公开(公告)号：US20200338859A1

公开(公告)日：2020-10-29

申请号：US16927444

申请日：2020-07-13

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Oscar Khaselev ,  Bin Mo ,  Monnir Boureghda ,  Michael T. Marczi ,  Bawa Singh

IPC: B32B15/01 ,  B22F5/00 ,  B22F7/04 ,  C22C32/00 ,  C22C49/00 ,  H01L23/00

Abstract: A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.

公开(公告)号：US10672531B2

公开(公告)日：2020-06-02

申请号：US15326224

申请日：2015-07-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/00 ,  B22F1/02 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12 ,  H05K1/18

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US10465295B2

公开(公告)日：2019-11-05

申请号：US15312799

申请日：2015-05-19

Applicant: Alpha Assembly Solutions Inc

Inventor： Steven Prokopiak ,  Ellen S. Tormey ,  Oscar Khaselev ,  Michael T. Marczi ,  Bawa Singh

IPC: C23F1/16 ,  C23F1/02 ,  H01L21/3213 ,  H01L31/18 ,  H01L31/0224 ,  H01L31/0216 ,  H01L31/0236

Abstract: A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents,

公开(公告)号：US10322471B2

公开(公告)日：2019-06-18

申请号：US15326180

申请日：2015-07-15

Applicant: Alpha Assembly Solutions Inc.

Inventor： Pritha Choudhury ,  Morgana De Avila Ribas ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Ranjit Pandher ,  Ravindra Bhatkal ,  Bawa Singh

IPC: B23K31/02 ,  B23K35/26 ,  B23K35/00 ,  C22C13/00 ,  C22C13/02 ,  B23K1/00 ,  B23K1/002 ,  B23K1/005 ,  B23K1/08 ,  B23K35/02 ,  H01L23/00 ,  B23K101/40 ,  B23K101/42

Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

公开(公告)号：US20190157535A1

公开(公告)日：2019-05-23

申请号：US16257441

申请日：2019-01-25

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Pritha Choudhury ,  Siuli Sarkar ,  Ranjit Pandher ,  Nicholas G. Herrick ,  Amit Patel ,  Ravindra M. Bhatkal ,  Bawa Singh

IPC: H01L33/62 ,  B23K1/005 ,  B23K1/002 ,  H01L23/00 ,  C22C13/02 ,  B23K35/26 ,  B23K1/00 ,  B23K1/08

Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

公开(公告)号：US20180036818A1

公开(公告)日：2018-02-08

申请号：US15549535

申请日：2016-02-10

Applicant: Alpha Assembly Solutions Inc.

Inventor： Steven Dane Prokopiak ,  Sanyogita Arora ,  Ranjit S. Pandher ,  Ellen S. Tormey ,  Bawa Singh

IPC: B23K1/00 ,  B23K3/04 ,  H01R4/04

CPC classification number: B23K1/0016 ,  B23K1/203 ,  B23K3/04 ,  B23K35/00 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/362 ,  B23K2101/36 ,  B23K2101/42 ,  C09J7/10 ,  C09J2201/28 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01R4/04

Abstract: A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.

公开(公告)号：US09786629B2

公开(公告)日：2017-10-10

申请号：US14908986

申请日：2014-07-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Sutapa Mukherjee ,  Harish Hanchina Siddappa ,  Morgana De Avila Ribas ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/00 ,  H01L21/66 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L22/12 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/13101 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81026 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/0133 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00

Abstract: Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

公开(公告)号：US20170106479A1

公开(公告)日：2017-04-20

申请号：US15390861

申请日：2016-12-27

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Sanyogita Arora ,  Siuli Sarkar ,  Anna Lifton ,  Rahul Raut ,  Bawa Singh

IPC: B23K35/362 ,  B23K35/02 ,  C08L93/04 ,  B23K35/36

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  B23K2101/42 ,  C08K11/00 ,  C08L93/04 ,  C08L2205/025 ,  H05K3/3489

Abstract: Flux formulations that remain pliable and tack-free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.

公开(公告)号：US20250026645A1

公开(公告)日：2025-01-23

申请号：US18901595

申请日：2024-09-30

Applicant: Alpha Assembly Solutions Inc.

Inventor： Nirmalyakumar Chaki ,  Supriya Devarajan ,  Barun Das ,  Chetan Pravinchandra Shah ,  Venodh Manoharan ,  Rahul Raut ,  Bawa Singh ,  Ranjit Pandher

IPC: C01B32/194 ,  B29C51/14 ,  B29K67/00 ,  B29K69/00 ,  C08K3/04 ,  C09K5/14 ,  H01B1/04

Abstract: Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.

公开(公告)号：US20240282742A1

公开(公告)日：2024-08-22

申请号：US18582801

申请日：2024-02-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghosal ,  Remya Chandran ,  Venodh Manoharan ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/00 ,  B22F9/24 ,  B23K35/02 ,  B23K35/30 ,  B82Y40/00

CPC classification number: H01L24/29 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/006 ,  B22F9/24 ,  B23K35/025 ,  B23K35/302 ,  B22F2301/10 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2304/058 ,  B82Y40/00

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.