公开(公告)号：US08643170B2

公开(公告)日：2014-02-04

申请号：US13442878

申请日：2012-04-10

申请人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L23/34

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

摘要翻译： 半导体管芯安装在散热片阵列框架结构上。 散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。 半导体管芯与绝缘基板上的电触点电连接。 半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

公开(公告)号：US08202222B2

公开(公告)日：2012-06-19

申请号：US11975091

申请日：2007-10-16

申请人： Jinzhong Yao ,  Wenping Zhou ,  Zhiqiang Chen

发明人： Jinzhong Yao ,  Wenping Zhou ,  Zhiqiang Chen

IPC分类号： A61B8/00

CPC分类号： G01S7/5208 ,  A61B8/483 ,  G01S15/8925 ,  G10K11/345 ,  G10K11/346

摘要： An ultrasonic image scanning system for scanning an organic object includes a 2D array probe constructed with transducer elements in both azimuth and elevation dimension. There is a multiplexer disposed in one dimension to route the transducer elements to system front-end channels, while the other dimension can sum into the first dimension with various element number.

摘要翻译： 用于扫描有机物体的超声波图像扫描系统包括由方位角和仰角尺寸的换能器元件构成的2D阵列探针。 有一个多路复用器设置在一个维度上以将换能器元件路由到系统前端通道，而另一个尺寸可以与各种元件数量相加到第一维度中。

公开(公告)号：US20110193237A1

公开(公告)日：2011-08-11

申请号：US13004029

申请日：2011-01-11

申请人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

发明人： Bin Tian ,  Nan Xu ,  Jinzhong Yao

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for assembling a semiconductor package includes a rapid cooling step after post mold curing of an encapsulation material. The rapid cooling step includes blowing chilled, compressed air over the package for about two minutes. The rapid cooling step does not require any clamping pressure be simultaneously applied to the package. The rapid cooling step reduces a temperature of the encapsulation material from a curing temperature to the cooled temperature within a maximum period of less than five minutes. By using rapid cooling, as opposed to cooling the package under a clamping pressure with ambient air, package warpage due to CTE mismatches is prevented.

摘要翻译： 一种组装半导体封装的方法包括在封装材料的后模塑固化之后的快速冷却步骤。 快速冷却步骤包括将冷却的压缩空气吹在包装上约两分钟。 快速冷却步骤不需要同时对包装施加任何夹紧压力。 快速冷却步骤将封装材料的温度从低于5分钟的最长时间内将固化温度降低到冷却温度。 通过使用快速冷却，与在环境空气下的夹紧压力下冷却封装相反，防止由于CTE错配引起的封装翘曲。

公开(公告)号：US20090236713A1

公开(公告)日：2009-09-24

申请号：US12403400

申请日：2009-03-13

申请人： Xuesong XU ,  Nan XU ,  Jinzhong YAO

发明人： Xuesong XU ,  Nan XU ,  Jinzhong YAO

IPC分类号： H01L23/495 ,  H01L21/60 ,  H01L21/56 ,  B29C45/14

CPC分类号： H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： In a method of packaging a semiconductor IC, a tape is attached to a back surface of a lead frame array, and the lead frame array is held between an upper mold chase and a lower mold chase of a mold, with the back surface of the lead frame array upward. The upper and lower mold chases form an upper cavity and a lower cavity with respect to the lead frame array respectively. A mold compound is injected into the upper and lower cavities respectively. With respect to clearances between leads, between die pads and/or between the leads and the die pads, the mold compound injected into the upper cavity covers the portion of the tape over the clearances before the mold compound injected into the lower cavity fills the clearances, so that the tape is depressed. After curing the mold compound, removing the mold and de-taping, the mold compound filled in the clearances is recessed inward from the back surface, which increases the solderability in the subsequent surface mount process and decreases the possibility of the occurrence of lead short-circuits.

