公开(公告)号：US5343073A

公开(公告)日：1994-08-30

申请号：US1014

申请日：1993-01-06

Applicant: Arvind Parthasarathi ,  Deepak Mahulikar

Inventor： Arvind Parthasarathi ,  Deepak Mahulikar

IPC: C23C30/00 ,  C22C9/00 ,  C22C9/06 ,  H01L21/56 ,  H01L23/28 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L29/44 ,  H01L29/52 ,  H01L29/62

CPC classification number: H01L23/10 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48618 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85418 ,  H01L2224/85871 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752

Abstract: There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.

Abstract translation: 提供了对聚合物树脂具有增强粘附性的引线框架。 引线框架涂有含有铬和锌混合物的薄层。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架对聚合树脂的粘附性提高。

公开(公告)号：US5578869A

公开(公告)日：1996-11-26

申请号：US413149

申请日：1994-03-29

Applicant: Paul R. Hoffman ,  Deepak Mahulikar ,  George A. Brathwaite ,  Dawit Solomon ,  Arvind Parthasarathi

Inventor： Paul R. Hoffman ,  Deepak Mahulikar ,  George A. Brathwaite ,  Dawit Solomon ,  Arvind Parthasarathi

IPC: H01L23/057 ,  H01L23/31 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/065 ,  H01L23/52 ,  H01L23/34 ,  H01L23/48 ,  H01L23/04

CPC classification number: H01L23/057 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/49894 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/30107

Abstract: There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.

Abstract translation: 提供了用于电子封装的金属部件。 该部件涂覆有非导电层，并且在表面上形成多个导电电路迹线。 电路迹线直接焊接到集成电路器件的输入/输出焊盘和第二多个电路迹线。 该组件可以包括散热器，以增强来自封装的集成电路器件的散热。

公开(公告)号：US5969414A

公开(公告)日：1999-10-19

申请号：US249104

申请日：1994-05-25

Applicant: Arvind Parthasarathi ,  Deepak Mahulikar

Inventor： Arvind Parthasarathi ,  Deepak Mahulikar

IPC: H01L23/433 ,  H01L23/495 ,  H01L23/02 ,  H01L23/28 ,  H01L23/36 ,  H01L23/48

CPC classification number: H01L23/4334 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85447 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752

Abstract: There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.

Abstract translation: 提供了一种用于封装在聚合物树脂中的引线框架组件，其防止树脂的组装后破裂或膨胀。 引线框架涂有粘附增强层，其将分层所需的剪切应力增加到超过约3.4MPa。 与该粘合增强层结合是将集成电路装置粘合到中央管芯附接浆板上的柔性管芯附着粘合剂。 这种适合的芯片附着粘合剂具有小于1.5MPa /℃的合并因子，Exa为约0.01mm至约0.08mm的厚度。

公开(公告)号：US5688606A

公开(公告)日：1997-11-18

申请号：US633256

申请日：1996-04-18

Applicant: Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

Inventor： Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

IPC: C25D11/04 ,  H01L23/02 ,  H01L23/04 ,  H01L23/06 ,  H01L23/14 ,  H05K1/05 ,  B32B15/00 ,  B21D39/00 ,  B32B3/00 ,  C25D5/18

CPC classification number: H05K1/056 ,  H01L23/142 ,  H05K1/053 ,  H01L2224/16225 ,  H01L2924/01327 ,  Y10T428/12493 ,  Y10T428/12556 ,  Y10T428/12736 ,  Y10T428/24917

Abstract: There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Abstract translation: 提供了具有增加的击穿电压的阳极氧化铝基板。 通过选择适当的铝合金和适当的加工参数来实现击穿电压的增加。 密封阳极膜通过减少腐蚀来增加击穿电压。 优选的密封剂是具有低固化至高度交联的聚合物的低室温粘度的环氧甲酚酚醛清漆。

公开(公告)号：US5563442A

公开(公告)日：1996-10-08

申请号：US449503

申请日：1995-05-24

Applicant: Deepak Mahulikar ,  Arvind Parthasarathi

Inventor： Deepak Mahulikar ,  Arvind Parthasarathi

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/32 ,  H01L23/49582 ,  H01L24/48 ,  H05K3/3426 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: There is disclosed a leadframe for electrically interconnecting a semiconductor device to external circuitry. The leadframe has an electrically conductive substrate that is coated with an oxidation resistant external layer. An intervening layer is disposed between a portion of the substrate and the external layer. The intervening layer is absent from the outer lead ends of the leadframe. Subsequent removal of the external layer from the outer lead ends enables a solder to directly contact the leadframe substrate.

Abstract translation: 公开了一种用于将半导体器件电连接到外部电路的引线框架。 引线框架具有涂覆有抗氧化外层的导电基板。 在衬底的一部分和外部层之间设置中间层。 引线框的外引线端不存在中间层。 随后从外部引线端部移除外部层使得焊料能够直接接触引线框架基板。

公开(公告)号：US5540378A

公开(公告)日：1996-07-30

申请号：US126862

申请日：1993-09-27

Applicant: Deepak Mahulikar ,  Arvind Parthasarathi

Inventor： Deepak Mahulikar ,  Arvind Parthasarathi

IPC: H01L23/28 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34 ,  H01L21/58 ,  H01L23/532

CPC classification number: H01L24/32 ,  H01L23/49582 ,  H01L24/48 ,  H05K3/3426 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10689 ,  H05K2201/10909 ,  H05K2201/2081 ,  Y02P70/613

Abstract: There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.

