公开(公告)号：US09942984B1

公开(公告)日：2018-04-10

申请号：US15664031

申请日：2017-07-31

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/09 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/09 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/028 ,  H05K1/0393 ,  H05K9/0084 ,  H05K2201/0715 ,  H05K2201/0723

Abstract: A signal attenuation reduction structure for a flexible circuit board includes a conductive paste coating zones formed on surfaces of high-frequency signal lines and an insulation layer formed on a dielectric layer of the flexible circuit board such that the conductive paste coating zone corresponds to a pair of high-frequency signal lines or covers a plurality of pairs of the high-frequency signal lines. An anisotropic conductive film is formed on surfaces of the insulation layer and the conductive paste coating zone of the flexible circuit board. The anisotropic conductive film is pressed to bond between the conductive paste coating zone and a shielding layer such that the conductive paste coating zone and the shielding layer achieve electrical connection therebetween in a vertical direction through the anisotropic conductive film.

公开(公告)号：US09398692B2

公开(公告)日：2016-07-19

申请号：US14446605

申请日：2014-07-30

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/118 ,  H05K1/0215 ,  H05K1/113 ,  H05K1/144 ,  H05K2201/058

Abstract: An interconnecting conduction structure for electrically connecting conductive traces of a lapped flexible circuit board is disclosed. The lapped flexible circuit board includes a first flexible circuit board and a second flexible circuit board. A through hole is formed in the second flexible circuit board and an interconnecting conduction member is filled in the through hole of the second flexible circuit board. The interconnecting conduction member is electrically connected to a second solder pad of the second flexible circuit board and a first solder pad of the first flexible circuit board in order to formed a lapped connection between conductive traces of the first flexible circuit board and the second flexible circuit board.

Abstract translation: 公开了用于电连接重叠的柔性电路板的导电迹线的互连导电结构。 重叠的柔性电路板包括第一柔性电路板和第二柔性电路板。 在第二柔性电路板中形成通孔，并且在第二柔性电路板的通孔中填充互连导电部件。 互连导电构件电连接到第二柔性电路板的第二焊盘和第一柔性电路板的第一焊盘，以便在第一柔性电路板和第二柔性电路板的导电迹线之间形成重叠连接 板。

公开(公告)号：US09155208B2

公开(公告)日：2015-10-06

申请号：US14138383

申请日：2013-12-23

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K3/4061 ,  H05K1/0283 ,  H05K1/115 ,  H05K1/118 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/1572

Abstract: A conductive connection structure for a conductive wiring layer of a flexible circuit board includes a first through hole and a second through hole formed in a lamination structure including a conductive wiring layer, a first covering layer, and a second covering layer. The first through hole extends through the first covering layer and the conductive wiring layer. The second through hole extends through the second covering layer. The second through hole is formed at a location corresponding to an exposed zone on a second surface of the conductive wiring layer and communicates with the first through hole. A first conductive paste layer is formed on a surface of the first covering layer and fills in the first through hole to form a pillar portion in the first through hole. The pillar portion has a bottom end forming a curved cap. The exposed zone of the second surface of the conductive wiring layer is at least partially covered by the curved cap.

Abstract translation: 用于柔性电路板的导电布线层的导电连接结构包括形成在包括导电布线层，第一覆盖层和第二覆盖层的叠层结构中的第一通孔和第二通孔。 第一通孔延伸穿过第一覆盖层和导电布线层。 第二通孔延伸穿过第二覆盖层。 第二通孔形成在与导电布线层的第二表面上的暴露区相对应的位置处，并与第一通孔连通。 第一导电浆料层形成在第一覆盖层的表面上并填充在第一通孔中，以在第一通孔中形成柱部分。 柱部具有形成弯曲帽的底端。 导电布线层的第二表面的暴露区域至少部分被弯曲的盖子覆盖。

公开(公告)号：US09077168B2

公开(公告)日：2015-07-07

申请号：US13690344

申请日：2012-11-30

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin ,  Kuo-Fu Su

IPC: H01B7/08 ,  H02G15/08 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H02G15/08 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09254

Abstract: A differential mode signal transmission module includes a first section having an external connection end on which at least a pair of differential mode signal transmission terminals are formed and includes a grounding terminal, a first differential mode signal terminal, and a second differential mode signal terminal. The extension connection end of the first section forms a counterpart signal terminals corresponding to those of the external connection end. At least one first conductive connection line is formed on the first section. The conductive connection line connects the grounding terminal of the external connection end of the first section to a collective grounding point. The extension connection end of the first section is connected to an extension section. The extension section is further connected to a second section opposite to the first section. The extension section includes at least one slit line in order to form a bundled section. The first section, the second section, and the extension section include at least one fold line.

