公开(公告)号：US06379792B1

公开(公告)日：2002-04-30

申请号：US09611204

申请日：2000-07-06

申请人： Minoru Isshiki ,  Kimio Yamakawa ,  Yoshito Ushio ,  Ryoto Shima ,  Katsutoshi Mine

发明人： Minoru Isshiki ,  Kimio Yamakawa ,  Yoshito Ushio ,  Ryoto Shima ,  Katsutoshi Mine

IPC分类号： B32B2718

CPC分类号： H01L24/29 ,  C08K5/549 ,  C08L2666/44 ,  C09J7/10 ,  C09J183/04 ,  C09J2203/326 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/23 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/31663 ,  C08L83/04 ,  H01L2924/00014 ,  H01L2924/0715 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： A silicone adhesive sheet for bonding a semiconductor chip to a chip attachment component comprising a crosslinkable silicone composition containing a silatrane derivative, and a method for manufacturing a silicone adhesive sheet by subjecting a crosslinkable silicone composition containing a silatrane derivative to a crosslinking reaction between backing materials that do not stick to the crosslinked product of said composition, where at least one of the backing materials has a larger dielectric constant than that of the crosslinked product. The present silicone adhesive sheet allows a semiconductor chip and a chip attachment component to be bonded in a short time at a relatively low temperature.

摘要翻译： 一种用于将半导体芯片接合到芯片附着部件的硅氧烷粘合片，其包含含有硅烷衍生物的可交联硅氧烷组合物，以及通过使含有硅烷衍生物的可交联硅氧烷组合物在背衬材料之间进行交联反应来制造硅氧烷粘合片的方法 其不粘附于所述组合物的交联产物，其中至少一种背衬材料具有比交联产物更大的介电常数。 本发明的硅氧烷粘合片允许半导体芯片和芯片附着部件在较短的时间内以较低的温度结合。

公开(公告)号：US06358804B2

公开(公告)日：2002-03-19

申请号：US09739610

申请日：2000-12-19

申请人： Akihiko Kobayashi ,  Katsutoshi Mine ,  Takashi Nakamura ,  Motoshi Sasaki ,  Kiyotaka Sawa

发明人： Akihiko Kobayashi ,  Katsutoshi Mine ,  Takashi Nakamura ,  Motoshi Sasaki ,  Kiyotaka Sawa

IPC分类号： H01L21336

CPC分类号： H01L21/02134 ,  H01L21/0212 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02337 ,  H01L21/02351 ,  H01L21/312 ,  H01L21/31695 ,  H01L21/76801 ,  H01L21/76825 ,  H01L21/76828 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： A method for forming thin films on substrates wherein the films are produced by applying a solution of an electrically insulating, heat-curing resin onto the substrate, evaporating the solvent and exposing the resin to high energy radiation to cure the resin. The resin solution contains a substance selected from solvents and gas generating additives that causes the dedensification of the film during the cure of the resin. This results in a film having a dielectric constant of below 2.7. A semiconductor device is also disclosed as having an interconnect structure including at least one electrically conductive layer with an interposed insulating layer having a dielectric constant of less than 2.7 wherein the insulating layer is produced by the method described above.

摘要翻译： 在基板上形成薄膜的方法，其中通过将电绝缘的热固化树脂的溶液施加到基板上，蒸发溶剂并将树脂暴露于高能辐射以固化树脂来制造薄膜。 树脂溶液含有选自溶剂和气体发生添加剂的物质，其在树脂固化期间引起薄膜的强化。 这导致介电常数低于2.7的膜。 半导体器件还被公开为具有互连结构，该互连结构包括具有介电常数小于2.7的中间绝缘层的至少一个导电层，其中绝缘层通过上述方法制造。

公开(公告)号：US6025435A

公开(公告)日：2000-02-15

申请号：US654493

申请日：1996-05-28

申请人： Kimio Yamakawa ,  Noriyasu Yokoyama ,  Katsutoshi Mine

发明人： Kimio Yamakawa ,  Noriyasu Yokoyama ,  Katsutoshi Mine

IPC分类号： C08K3/22 ,  C08L83/04 ,  C08L83/05 ,  C08L83/06 ,  C08L83/07 ,  C08L83/02

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/24 ,  C08G77/70

摘要： A thermally conductive silicone rubber composition comprised of (A) 100 parts by weight of an organopolysiloxane that contains at least two silicon-bonded alkenyl groups per molecule, (B) 0.1 to 50 parts by weight of an organohydrogenpolysiloxane that contains at least two silicon-bonded hydrogen atoms molecule, (C) 0.1 to 10 parts by weight of organosiloxane that contains at least one silicon-bonded alkoxy group per silicon-bonded hydroxyl per molecule, (D) 300 to 1200 parts by weight of fine alumina powder comprised of (i) 5 to 95 wt % of spherical or nonspherical fine powder of an average particle diameter of up to 10 .mu.m and of (ii) 95 to 5 wt % of spherical or nonspherical fine alumina powder of an average particle diameter of 10 to 50 .mu.m, and (E) a catalytic quantity a hydrosilylation reaction catalyst.

