado ,  Jeffrey C. Britt

Inventor： David T. Emerson ,  Justin Lydon ,  Raymond Rosado ,  Jeffrey C. Britt

IPC: F21V5/04

CPC classification number: H01L33/486 ,  H01L33/20 ,  H01L33/54 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Light emitter devices and methods with reduced dimensions and improved light output are provided. In one embodiment, a light emitter device includes a submount having an area of approximately 6 square millimeters (mm2) or less. The device can further include a light emitting chip on the submount and a lens disposed over the light emitting chip and positioned on the submount. The device can be operable for emitting light at approximately 100 lumens or higher.

Abstract translation: 提供了具有减小的尺寸和改善的光输出的发光器件和方法。 在一个实施例中，发光器件包括具有大约6平方毫米（mm 2）或更小的面积的底座。 该装置还可以包括在底座上的发光芯片和设置在发光芯片上并位于底座上的透镜。 该装置可操作用于发射大约100流明或更高的光。

公开(公告)号：US20120206039A1

公开(公告)日：2012-08-16

申请号：US13429053

申请日：2012-03-23

Applicant: CHRISTOPHER P. HUSSELL ,  David T. Emerson

Inventor： CHRISTOPHER P. HUSSELL ,  David T. Emerson

IPC: H01J1/70 ,  H05B33/10

CPC classification number: F21K9/90 ,  F21Y2115/10 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method of manufacturing an LED lamp is disclosed. The method includes admixing an uncured curable liquid resin and a phosphor, dispensing the uncured admixture on an LED chip, centrifuging the chip and the admixture to disperse the phosphor particles in the uncured resin, and curing the resin while the phosphor particles remain distributed.

Abstract translation: 公开了一种制造LED灯的方法。 该方法包括混合未固化的可固化液体树脂和荧光体，将未固化的混合物分配在LED芯片上，离心芯片和混合物以将荧光体颗粒分散在未固化的树脂中，并在荧光体颗粒保持分布的同时固化树脂。

公开(公告)号：US20120126255A1

公开(公告)日：2012-05-24

申请号：US13028972

申请日：2011-02-16

Applicant: Christopher P. Hussell ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

Inventor： Christopher P. Hussell ,  Peter Scott Andrews ,  Jesse Colin Reiherzer ,  David T. Emerson

IPC: H01L33/62 ,  H01L33/52

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

Abstract: Light emitting devices and methods are disclosed. In one embodiment a light emitting device can include a substrate, one or more light emitting diodes (LEDs) disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. In one aspect, a method for making a light emitting device is disclosed. The method can include providing a substrate with one or more LEDs comprising electrical connectors. The method can further include providing a retention material on at least a portion of the substrate wherein the retention material is disposed over at least a portion of the electrical connectors.

Abstract translation: 公开了发光器件和方法。 在一个实施例中，发光器件可以包括衬底，设置在衬底上的一个或多个发光二极管（LED），并且LED可以包括用于连接到电气元件的电连接器。 发光器件还可以包括设置在衬底上的保持材料，并且保持材料可以设置在至少一部分电连接器上。 一方面，公开了一种制造发光器件的方法。 该方法可以包括向基板提供包括电连接器的一个或多个LED。 该方法还可以包括在基底的至少一部分上提供保留材料，其中保持材料设置在电连接器的至少一部分上方。