公开(公告)号：US4997517A

公开(公告)日：1991-03-05

申请号：US462519

申请日：1990-01-09

Applicant: Arvind Parthasarathi

Inventor： Arvind Parthasarathi

IPC: B32B15/01 ,  H01L23/495 ,  H05K3/38 ,  H05K3/40

CPC classification number: B32B15/01 ,  H01L23/49534 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K3/386 ,  H05K3/4092 ,  Y10T29/49121

Abstract: A multi-metal layer interconnect tape is provided. The tape is not supported by a dielectric carrier. A thin dielectric adhesive layer separates at least two self supporting metal foil layers. In one embodiment of the invention, conductive vias electrically interconnect leads formed in a first metal foil layer with ground and power circuits formed in a second metal foil layer. The metal foil layers are in close proximity so the vias have a low aspect ratio. The vias may be readily coated with continuous film of a conductive metal and are much easier to clean than conventional vias having significantly higher aspect ratios.

Abstract translation: 提供多金属层互连带。 磁带不由电介质载体支撑。 薄的电介质粘合剂层分离至少两个自支撑金属箔层。 在本发明的一个实施例中，导电通孔将形成在第一金属箔层中的引线电连接到在第二金属箔层中形成的接地和功率电路。 金属箔层非常接近，因此通孔具有低纵横比。 通孔可以容易地涂覆有导电金属的连续膜，并且比具有显着更高纵横比的常规通孔更容易清洁。

公开(公告)号：US4552627A

公开(公告)日：1985-11-12

申请号：US670239

申请日：1984-11-13

Applicant: Arvind Parthasarathi

Inventor： Arvind Parthasarathi

IPC: C25D5/16 ,  C25D5/34 ,  H05K3/38 ,  C25D17/00

CPC classification number: C25D5/16 ,  C25D5/34 ,  H05K3/384 ,  H05K3/385 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/0392 ,  H05K2203/0723 ,  H05K2203/1157 ,  Y10T428/12472

Abstract: The present invention relates to a technique for improving the adhesive properties of a metal or metal alloy material by reducing the number of bare spots and unplated regions on each treated surface of the metal or metal alloy material. The technique comprises electrolytically forming a substantially uniform metal oxide layer on at least one surface of the material, chemically converting the oxide layer into a substantially uniform layer of fresh metal, and thereafter electrolytically forming a plurality of dendritic structures on the at least one surface. The technique of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the technique is also described.

Abstract translation: 本发明涉及通过减少金属或金属合金材料的每个处理表面上的裸露点和未镀层区域的数量来提高金属或金属合金材料的粘合性能的技术。 该技术包括在材料的至少一个表面上电解形成基本上均匀的金属氧化物层，将氧化物层化学转化成基本均匀的新鲜金属层，然后在至少一个表面上电解形成多个树枝状结构。 本发明的技术在改进锻铜和铜合金箔的粘合性方面具有特别的用途。 还描述了用于执行该技术的装置。

公开(公告)号：US4549950A

公开(公告)日：1985-10-29

申请号：US670232

申请日：1984-11-13

Applicant: Ned W. Polan ,  Raymond J. Smialek ,  Arvind Parthasarathi

Inventor： Ned W. Polan ,  Raymond J. Smialek ,  Arvind Parthasarathi

IPC: C25D1/04 ,  C25D7/06 ,  C25D21/06 ,  C25D21/18 ,  C25D17/00

CPC classification number: C25D21/06 ,  C25D21/18 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/0723

Abstract: The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.

Abstract translation: 本发明涉及用于生产用于电气和电子应用的改进质量的电沉积和/或处理的金属或金属合金箔的系统和方法。 通过向系统中的每个处理槽提供双过滤系统来改善由系统生产和/或处理的箔的质量。 用于每个罐的双过滤系统包括过滤器调节回路，用于基本上连续地从罐中取出溶液并从排出的溶液中除去颗粒物质，以及用于从溶液中除去表面杂质的系统。 在第一实施例中，表面杂质去除系统包括离线溶液过滤和补充系统。 在第二实施例中，表面杂质去除系统包括浮在溶液表面上的撇渣器。 本发明在用于生产电沉积和/或处理的铜箔的系统中具有特别的用途。

公开(公告)号：US20110010349A1

公开(公告)日：2011-01-13

申请号：US12459949

申请日：2009-07-10

Applicant: Jeffrey Gordon Ellingson ,  Arvind Parthasarathi ,  Padmanabha Vedam

Inventor： Jeffrey Gordon Ellingson ,  Arvind Parthasarathi ,  Padmanabha Vedam

IPC: G06F17/30

CPC classification number: G06Q10/00

Abstract: We have invented a method and device for enabling users of enterprise software products to create, publish, and share reviews of enterprise software products. This useful, concrete and tangible result is accomplished through a server-hosted website accessible through the Internet. There are unique challenges with creating and sharing reviews of enterprise software products (compared to other products), and our invention solves these problems using several new and innovative methods we created, which form the basis of this application. Using this website, users of enterprise software can create a review of a product they are using or deploying, and also view reviews created by other users about the enterprise software products they are interested in. With usage, this invention becomes a global repository of enterprise software product reviews and a resource for users worldwide to share opinions and experiences to help each other evaluate, select, buy, and use enterprise software products.