摘要翻译： 一种导热硅橡胶组合物，其包含（A）每分子含有至少两个硅键合的烯基的有机聚硅氧烷100重量份，（B）0.1至50重量份的含有至少两个硅键的烯基的有机基聚硅氧烷， 键合氢原子分子，（C）每分子含硅键羟基含有至少一个与硅键合的烷氧基为0.1〜10重量份的有机硅氧烷，（D）300〜1200重量份由（ i）5〜95重量％的平均粒径为10μm以下的球状或非球形的细粉末和（ii）95〜5重量％的平均粒径为10〜50的球状或非球形的微细氧化铝粉末 （E）催化量的氢化硅烷化反应催化剂。

公开(公告)号：US5891969A

公开(公告)日：1999-04-06

申请号：US795919

申请日：1997-02-05

申请人： Katsutoshi Mine ,  Takae Takeuchi ,  Kimio Yamakawa

发明人： Katsutoshi Mine ,  Takae Takeuchi ,  Kimio Yamakawa

IPC分类号： C08G59/30 ,  C08G59/32 ,  C08G59/40 ,  C08L63/00 ,  C08L83/04 ,  C08L83/06 ,  H01L23/24 ,  H01L23/29 ,  H01L23/31 ,  C08L63/02

CPC分类号： H01L23/296 ,  C08G59/306 ,  C08G59/3254 ,  C08L63/00 ,  C08L83/04 ,  C08L83/06 ,  H01L23/24 ,  C08G77/10 ,  C08G77/12 ,  C08G77/14 ,  C08G77/70 ,  H01L2224/48091 ,  H01L2224/73265

摘要： A curable epoxy resin composition comprising (A) a curable epoxy resin and (B) an organopolysiloxane prepared by equilibrium polymerization and having the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.din which R.sup.1 is an epoxy-functional monovalent organic group, R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group having no more than 4 carbon atoms, a>0, b>0, d>0 and c.gtoreq.0. Also, an electronic component coated with a product obtained by curing the aforesaid composition

摘要翻译： 一种可固化环氧树脂组合物，其包含（A）可固化环氧树脂和（B）通过平衡聚合制备并具有平均单元式（R1SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（R3O1 / 2）其中R1是环氧官能的一价有机基团，R 2是一价烃基，R 3是氢原子或不超过4个碳原子的烷基，a> 0，b> 0，d> 0和 c> / = 0。 另外，涂覆有通过固化上述组合物获得的产品的电子部件

公开(公告)号：US5877228A

公开(公告)日：1999-03-02

申请号：US926112

申请日：1997-09-09

申请人： Katsutoshi Mine ,  Hiroyoshi Naito ,  Kimio Yamakawa

发明人： Katsutoshi Mine ,  Hiroyoshi Naito ,  Kimio Yamakawa

IPC分类号： C08F2/48 ,  C08J3/28

CPC分类号： C08J3/28 ,  C08J2383/04

摘要： Method for curing UV-curable silicone compositions, characterized by the formation of cured silicone, having a low-tack surface that is harder than the interior, by exposing an ultraviolet-curable silicone composition to ultraviolet radiation at a ratio of the exposure dose for wavelengths of 200 to 280 nm (excluding 280 nm) to the exposure dose for wavelengths of 280 to 400 nm of 0.5 to 10.0.

摘要翻译： 固化可UV固化的有机硅组合物的方法，其特征在于形成固化的硅氧烷，其具有比内部更硬的低粘性表面，通过将紫外线固化的硅氧烷组合物暴露于紫外线辐射下，以波长的曝光剂量 为200〜280nm（不包括280nm），对于波长为280〜400nm的曝光剂量为0.5〜10.0。

公开(公告)号：US5338817A

公开(公告)日：1994-08-16

申请号：US155894

申请日：1993-11-23

申请人： Katsutoshi Mine ,  Takashi Nakamura ,  Motoshi Sasaki

发明人： Katsutoshi Mine ,  Takashi Nakamura ,  Motoshi Sasaki

IPC分类号： C08G77/04 ,  C08G77/06 ,  C08G77/12 ,  C08G77/32 ,  C08G77/34

CPC分类号： C08G77/12

摘要： Disclosed is a method for the preparation of high molecular-weight silicone resins that have excellent storage stability in solution form. The method comprises the hydrolysis and condensation of a disiloxane and an alkyl silicate in an aqueous solution which contains at least 30 weight % alcohol and at least 5 weight % inorganic acid followed by isolation of the resin with an organic solvent which is poorly soluble in water and which has a dielectric constant of at least 4.

