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11.发明授权Method for manufacturing component built-in module, and component built-in module 失效组件内置模块的制造方法和组件内置模块公开(公告)号：US07488895B2
公开(公告)日：2009-02-10
申请号：US10573717
申请日：2004-09-27
申请人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Yasushi Taniguchi , Seiichi Nakatani
发明人： Yoshitake Hayashi , Masayoshi Koyama , Satoru Yuhaku , Kazuo Otani , Susumu Matsuoka , Yasushi Taniguchi , Seiichi Nakatani
IPC分类号： H05K1/03
CPC分类号： H01L23/5389 , H01L21/4857 , H01L23/49833 , H01L23/5385 , H01L25/0657 , H01L2225/06517 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2924/0002 , H05K1/186 , H05K1/187 , H05K3/20 , H05K3/4069 , H05K3/4614 , H05K3/462 , H05K2201/10378 , H05K2203/0191 , Y10T29/49165 , H01L2924/00
摘要： A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.
摘要翻译： 本发明的组件内置模块包括：第一布线图案; 安装在所述第一布线图案上的电子部件; 第二布线图案; 电气绝缘片，其中内置有电气部件，电绝缘片设置在第一布线图案和第二布线图案之间; 以及形成在穿过所述电绝缘片的通孔中的通孔导体，所述通孔导体电连接所述第一布线图案和所述第二布线图案。 通孔导体的侧面在通孔导体的轴线方向上形成连续的线。 因此，可以提供具有优异的电连接可靠性的组件内置模块。
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公开(公告)号：US20050136751A1
公开(公告)日：2005-06-23
申请号：US11062620
申请日：2005-02-23
申请人： Takashi Inada , Koji Kaneda , Yasushi Taniguchi , Masashi Fujino , Fusatoshi Araki , Toyokazu Machida
发明人： Takashi Inada , Koji Kaneda , Yasushi Taniguchi , Masashi Fujino , Fusatoshi Araki , Toyokazu Machida
CPC分类号： H01R43/20 , Y10T29/49169 , Y10T29/49174 , Y10T29/5187 , Y10T29/53078 , Y10T29/53083 , Y10T29/53213 , Y10T29/53235 , Y10T29/53239 , Y10T29/53243
摘要： A method for manufacturing a sub-harness comprises the steps of: holding a first connector housing in a guiding device for terminal insertion; holding a second connector housing in a continuity check tool; bringing a terminal at a first end of an electric wire with terminals at the both ends thereof into contact with a touch contact to make a specified light emitter of light emitters in the guiding device emit, said touch contact being connected to the guiding device via a main control device, said touch contact having a curved contact surface; inserting the terminal at the first end into a specified terminal-receiving chamber of terminal-receiving chambers in the first connector housing to bring the terminal at the first end into contact with a specified terminal contact of terminal contacts in the guiding device, said specified chamber being illuminated by said light emitter; and checking continuity between terminals at the first end and at a second end of the electric wire with a continuity check control device which is connected to the continuity check tool and the specified terminal contact, said terminal at the second end having been inserted into the second connector housing.
摘要翻译： 一种用于制造子束的方法包括以下步骤：将第一连接器壳体保持在用于端子插入的引导装置中; 在连续性检查工具中保持第二连接器壳体; 将端子设置在电线的第一端处，其两端的端子与触摸触点接触，以使引导装置中的指定的发光体发射器发射，所述触摸触点经由引导装置连接到引导装置 主控装置，所述触点具有弯曲的接触表面; 将第一端的端子插入第一连接器壳体中的端子容纳室的指定的端子容纳室中，以使端子在第一端与引导装置中的端子触点的指定端子触点接触，所述指定的室 被所述光发射器照亮; 以及连接到导通性检查工具和指定的端子触点的连续性检查控制装置，检查电线的第一端和第二端的端子之间的导通性，将第二端的端子插入第二端 连接器外壳。
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公开(公告)号：US5855641A
公开(公告)日：1999-01-05
申请号：US739928
申请日：1996-10-30
申请人： Yasushi Taniguchi
发明人： Yasushi Taniguchi
CPC分类号： C03B11/086 , C23C16/0245 , C23C16/0263 , C23C16/26 , C03B2215/24 , Y02P40/57 , Y10S425/808
摘要： Molds for press molding an optical element of glass are disclosed. Proposed are: (1) A mold contains oxygen at the interface between a mold base of the mold and a carbon film formed at least on the molding surface of the mold base with an oxygen amount of 0-10 atom % and with the interface of a width of 0-500 .ANG., (2) a mold subjected to carbon ion injection at least on the molding surface of the mold base, and (3) a mold subjected to ion injection during or after formation of a carbon film at least on the molding surface of the mold base material.