Abstract translation: 我们发明了一种方法和设备，使企业软件产品的用户能够创建，发布和分享企业软件产品的评论。 这个有用的，具体的和有形的结果是通过可通过互联网访问的服务器托管的网站实现的。 创建和分享企业软件产品评估（与其他产品相比）有独特的挑战，我们的发明使用我们创建的几种新颖创新的方法解决了这些问题，这些方法构成了本应用的基础。 使用本网站，企业软件用户可以对其正在使用或部署的产品进行审查，还可以查看其他用户对其感兴趣的企业软件产品创建的评论。通过使用，本发明成为企业的全球存储库 软件产品评论和资源，供全球用户分享意见和经验，帮助对方评估，选择，购买和使用企业软件产品。

公开(公告)号：US6083633A

公开(公告)日：2000-07-04

申请号：US877020

申请日：1997-06-16

Applicant: Julius C. Fister ,  Szuchain F. Chen ,  Christoper P. Laurello ,  Arvind Parthasarathi ,  Derek E. Tyler

Inventor： Julius C. Fister ,  Szuchain F. Chen ,  Christoper P. Laurello ,  Arvind Parthasarathi ,  Derek E. Tyler

IPC: B32B15/01 ,  H05K3/24

CPC classification number: H05K3/244 ,  B32B15/01 ,  Y10S428/926 ,  Y10S428/929 ,  Y10T428/12493 ,  Y10T428/12632 ,  Y10T428/12694 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12771 ,  Y10T428/12778 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12917

Abstract: An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the formation of a copper/tin intermetallic and the resultant depletion of the free, unreacted, tin utilized as an oxidation and corrosion barrier, a barrier is interposed between the substrate and the coating. In a first embodiment, the barrier is formed from multiple constituent layers, at least one of which is copper. The thickness ("y") of the copper layer is dependent on the anticipated service temperature and satisfies the equation y=(-1.52+0.0871x+0.00859 t).+-.50% where t=anticipated time at the service temperature, x=anticipated service temperature (Celsius), and y=the thickness of the copper layer in microinches. In a second embodiment, the barrier layer is formed from one or more constituent layers, at least one of which is iron or iron base.

Abstract translation: 电导体具有涂覆有锡基涂层的铜基底。 为了抑制铜/锡金属间化合物的形成以及作为氧化和腐蚀屏障使用的游离的未反应的锡的消耗，衬底和涂层之间插入有阻挡层。 在第一实施例中，屏障由多个构成层形成，其中至少一个是铜。 铜层的厚度（“y”）取决于预期的使用温度，满足等式y =（ - 1.52 + 0.0871x + 0.00859 t）+/- 50％，其中t =使用温度下的预期时间，x =预期使用温度（摄氏度），y =微米级铜层的厚度。 在第二实施例中，阻挡层由一个或多个构成层形成，其中至少一个是铁或铁基。

公开(公告)号：US5969414A

公开(公告)日：1999-10-19

申请号：US249104

申请日：1994-05-25

Applicant: Arvind Parthasarathi ,  Deepak Mahulikar

Inventor： Arvind Parthasarathi ,  Deepak Mahulikar

IPC: H01L23/433 ,  H01L23/495 ,  H01L23/02 ,  H01L23/28 ,  H01L23/36 ,  H01L23/48

CPC classification number: H01L23/4334 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85447 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752

Abstract: There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.

Abstract translation: 提供了一种用于封装在聚合物树脂中的引线框架组件，其防止树脂的组装后破裂或膨胀。 引线框架涂有粘附增强层，其将分层所需的剪切应力增加到超过约3.4MPa。 与该粘合增强层结合是将集成电路装置粘合到中央管芯附接浆板上的柔性管芯附着粘合剂。 这种适合的芯片附着粘合剂具有小于1.5MPa /℃的合并因子，Exa为约0.01mm至约0.08mm的厚度。

