摘要:
Forming a green multi-layer component with an embedded pattern of barrier material, which may be in the form of a positive pattern to form a recessed area or in the form of a negative pattern to form raised areas on the component. Peripheral channels are machined into the green laminate surface to outline each negative or positive pattern feature, the channels being cut deep and wide enough to contact and overlap the edges of the barrier material. The layer of barrier material and the overlying layer(s) of ceramic material are separated from the remainder of the component to produce a non-planar part having raised areas in the case of a negative pattern of barrier material or a part having recessed areas in the case of a positive pattern of barrier material. An apparatus and process to control the machining depth of cut using both AC and DC sensing techniques is disclosed. The non-planar component may be provided with recessed surface metallurgy, such as seal bands and filled via connections, which can survive planarization.
摘要:
Forming a green multi-layer component with an embedded pattern of barrier material, which may be in the form of a positive pattern to form a recessed area or in the form of a negative pattern to form raised areas on the component. Peripheral channels are machined into the green laminate surface to outline each negative or positive pattern feature, the channels being cut deep and wide enough to contact and overlap the edges of the barrier material. The layer of barrier material and the overlying layer(s) of ceramic material are separated from the remainder of the component to produce a non-planar part having raised areas in the case of a negative pattern of barrier material or a part having recessed areas in the case of a positive pattern of barrier material. An apparatus and process to control the machining depth of cut using both AC and DC sensing techniques is disclosed. The non-planar component may be provided with recessed surface metallurgy, such as seal bands and filled via connections, which can survive planarization.
摘要:
A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.
摘要:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
摘要:
A method and structure to form surface plating metallization on a substrate. Two layers of tape are applied to the surface of the substrate. A first path is cut through both layers of tape exposing the substrate surface. The first path connects at least one conductive via on the top surface of the substrate. A second path is cut through the second layer of tape exposing the first layer of tape. The second path is routed from the first path to an edge of the substrate A seed layer is deposited over the surface of the second layer of tape thereby creating a seeded plating path in the first path and a sacrificial seeded conduction path in the second path. Connecting the sacrificial seeded conduction path to a plating potential at the edge of the substrate creates a plated path on the surface of the substrate. The sacrificial path is removed when the tape is removed.
摘要:
The present invention is a workpiece support apparatus and method of making of using the same. A holding fixture frame supports the workpiece about the perimeter and also locates the workpiece. A series of support wires keep the workpiece from sagging inside the holding fixture frame. The support wires provide support while allowing top and bottom access to the workpiece. The workpiece remains flat at the point of the machining operation.
摘要:
A punched slug removal system for punching a slug from a workpiece and removing the punched slug. The system includes a punch having a reciprocating travel path with a transition point where the punch changes direction. A die plate has an aperture into which a die bushing may be disposed. The die bushing provides support for the workpiece and has an opening through which the punch and a slug pass. A manifold supports the die plate and (if present) the die bushing and has a distribution channel and an orifice which direct a gas flow onto a slug attached to the punch in a direction perpendicular to the reciprocating travel path of the punch to remove the slug from the punch. The distribution channel is tapered to increase the velocity of the gas flow. The orifice is positioned at the top of the manifold adjacent the transition point of the reciprocating travel path of the punch. The manifold extends into the aperture of the die plate, reducing the cross sectional area of the aperture, and has a step formed under the punch. The system also includes a vacuum, offset relative to the punch and applied to the side of the punch opposite the orifice, to enhance removal of slugs from the punch.
摘要:
A desired design for electronic structures is converted into a graphic design format and sorted into a pseudo-raster format corresponding to scan lines. A laser or other machining beam is controlled by a separate tracking beam utilizing a mid-objective scanning system. The firing frequency of the machining beam is determined by the position of the tracking beam on a detector, as compared to the scan line data. Accuracy is verified by detection of plume or spectra generated during machining. Alignment of the machining and tracking beams is by interferometric methods. The system improves optical performance parameters of telecentricity, angle of scanned beam line, location of line in which the scanned line resides, astigmatism and field curvature.
摘要:
A desired design for electronic structures is converted into a graphic design format and sorted into a pseudo-raster format corresponding to scan lines. A laser or other machining beam is controlled by a separate tracking beam utilizing a mid-objective scanning system. The firing frequency of the machining beam is determined by the position of the tracking beam on a detector, as compared to the scan line data. Accuracy is verified by detection of plume or spectra generated during machining. Evaluation and alignment of the machining and tracking beams is by interferometric methods. The system improves optical performance parameters of telecentricity, angle of scanned beam line, location of line in which the scanned line resides, astigmatism and field curvature.
摘要:
A process of forming an aperture in a metallic sheet including the steps of:a) defining at least one feature in a sheet of metallic material;b) laser drilling the at least one feature but not entirely removing it from the metallic sheet, the at least one feature being partially filled by metallic material which has melted and resolidified; and thenc) chemically etching the metallic sheet and the melted and resolidified metallic material wherein the etchant attacks and at least partially dissolves the melted and resolidified metallic material, weakening the bond of the melted and resolidified metallic material to the metallic sheet.