Abstract translation: 差分模式信号传输模块包括具有外部连接端的第一部分，在该第一部分上形成有至少一对差模信号传输端子，并且包括接地端子，第一差分模式信号端子和第二差分模式信号端子。 第一部分的延伸连接端形成与外部连接端对应的对应信号端子。 在第一部分上形成至少一个第一导电连接线。 导电连接线将第一部分的外部连接端的接地端子连接到集合接地点。 第一部分的延伸连接端连接到扩展部分。 延伸部分进一步连接到与第一部分相对的第二部分。 延伸部分包括至少一条狭缝线以形成捆扎部分。 第一部分，第二部分和扩展部分包括至少一个折线。

公开(公告)号：US09775249B2

公开(公告)日：2017-09-26

申请号：US15240155

申请日：2016-08-18

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/06 ,  H05K3/18 ,  H05K3/42 ,  H05K3/02 ,  H05K1/09

CPC classification number: H05K3/007 ,  H05K1/0281 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/025 ,  H05K3/064 ,  H05K3/188 ,  H05K3/429 ,  H05K2201/0338 ,  H05K2201/0352 ,  H05K2201/09563 ,  H05K2203/0152

Abstract: Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.

公开(公告)号：US09578747B2

公开(公告)日：2017-02-21

申请号：US14827668

申请日：2015-08-17

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/11 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K1/028 ,  H05K1/0298 ,  H05K3/002 ,  H05K3/426 ,  Y10T29/49165

Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.

Abstract translation: 电路板的通孔的结构包括在载体板上形成布线之后形成的粘合剂层和导体层。 至少一个通孔在垂直方向上穿过载板，布线，粘合剂层和导体层延伸并形成孔壁表面。 导体层相对于垂直方向上的电路迹线的暴露区域显示高度差。 导电覆盖部分覆盖导体层和通孔的孔壁表面。 载板是单面板，双面板，多层板或其组合，单面板，双面板和多层板可以是柔性板， 刚性板，或组合柔性和刚性板的复合板。

公开(公告)号：US09468101B2

公开(公告)日：2016-10-11

申请号：US14659977

申请日：2015-03-17

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  H05K3/06

CPC classification number: H05K1/115 ,  H05K1/0251 ,  H05K1/092 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/0397 ,  H05K2201/09845 ,  H05K2201/09854

Abstract: Disclosed urea microvia structure of a flexible circuit board and a manufacturing method thereof. A first through hole is formed in a first conductive layer of a flexible circuit board and a first exposed zone is defined. A second conductive layer includes a second through hole formed therein and defines a second exposed zone. A dielectric layer includes a dielectric layer through hole corresponding to the second through hole of the second conductive layer. A conductive paste layer is filled in the second through hole of the second conductive layer, the dielectric layer through hole of the dielectric layer, and the first through hole of the first conductive layer in such a way that the conductive paste layer covers and electrically contacts the first exposed zone of the first conductive layer and the second exposed zone of the second conductive layer.

Abstract translation: 柔性电路板的尿素微孔结构及其制造方法。 在柔性电路板的第一导电层中形成第一通孔，并且限定第一暴露区域。 第二导电层包括形成在其中的第二通孔并且限定第二暴露区域。 电介质层包括与第二导电层的第二通孔对应的电介质层通孔。 导电膏层填充在第二导电层的第二通孔，电介质层的电介质层通孔和第一导电层的第一通孔中，导电膏层覆盖并电接触 第一导电层的第一暴露区域和第二导电层的第二暴露区域。

公开(公告)号：US09468099B2

公开(公告)日：2016-10-11

申请号：US14731709

申请日：2015-06-05

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Gwun-Jin Lin

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/118 ,  H05K3/3405 ,  H05K2201/09145 ,  H05K2201/09909 ,  H05K2201/10356 ,  H05K2201/2027

Abstract: Disclosed is contact pad connection structure for connecting a conductor assembly and a flexible circuit board. A substrate has a top surface on which a plurality of elevation pads are formed and respectively located in spacing zones between contact pads. Each of the elevation pads has a height above a top contact surface of the contact pads. The conductor assembly has exposed conductors that are respectively set in contact with the top contact surfaces of the contact pads and a solder material is applied to solder and fix the exposed conductors respectively in position on the top contact surfaces of the contact pads. Each of the elevation pads includes an extension section extended in a direction toward a front edge of the substrate.