公开(公告)号：US5573845A

公开(公告)日：1996-11-12

申请号：US352663

申请日：1994-12-09

Applicant: Arvind Parthasarathi ,  William L. Brenneman

Inventor： Arvind Parthasarathi ,  William L. Brenneman

IPC: B32B7/04 ,  B32B15/08 ,  H01R13/405 ,  H01R43/24 ,  H05K1/05 ,  H05K3/20 ,  H05K3/38 ,  H05K3/44 ,  B32B9/00

CPC classification number: H01R43/24 ,  B32B15/08 ,  B32B7/04 ,  H05K3/384 ,  H01R13/405 ,  H05K1/056 ,  H05K2203/0307 ,  H05K2203/0361 ,  H05K3/202 ,  H05K3/44 ,  Y10S428/901 ,  Y10T428/249955

Abstract: There is provided a composite material particularly suited for electrical and electronic applications having a metallic core with a desired surface finish. An acicular superficial coating layer having an apparent thickness of less than 275 angstroms is adjacent to at least a portion of the metallic core. The superficial coating layer is removable from the metallic core without appreciable change to the metallic core surface finish.

Abstract translation: 提供了特别适用于具有所需表面光洁度的金属芯的电气和电子应用的复合材料。 具有小于275埃的表观厚度的针状表面涂层与金属芯的至少一部分相邻。 表面涂层可从金属芯上移除，而金属芯表面光洁度却无明显变化。

公开(公告)号：US5489373A

公开(公告)日：1996-02-06

申请号：US382693

申请日：1995-02-02

Applicant: Arvind Parthasarathi

Inventor： Arvind Parthasarathi

IPC: C25D9/08 ,  C25D5/48

CPC classification number: C25D9/08

Abstract: There is disclosed an aqueous chemical solution that consists essentially of zinc ions, a source of hydroxides, and silicon ions. The ratio of silicon to zinc (Si:Zn) is, by weight from about 1:5 to about 1:250. Within the ratio range, the silicon ions inhibit precipitation of zinc from the chemical solution. This is particularly useful when the chemical solution is an electrolyte for the deposition of zinc or a zinc containing compound onto a metallic structure where a critical zinc content must be maintained to impart adequate adhesion of a coated substrate to a polymer adhesive.

Abstract translation: 公开了一种基本上由锌离子，氢氧化物源和硅离子组成的水性化学溶液。 硅与锌（Si：Zn）的比例为约1:5至约1:250。 在比率范围内，硅离子抑制锌从化学溶液中的沉淀。 当化学溶液是用于将锌或含锌化合物沉积到必须保持临界锌含量以赋予涂覆的基材足够粘合到聚合物粘合剂的金属结构上的电解质时，这是特别有用的。

公开(公告)号：US4749626A

公开(公告)日：1988-06-07

申请号：US879118

申请日：1986-07-03

Applicant: Igor V. Kadija ,  Julius C. Fister ,  Joseph Winter ,  Arvind Parthasarathi

Inventor： Igor V. Kadija ,  Julius C. Fister ,  Joseph Winter ,  Arvind Parthasarathi

IPC: C25D3/60 ,  H05K3/24 ,  B32B15/01

CPC classification number: C23C18/48 ,  C25D21/10 ,  C25D3/60 ,  C25D1/04 ,  H05K3/244 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722

Abstract: The present invention relates to an addition to tin coating solutions for inhibiting the growth of tin whiskers. The addition comprises a concentration of a metal salt selected from the group consisting of palladium salt, silver salt, nickel salt, iron salt, cadmium salt, platinum salt, gold salt, indium salt, ruthenium salt and cobalt salt. In a preferred embodiment, the metal salt addition is either a palladium salt such as palladium chloride or a silver salt such as silver sulfate.

Abstract translation: 本发明涉及添加用于抑制锡晶须生长的锡涂层溶液。 该添加物含有选自钯盐，银盐，镍盐，铁盐，镉盐，铂盐，金盐，铟盐，钌盐和钴盐中的金属盐的浓度。 在优选的实施方案中，金属盐添加物是钯盐如氯化钯或银盐如硫酸银。

公开(公告)号：US5688606A

公开(公告)日：1997-11-18

申请号：US633256

申请日：1996-04-18

Applicant: Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

Inventor： Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

IPC: C25D11/04 ,  H01L23/02 ,  H01L23/04 ,  H01L23/06 ,  H01L23/14 ,  H05K1/05 ,  B32B15/00 ,  B21D39/00 ,  B32B3/00 ,  C25D5/18

CPC classification number: H05K1/056 ,  H01L23/142 ,  H05K1/053 ,  H01L2224/16225 ,  H01L2924/01327 ,  Y10T428/12493 ,  Y10T428/12556 ,  Y10T428/12736 ,  Y10T428/24917

Abstract: There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Abstract translation: 提供了具有增加的击穿电压的阳极氧化铝基板。 通过选择适当的铝合金和适当的加工参数来实现击穿电压的增加。 密封阳极膜通过减少腐蚀来增加击穿电压。 优选的密封剂是具有低固化至高度交联的聚合物的低室温粘度的环氧甲酚酚醛清漆。