摘要翻译： 公开了一种制备溶液形式具有优异储存稳定性的高分子量有机硅树脂的方法。 该方法包括在含有至少30重量％醇和至少5重量％无机酸的水溶液中水解和缩合二硅氧烷和硅酸烷基酯，然后用难溶于水的有机溶剂分离树脂 并且其介电常数至少为4。

公开(公告)号：US5036024A

公开(公告)日：1991-07-30

申请号：US580054

申请日：1990-09-10

申请人： Katsutoshi Mine ,  Akemi Kogo ,  Kimio Yamakawa ,  Kazumi Nakayoshi

发明人： Katsutoshi Mine ,  Akemi Kogo ,  Kimio Yamakawa ,  Kazumi Nakayoshi

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L25/065

CPC分类号： H01L21/56 ,  H01L23/293 ,  H01L23/3135 ,  H01L25/0652 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1301 ,  H01L2924/181 ,  Y10T29/49121

摘要： Semiconductor devices which comprise a semiconductor chip, electrically conductive materials for connections to external leads, and encapsulated by a sealing resin has a surface and a portion of the electrically conductive material covered with a hardened silicone layer whose surface is exposed to ultraviolet radiation and the irradiation processed surface adheres to and is unified with the sealing resin. The sealing resin does not break easily when the device is exposed to heat cycles, thermal shock, repeated interruptions in current flow, and long periods of time at high temperature or low temperature. Such devices also exhibit excellent properties of moisture resistance, corrosion resistance and stress relaxation.

公开(公告)号：US4985342A

公开(公告)日：1991-01-15

申请号：US268109

申请日：1988-11-07

申请人： Naohiro Muramoto ,  Katsutoshi Mine

发明人： Naohiro Muramoto ,  Katsutoshi Mine

IPC分类号： C08G77/04 ,  G03C5/16 ,  G03F7/075 ,  G03F7/20 ,  G03F7/26 ,  H01L21/027 ,  H01L21/30 ,  G03C1/72

CPC分类号： G03F7/0757

摘要： Pattern-forming material useful in producing highly accurate submicron patterns having unusually high aspect ratios at superior resolutions are obtained by using a solvent-soluble polyorganosiloxane having SiO.sub.4/2 units and at least one other organosiloxane unit which contains a high energy radiation sensitive group. The polyorganosiloxane has a softening temperature greater than room temperature.

公开(公告)号：US4033924A

公开(公告)日：1977-07-05

申请号：US735721

申请日：1976-10-26

申请人： Katsutoshi Mine ,  Minoru Nishio ,  Shinichi Sumimura

发明人： Katsutoshi Mine ,  Minoru Nishio ,  Shinichi Sumimura

IPC分类号： C09K3/10 ,  C08K5/14 ,  C08L83/00 ,  C08L83/04 ,  C09J183/00

CPC分类号： C08K5/54 ,  C08K5/14 ,  C08G77/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/70

摘要： There is disclosed heat curable organopolysiloxane compositions which contain adhesion additives which are organosilicon compounds which contain an epoxy functional group and at least one alkyl group or low molecular weight alkenyl group or hydrogen atom bound to silicon.

摘要翻译： 公开了含有粘合添加剂的可热固化的有机聚硅氧烷组合物，其是含有环氧官能团和至少一个与硅结合的烷基或低分子量链烯基或氢原子的有机硅化合物。

公开(公告)号：US07766218B2

公开(公告)日：2010-08-03

申请号：US12067648

申请日：2006-09-20

申请人： Kimio Yamakawa ,  Katsutoshi Mine

发明人： Kimio Yamakawa ,  Katsutoshi Mine

IPC分类号： B23K31/02 ,  B23K35/34

CPC分类号： H05K3/321 ,  B22F1/004 ,  B22F1/0062 ,  B22F2998/00 ,  H01B1/22 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12044 ,  H05K1/097 ,  H05K2201/10636 ,  H05K2203/1131 ,  Y02P70/611 ,  B22F3/10 ,  H01L2924/00

摘要： To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the like. A pasty silver particle composition comprising nonspherical silver particles having an average particle diameter of 0.1 to 18 μm and a carbon content of not more than 1.0% by weight and a volatile dispersion medium, wherein, upon heating, the volatile dispersion medium is volatilized and the nonspherical silver particles are sintered to one another to form solid silver. There are also provided a process for producing solid silver comprising heating the pasty silver particle composition, solid silver having excellent strength, electric conductivity and thermal conductivity, a method for joining a metallic member using the pasty silver particle composition, and a production process of a printed wiring board comprising silver wiring.

摘要翻译： 提供糊状银粒子组合物，其在加热时允许银颗粒容易地烧结以形成具有优异强度，导电性和导热性的固体银以及固体银等的制备方法。 一种糊状银粒子组合物，其包含平均粒径为0.1〜18μm，碳含量为1.0重量％以下的非球状银粒子和挥发性分散介质，其中，在加热时，挥发性分散介质挥发， 非球形银颗粒彼此烧结以形成固体银。 还提供了一种制备固体银的方法，包括加热糊状银颗粒组合物，具有优异强度，导电性和导热性的固体银，使用糊状银颗粒组合物接合金属构件的方法和 包括银线的印刷线路板。