摘要翻译： 公开了用于压制玻璃的光学元件的模具。 提出：（1）模具在模具的模具底座与至少在模具底座的模制表面上形成的碳膜之间的界面处含氧，氧量为0-10原子％，并且与 宽度为0-500安培，（2）至少在模具底座的模制表面上进行碳离子注入的模具，和（3）至少在形成碳膜之前或之后进行离子注入的模具 模具基材的成型表面。
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公开(公告)号：US5705272A
公开(公告)日：1998-01-06
申请号：US426178
申请日：1995-04-21
申请人： Yasushi Taniguchi
发明人： Yasushi Taniguchi
IPC分类号： G03G15/20
CPC分类号： G03G15/2064 , Y10T428/30
摘要： A heating member having a lubricating and protective layer on the surface thereof, wherein the lubricating and protective layer is a vapor deposited layer which is made of carbon or the main component of which is carbon; and the lubricating and protective layer is formed on a separation-preventive layer for preventing separation of the lubricating and protective layer. The heating member according to the present invention for use in a heat fixing apparatus enables the heat fixing apparatus to maintain excellent wear resistance and sliding characteristics for a long time. Furthermore, the fixing speed can be raised and the size of an image that can be fixed can be enlarged, and thus the running cost can be reduced.
摘要翻译： 一种在其表面具有润滑和保护层的加热构件，其中润滑和保护层是由碳或其主要成分为碳的碳制成的气相沉积层; 并且润滑保护层形成在用于防止润滑和保护层分离的防分离层上。 根据本发明的用于热定影装置的加热构件使得热定影装置能够长时间保持优异的耐磨性和滑动特性。 此外，可以提高定影速度，并且可以扩大可以固定的图像的尺寸，从而可以降低运行成本。
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公开(公告)号：US5702910A
公开(公告)日：1997-12-30
申请号：US569461
申请日：1995-12-08
CPC分类号： G01N33/6893 , C07K16/26 , G01N2333/58 , Y10S435/96 , Y10S436/808 , Y10S436/811 , Y10S530/808 , Y10S530/809 , Y10S530/829
摘要： The present invention relates to a sandwich immunoassay for rapidly and readily measuring N-peptide using two kinds of monoclonal antibodies recognizing different portions of the N-peptide. The method for measuring N-peptide or a precursor thereof includes the steps of: incubating a mixture containing a sample and a first monoclonal antibody recognizing a portion of N-peptide; adding a labelled second monoclonal antibody recognizing a portion of N-peptide to the mixture, followed by further incubation; and detecting the resulting antigen-antibody complex in the mixture. Alternatively, the method includes the steps of: incubating a mixture containing a sample, a first monoclonal antibody recognizing a portion of N-peptide, and a labelled second monoclonal antibody recognizing another portion of N-peptide; and detecting the resulting antigen-antibody complex.
摘要翻译： 本发明涉及使用识别N-肽的不同部分的两种单克隆抗体快速且容易地测量N-肽的夹心免疫测定。 用于测量N-肽或其前体的方法包括以下步骤：将含有样品和识别N肽部分的第一单克隆抗体的混合物孵育; 将识别一部分N-肽的标记的第二单克隆抗体加入到混合物中，随后进一步培养; 并检测混合物中得到的抗原 - 抗体复合物。 或者，该方法包括以下步骤：将含有样品的混合物，识别N肽部分的第一单克隆抗体和识别N-肽的另一部分的标记的第二单克隆抗体孵育; 并检测所得到的抗原 - 抗体复合物。
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公开(公告)号：US5676723A
公开(公告)日：1997-10-14
申请号：US786180
申请日：1997-01-21
CPC分类号： C03B11/086 , C03B2215/12 , C03B2215/24 , C03B2215/31 , C03B2215/32 , C03B2215/34 , C03B2215/38 , Y02P40/57 , Y10S425/808
摘要： There is disclosed a mold for pressing molding of an optical element of glass. On at least the molding surface of the mold base of the mold, there is formed a mixing layer which consists of carbon and at least one of the elements constituting the mold base. The atomic percentage of carbon increases toward the molding surface and decreases toward the mold base, while the atomic percentage of the other element decreases toward the surface and increases toward the mold base. The mold may contain an intermediate layer at least on the molding surface of the mold base.
摘要翻译： 公开了一种用于压制玻璃光学元件的模具。 在至少模具的模具底座的模制表面上形成由碳和至少一个构成模底的元件组成的混合层。 碳的原子百分比朝向模制表面增加并且朝向模底部减小，而另一个元素的原子百分比朝向表面减小并且朝向模底增加。 模具可以至少在模具基座的模制表面上包含中间层。
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公开(公告)号：US5662999A
公开(公告)日：1997-09-02
申请号：US336106
申请日：1994-11-04
IPC分类号： B30B15/02 , C03B11/00 , C03B11/08 , C03B40/00 , C04B41/87 , C23C16/02 , C23C16/26 , C03C23/00 , B30B15/00
CPC分类号： C23C16/0272 , C03B11/08 , C23C16/26 , Y02P40/57 , Y10T428/24975 , Y10T428/2916 , Y10T428/30 , Y10T428/31678
摘要： A mold used for press-molding precision parts, such as an optical element formed of glass. A carbon film is formed at least on the molding surface of a matrix of the mold via an intermediate layer or without such a layer. The carbon film is shaped with a carbon ion beam having a desired ion energy such that a plurality of projections having an average height of from 0.5 to 30 nm are arranged at an average pitch of from 5 to 30 nm. Such a shape of the carbon film decreases the surface energy and frictional coefficient of the film and increases adhesion strength of the film to the matrix without impairing the surface roughness of an optical element to be molded. Thus, a resultant mirror surface of the mold is highly durable, free from film peeling and cracks in the formation of glass.
