Abstract:
A semiconductor memory device and a self-refresh method in which the semiconductor memory device includes a plurality of input/output ports having respective independent operation, a period of self-refresh through one of the plurality of input/output ports being subordinate to a kind of operation through another input/output port. Whereby, a refresh characteristic in a multi-port semiconductor memory device including a dual-port semiconductor memory device may be improved.
Abstract:
A multi-port semiconductor memory device having variable access paths and a method therefore are provided. The semiconductor memory device includes a plurality of input/output ports; a memory array divided into a plurality of memory areas; and a select control unit to variably control access paths between the memory areas and the input/output ports so that each memory area is accessed through at least one of the input/output ports.
Abstract:
An optical pickup device includes a light unit for irradiating a light beam having a wavelength longer than 650 nm onto a recording medium and receiving and detecting a light beam reflected by the recording medium, and an objective tens formed of a single lens having an NA of 0.7 or more to form a light spot on the recording medium by condensing an incident light beam emitted from the light unit. A recording medium has a recording density of a DVD family or more and is formed of a material suitable for a long wavelength of 700 nm or more so that a reproduction signal by a reflectance of a recording surface is optimized. Thus, a compact high density optical recording/reproducing apparatus which is inexpensive and has high performance can be realized.
Abstract:
A semiconductor package includes multiple embedded chips, each chip including a common circuit having substantially the same common function. The common circuit in a selected one of the chips is enabled. The common circuit in one or more other ones of the chips is disabled. As a result, the enabled common circuit performs the common function for the selected chip and the one or more other chips.
Abstract:
Graphics memory devices include an output register having an input electrically coupled to an output signal line (DO) and first and second data output buffers responsive to first and second clock signals (CLK1, CLK2), respectively. The first data output buffer has an input electrically coupled to the output signal line (DO) and the second data output buffer has an input electrically coupled to an output of the output register. These memory devices also include at least one memory cell array and a read data driver that has an input electrically coupled to the memory cell array by an input/output signal line (I/O) and an output electrically coupled to the output signal line (DO). To provide improved performance for graphics processing applications, a clock signal generator is provided that generates the first and second clock signals at different frequencies and/or different phases relative to each other. The second clock signal is preferably generated at a higher frequency than the first clock signal so that data (e.g., screen refresh data) provided by the read data driver to the output register can be serially transmitted from the second data output buffer at a high data rate. This data can also be transmitted in parallel with data being transmitted from the first data output buffer. In particular, the first data output buffer generates data at its output (first port) in response to a rising or falling edge of the first clock signal, but the second data output buffer generates data at its output (second port) in response to rising and falling edges of the second clock signal. Thus, even if the first and second clock signals have the same frequency, the rate of data being transmitted by the second data output buffer can be higher than the rate of data being transmitted by the first data output buffer.
Abstract:
The semiconductor memory device includes a clock signal generating circuit, a precharge circuit, a write circuit, and an input/output circuit. The clock signal generating circuit generates a second clock signal having a second state of a constant interval irrespective of a period of a first clock signal. The precharge circuit precharges a data input/output line in response to a precharge signal. The write circuit transfers, during a write operation, input data signal to the data input/output line each time the second clock signal is a first state under the state that a power signal and the precharge signal are the first state. The input/output circuit transfers data transmitted to the data input/output line to a cell.
Abstract:
A semiconductor memory device has the skew between the individual transmission lines of a parallel transmission bus minimized by the addition of respective load transmission lines to each of the individual transmission lines in the parallel bus. A first circuit unit including a first parallel bank of internal circuits for generating internal control signals is formed adjacent to a predetermined region within a chip. A second circuit unit includes a second parallel bank of internal circuits for performing a predetermined operation in response to an output of the first circuit unit. The second circuit transmits signals to the first circuit over a parallel bus comprised of a plurality of transmission lines connected respectively between the individual internal circuits of the first and second circuit units. A plurality of load transmission lines are connected respectively to predetermined portions of the individual transmission lines to thereby equalize the loads of the transmission lines.
Abstract:
A synchronous dynamic random access memory capable of accessing data in a memory cell array therein in synchronism with a system clock from an external system such as a central processing unit (CPU). The synchronous DRAM receives an external clock and includes a plurality of memory banks each including a plurality of memory cells and operable in either an active cycle or a precharge cycle, a circuit for receiving a row address strobe signal and latching a logic level of the row address strobe signal in response to the clock, an address input circuit for receiving an externally generated address selecting one of the memory banks, and a circuit for receiving the latched logic level and the address from the address input circuit and for outputting an activation signal to the memory bank selected by the address and an inactivation signals to unselected memory banks when the latched logic level is a first logic level, so that the selected memory bank responsive to the activation signal operates in the active cycle while the unselected memory banks responsive to the inactivation signals operate in the precharge cycle.
Abstract:
A semiconductor memory device includes a semiconductor die and an input-output bump pad part. The semiconductor die includes a plurality of memory cell arrays. The input-output bump pad part is formed in a central region of the semiconductor die. The input-output bump pad part provides a plurality of channels for connecting each of the memory cell arrays independently to an external device. The semiconductor memory device may adopt the multi-channel interface, thereby having high performance with relatively low power consumption.
Abstract:
A stacked layer type semiconductor device includes N memories each including at least one main via and (N−1) sub vias, the N memories being sequentially stacked on one-another so that central axes of the N memories face each other crosswise, and a plurality of connection units electrically connecting the N memories. Here, N is a natural number greater than 1.