Abstract translation: 公开了用于连接导体组件和柔性电路板的接触垫连接结构。 衬底具有其上形成有多个仰角垫的顶表面，并且分别位于接触垫之间的间隔区域中。 每个仰角垫具有高于接触垫的顶部接触表面的高度。 导体组件具有分别设置成与接触焊盘的顶部接触表面接触的暴露的导体，并且施加焊料材料以将暴露的导体分别焊接并固定在接触焊盘的顶部接触表面上的适当位置。 每个仰角垫包括在朝向基板的前边缘的方向延伸的延伸部分。

公开(公告)号：US09271392B2

公开(公告)日：2016-02-23

申请号：US14039068

申请日：2013-09-27

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0237 ,  H05K1/0218 ,  H05K1/0245 ,  H05K1/025 ,  H05K3/4691 ,  H05K2201/09063

Abstract: A rigid-flexible circuit board includes at least one flexible circuit board and at least one rigid circuit board. The flexible circuit board includes a flexible-board substrate, a plurality of flexible circuit board differential mode signal lines, at least one flexible circuit board grounding line, a flexible circuit board insulation layer formed on the upper surface of the flexible-board substrate and covering the flexible circuit board differential mode signal lines and the flexible circuit board grounding line. The rigid circuit board is stacked on the stacking section of the flexible circuit board. A shielding layer is formed on the flexible circuit board insulation layer of the flexible circuit board and corresponds to the extension section of the flexible circuit board. The shielding layer further extends from the extension section to the stacking section. An impedance control structure is formed on the shielding layer to control the impedance of the flexible circuit board differential mode signal lines.

Abstract translation: 刚性柔性电路板包括至少一个柔性电路板和至少一个刚性电路板。 柔性电路板包括柔性电路板基板，多个柔性电路板差模信号线，至少一个柔性电路板接地线，柔性电路板绝缘层，形成在柔性基板基板的上表面和覆盖层 柔性电路板差分信号线和柔性电路板接地线。 刚性电路板堆叠在柔性电路板的堆叠部分上。 屏蔽层形成在柔性电路板的柔性电路板绝缘层上，对应于柔性电路板的延伸部分。 屏蔽层从延伸部分进一步延伸到堆叠部分。 在屏蔽层上形成阻抗控制结构，以控制柔性电路板差模信号线的阻抗。

公开(公告)号：US09225134B2

公开(公告)日：2015-12-29

申请号：US14138364

申请日：2013-12-23

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Gwun-Jin Lin ,  Chih-Heng Chuo ,  Kuo-Fu Su

IPC: H01R35/02 ,  H01R12/61 ,  H05K1/02 ,  H05K1/11 ,  H05K5/02

CPC classification number: H01R35/02 ,  H05K1/028 ,  H05K1/118 ,  H05K5/0226 ,  H05K2201/055 ,  H05K2201/2009 ,  Y10T29/49002

Abstract: Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the connection section and an extended sheet are wound up in a direction towards the terminal distribution section to form the connection section into a rolled body with the extended sheet wrapped around the rolled body to provide an effect of protection. The rolled body is then inserted through a bore of a hinge assembly so that after the rolled body completely passes through the bore of the hinge assembly, the extension section of the flexible circuit board is located in the bore of the hinge assembly and the first end and the second end are respectively set at opposite ends of the bore of the hinge assembly. In other applications, a reinforcement plate is included to reinforce the terminal distribution section of the flexible circuit board.

Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组装结构。 利用形成在作为中心线的预先准备好的柔性电路板上的预折线，将柔性电路板的连接部折叠到端子分配部，然后将连接部和延伸片卷起 在朝向终端分配部分的方向上，将连接部分形成为卷绕体，其中延伸的片材缠绕在卷绕体上以提供保护效果。 然后将卷绕的主体穿过铰链组件的孔插入，使得在卷绕体完全通过铰链组件的孔之后，柔性电路板的延伸部分位于铰链组件的孔中，第一端 并且第二端分别设置在铰链组件的孔的相对端。 在其他应用中，包括加强板以加强柔性电路板的端子分配部分。