摘要翻译： 用于压制成型精密部件的模具，例如由玻璃形成的光学元件。 至少在模具的基体的模制表面上经由中间层或没有这种层形成碳膜。 碳膜用具有期望的离子能量的碳离子束成形，使得平均高度为0.5至30nm的多个突起以5-30nm的平均间距排列。 碳膜的这种形状降低了膜的表面能和摩擦系数，并且增加了膜对基体的粘合强度，而不损害要模制的光学元件的表面粗糙度。 因此，模具的合成镜面是高度耐用的，没有膜剥离和玻璃形成中的裂纹。
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公开(公告)号：US08887383B2
公开(公告)日：2014-11-18
申请号：US12518358
申请日：2007-11-27
CPC分类号： H01L24/12 , H01L21/6835 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/742 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/11003 , H01L2224/11522 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13171 , H01L2224/1329 , H01L2224/133 , H01L2224/16 , H01L2224/83555 , H01L2924/00013 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K3/244 , H05K3/3484 , H05K3/3489 , H05K2201/0338 , H05K2203/0425 , H05K2203/043 , H05K2203/083 , H05K2203/087 , Y10T29/49128 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： An electrode structure 100 on which a solder bump is placed includes an electrode pattern 50 made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layer 52 formed on a part of the electrode pattern 50, a Pd layer 54 formed on at least a part of a region other than the part of the electrode pattern 50, and an Au layer 56 formed on the Ni layer 52 and the Pd layer 54.
摘要翻译： 在其上放置焊料凸块的电极结构100包括由选自Cu，Al，Cr和Ti的电极构成材料制成的电极图案50，形成在电极图案的一部分上的Ni层52 50，形成在除了电极图案50的一部分以外的区域的至少一部分上的Pd层54以及形成在Ni层52和Pd层54上的Au层56。
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公开(公告)号：US08297488B2
公开(公告)日：2012-10-30
申请号：US12282774
申请日：2007-02-22
申请人： Seiji Karashima , Yasushi Taniguchi , Seiichi Nakatani , Kenichi Hotehama , Takashi Kitae , Susumu Sawada
发明人： Seiji Karashima , Yasushi Taniguchi , Seiichi Nakatani , Kenichi Hotehama , Takashi Kitae , Susumu Sawada
CPC分类号： H05K3/3484 , H01L24/11 , H01L2224/11522 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01055 , H01L2924/01078 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/15788 , H05K2203/0425 , H05K2203/083 , H05K2203/087 , H01L2924/00
摘要： A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.
摘要翻译： 在布线基板31的电极32上形成凸块19的方法包括以下步骤：（a）将含有导电粒子16和气泡发生剂的流体14供给到布线板31上的包括电极32的第一区域17上 ; （b）设置具有形成在电极32附近的壁面45的基板40，以形成流体14的弯液面55，使得基板40面向布线板31; 和（c）加热流体14以从包含在流体14中的气泡生成剂产生气泡30。
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公开(公告)号：US20100044091A1
公开(公告)日：2010-02-25
申请号：US12518358
申请日：2007-11-27
CPC分类号： H01L24/12 , H01L21/6835 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/742 , H01L2224/0401 , H01L2224/0558 , H01L2224/05644 , H01L2224/11003 , H01L2224/11522 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13166 , H01L2224/13171 , H01L2224/1329 , H01L2224/133 , H01L2224/16 , H01L2224/83555 , H01L2924/00013 , H01L2924/01002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H05K3/244 , H05K3/3484 , H05K3/3489 , H05K2201/0338 , H05K2203/0425 , H05K2203/043 , H05K2203/083 , H05K2203/087 , Y10T29/49128 , Y10T29/49144 , Y10T29/49147 , Y10T29/49155 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： An electrode structure 100 on which a solder bump is placed includes an electrode pattern 50 made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layer 52 formed on a part of the electrode pattern 50, a Pd layer 54 formed on at least a part of a region other than the part of the electrode pattern 50, and an Au layer 56 formed on the Ni layer 52 and the Pd layer 54.
摘要翻译： 在其上放置焊料凸块的电极结构100包括由选自Cu，Al，Cr和Ti的电极构成材料制成的电极图案50，形成在电极图案的一部分上的Ni层52 50，形成在除了电极图案50的一部分以外的区域的至少一部分上的Pd层54以及形成在Ni层52和Pd层54上的Au层56。
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