摘要翻译： 在封装半导体IC的方法中，将带附接到引线框架阵列的后表面，并且引线框架阵列保持在模具的上模追逐和下模追逐之间，其中 引线框阵列向上。 上下模具分别相对于引线框架阵列形成上腔体和下腔体。 模具化合物分别注入上腔和下穴。 关于引线之间，芯片之间和/或引线和芯片焊盘之间的间隙，注入上腔的模具复合体在注入到下腔内的模具化合物填充间隙之前在间隙上覆盖磁带的部分 ，使得磁带被压下。 在固化模具化合物之后，除去模具和脱胶，填充间隙的模具化合物从后表面向内凹入，这增加了随后的表面贴装工艺中的可焊性，并且降低了引线短路的可能性， 电路。

公开(公告)号：US09443746B2

公开(公告)日：2016-09-13

申请号：US14562770

申请日：2014-12-07

申请人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L23/495 ,  H01L21/67 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/67126 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.

摘要翻译： 用于模制封装的半导体器件的模具包括夹板，空腔棒和附接机构。 空腔棒具有模具半部，其具有用于模制封装半导体器件的模腔。 模具半部具有齿和相邻齿对之间的空间。 所述齿和所述间隙支撑所述封装半导体器件的引线框架的引线的弯曲。 连接机构将空腔棒固定到夹紧板上，并允许空腔棒相对于夹紧板滑动。 空腔棒的这种滑动使得能够与配合的腔棒正确对准以减少树脂流出的可能性。

公开(公告)号：US20160049318A1

公开(公告)日：2016-02-18

申请号：US14562770

申请日：2014-12-07

申请人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Xingshou Pang ,  Jinzhong Yao

IPC分类号： H01L21/67 ,  H01L21/48 ,  H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/67126 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.

摘要翻译： 用于模制封装的半导体器件的模具包括夹板，空腔棒和附接机构。 空腔棒具有模具半部，其具有用于模制封装半导体器件的模腔。 模具半部具有齿和相邻齿对之间的空间。 所述齿和所述间隙支撑所述封装半导体器件的引线框架的引线的弯曲。 连接机构将空腔棒固定到夹紧板上，并允许空腔棒相对于夹紧板滑动。 空腔棒的这种滑动使得能够与配合的腔棒正确对准以减少树脂流出的可能性。

公开(公告)号：US20150028468A1

公开(公告)日：2015-01-29

申请号：US14277061

申请日：2014-05-14

申请人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

发明人： Zhigang Bai ,  Zhijie Wang ,  Jinzhong Yao

IPC分类号： H01L23/08 ,  H01L23/00 ,  H01L21/56

CPC分类号： H01L24/85 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/48245 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.

摘要翻译： 无引线型半导体封装具有形成模体的模盖。 模具体的角部用模具柱加强，使得拐角具有圆形的突起并且不形成90°的角度。 模具柱防止角垫脱落。

公开(公告)号：US20140361421A1

公开(公告)日：2014-12-11

申请号：US13972885

申请日：2013-08-21

申请人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

发明人： Zhigang Bai ,  Jinzhong Yao ,  Yuan Zang

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49517 ,  H01L23/3107 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/06135 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set.

摘要翻译： 基于引线框架的半导体管芯封装包括引线框架，其具有支撑半导体管芯的管芯焊盘和围绕管芯和管芯焊盘的引线指。 模具通过接合线电连接到引线指。 管芯和接合线用密封剂覆盖，引线的端部从密封剂突出。 一组引导指弯曲并向下突出，另一组引导指弯曲并向内突出，并在密封剂的底表面下方。 密封剂包括用于接收第二组的引导指的槽或槽。

公开(公告)号：US08802474B1

公开(公告)日：2014-08-12

申请号：US14219011

申请日：2014-03-19

申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

IPC分类号： H01L21/00 ,  H01L29/84 ,  H01L41/25

CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。

公开(公告)号：US20140127862A1

公开(公告)日：2014-05-08

申请号：US14155309

申请日：2014-01-14

申请人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

发明人： Junhua Luo ,  Jinzhong Yao ,  Baoguan Yin

IPC分类号： H01L21/56

CPC分类号： H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

摘要翻译： 半导体管芯安装在散热片阵列框架结构上。 散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。 半导体管芯与绝缘基板上的电触点电连接。 半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。