Abstract translation: 公开了一种用于组装电子封装的方法，其中引线框的外引线端可焊接到外部电路，而不需要锡或焊料涂层。 在封装组装之前，在引线框架上沉积抗氧化层。 在外部引线焊接之前去除抗氧化层，提供清洁，无氧化的金属表面进行焊接。

公开(公告)号：US5534356A

公开(公告)日：1996-07-09

申请号：US427921

申请日：1995-04-26

Applicant: Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

Inventor： Deepak Mahulikar ,  Efraim Sagiv ,  Arvind Parthasarathi ,  Satish Jalota ,  Andrew J. Brock ,  Michael A. Holmes ,  Jeffrey M. Schlater ,  German J. Ramirez ,  Dexin Liang

IPC: C25D11/04 ,  H01L23/02 ,  H01L23/04 ,  H01L23/06 ,  H01L23/14 ,  H05K1/05 ,  B32B9/00

CPC classification number: H05K1/056 ,  H01L23/142 ,  H05K1/053 ,  H01L2224/16225 ,  H01L2924/01327 ,  Y10T428/12493 ,  Y10T428/12556 ,  Y10T428/12736 ,  Y10T428/24917

Abstract: There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.

Abstract translation: 提供了具有增加的击穿电压的可阳极氧化的铝基板。 通过选择适当的铝合金和适当的加工参数来实现击穿电压的增加。 密封阳极膜通过减少腐蚀增加击穿电压。 优选的密封剂是具有低固化至高度交联的聚合物的低室温粘度的环氧甲酚酚醛清漆。

公开(公告)号：US5449951A

公开(公告)日：1995-09-12

申请号：US270064

申请日：1994-07-01

Applicant: Arvind Parthasarathi ,  Deepak Mahulikar

Inventor： Arvind Parthasarathi ,  Deepak Mahulikar

IPC: C23C30/00 ,  C22C9/00 ,  C22C9/06 ,  H01L21/56 ,  H01L23/28 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L23/043 ,  H01L23/544

CPC classification number: H01L23/10 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48618 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85418 ,  H01L2224/85871 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/20752

Abstract: There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing chromium, zinc or a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.

Abstract translation: 提供了对聚合物树脂具有增强粘附性的引线框架。 引线框架涂有含有铬，锌或铬和锌的混合物的薄层。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架对聚合树脂的粘附性提高。

公开(公告)号：US4647315A

公开(公告)日：1987-03-03

申请号：US750573

申请日：1985-07-01

Applicant: Arvind Parthasarathi ,  Ned W. Polan

Inventor： Arvind Parthasarathi ,  Ned W. Polan

IPC: C23C22/24 ,  C23C22/33 ,  C23C22/68 ,  C23C22/82 ,  C23C22/83 ,  C23F11/00 ,  H05K3/28

CPC classification number: C23C22/33 ,  C23C22/83 ,  H05K3/282 ,  H05K2203/0307 ,  H05K2203/0723

Abstract: The present invention relates to a technique for improving the tarnish and oxidation resistance of copper and copper base alloy materials. The technique of the present invention involves immersing the copper or copper base alloy material in a dilute aqueous chromic acid-phosphoric acid solution. After emerging from the chromic acid-phosphoric acid solution, the copper or copper base alloy material is preferably rinsed with a dilute aqueous caustic solution and dried. Copper and copper base alloy materials treated in accordance with the present invention have particular utility in printed circuit applications.

Abstract translation: 本发明涉及一种提高铜和铜基合金材料的抗褪色和抗氧化性能的技术。 本发明的技术包括将铜或铜基合金材料浸入稀酸铬酸 - 磷酸水溶液中。 在从铬酸 - 磷酸溶液中出来之后，铜或铜基合金材料优选用稀的苛性碱水溶液冲洗并干燥。 根据本发明处理的铜和铜基合金材料在印刷电路应用中具有特殊的用途。

公开(公告)号：US4549941A

公开(公告)日：1985-10-29

申请号：US670236

申请日：1984-11-13

Applicant: Arvind Parthasarathi ,  Ned W. Polan

Inventor： Arvind Parthasarathi ,  Ned W. Polan

IPC: C25D5/16 ,  C25D5/34 ,  C25D5/48 ,  H05K3/38 ,  C25D5/10 ,  C25D17/00

CPC classification number: C25D5/16 ,  C25D5/34 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/0392 ,  H05K2203/0723 ,  Y10T428/12472

Abstract: The present invention relates to a treatment for improving the adhesive properties of metallic foils to be used in electrical and electronic applications. The treatment of the present invention comprises applying a light substantially uniform layer of metal to at least one surface of the metallic foil just prior to the formation of a plurality of dendritic structures on the surface. The metal layer renders the surface or surfaces to be treated more uniformly electrochemically active and consequently more receptive to the subsequent dendritic treatment. The treatment of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the present treatment is also described.

Abstract translation: 本发明涉及一种用于改善用于电气和电子应用的金属箔的粘合性能的处理。 本发明的处理包括在表面上形成多个树枝状结构之前，在金属箔的至少一个表面上施加光基本均匀的金属层。 金属层使待处理的表面或表面更均匀地具有电化学活性，因此更容易接受后续的树枝状处理。 本发明的处理在提高锻铜和铜合金箔的粘合性方面具有特别的用途。 还描述了用于执行本处理的装置。