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公开(公告)号：US5688606A
公开(公告)日：1997-11-18
申请号：US633256
申请日：1996-04-18
申请人： Deepak Mahulikar , Efraim Sagiv , Arvind Parthasarathi , Satish Jalota , Andrew J. Brock , Michael A. Holmes , Jeffrey M. Schlater , German J. Ramirez , Dexin Liang
发明人： Deepak Mahulikar , Efraim Sagiv , Arvind Parthasarathi , Satish Jalota , Andrew J. Brock , Michael A. Holmes , Jeffrey M. Schlater , German J. Ramirez , Dexin Liang
IPC分类号： C25D11/04 , H01L23/02 , H01L23/04 , H01L23/06 , H01L23/14 , H05K1/05 , B32B15/00 , B21D39/00 , B32B3/00 , C25D5/18
CPC分类号： H05K1/056 , H01L23/142 , H05K1/053 , H01L2224/16225 , H01L2924/01327 , Y10T428/12493 , Y10T428/12556 , Y10T428/12736 , Y10T428/24917
摘要： There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.
摘要翻译： 提供了具有增加的击穿电压的阳极氧化铝基板。 通过选择适当的铝合金和适当的加工参数来实现击穿电压的增加。 密封阳极膜通过减少腐蚀来增加击穿电压。 优选的密封剂是具有低固化至高度交联的聚合物的低室温粘度的环氧甲酚酚醛清漆。
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公开(公告)号：US5534356A
公开(公告)日：1996-07-09
申请号：US427921
申请日：1995-04-26
申请人： Deepak Mahulikar , Efraim Sagiv , Arvind Parthasarathi , Satish Jalota , Andrew J. Brock , Michael A. Holmes , Jeffrey M. Schlater , German J. Ramirez , Dexin Liang
发明人： Deepak Mahulikar , Efraim Sagiv , Arvind Parthasarathi , Satish Jalota , Andrew J. Brock , Michael A. Holmes , Jeffrey M. Schlater , German J. Ramirez , Dexin Liang
CPC分类号： H05K1/056 , H01L23/142 , H05K1/053 , H01L2224/16225 , H01L2924/01327 , Y10T428/12493 , Y10T428/12556 , Y10T428/12736 , Y10T428/24917
摘要： There is provided an anodizable aluminum substrate having an increased breakdown voltage. The increase in breakdown voltage is achieved by selecting an appropriate aluminum alloy and appropriate processing parameters. Sealing the anodic film increases the breakdown voltage by decreasing corrosion. A preferred sealant is an epoxy cresol novolac having a low room temperature viscosity that cures to a highly cross-linked polymer.
摘要翻译： 提供了具有增加的击穿电压的可阳极氧化的铝基板。 通过选择适当的铝合金和适当的加工参数来实现击穿电压的增加。 密封阳极膜通过减少腐蚀增加击穿电压。 优选的密封剂是具有低固化至高度交联的聚合物的低室温粘度的环氧甲酚酚醛清漆。
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公开(公告)号：US5952083A
公开(公告)日：1999-09-14
申请号：US955191
申请日：1997-10-21
CPC分类号： H01L23/142 , C25D11/04 , C25D3/38 , H05K1/053 , H01L2924/0002 , Y10T428/24917
摘要： Anodizable components for electronic packaging applications, such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film. To inhibit the formation of electrically conductive precipitates in the anodic film that can form an electrical short circuit between the circuit traces and the metallic core of the component, the metallic core is formed from an anodizable alloy having below thresholds of precipitate forming constituents. Such precipitate forming constituents include iron, silicon and manganese.
摘要翻译： 用于电子封装应用的可阳极氧化组件，例如用于印刷电路板或球栅阵列电子封装的基板，其具有形成在非导电阳极膜上的导电电路。 为了抑制阳极膜中导电沉淀物的形成，其可以在电路迹线和元件的金属芯之间形成电短路，金属芯由具有低于沉淀形成成分阈值的阳极化合金形成。 这种沉淀形成成分包括铁，硅和锰。
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公开(公告)号：US5578869A
公开(公告)日：1996-11-26
申请号：US413149
申请日：1994-03-29
申请人： Paul R. Hoffman , Deepak Mahulikar , George A. Brathwaite , Dawit Solomon , Arvind Parthasarathi
发明人： Paul R. Hoffman , Deepak Mahulikar , George A. Brathwaite , Dawit Solomon , Arvind Parthasarathi
IPC分类号： H01L23/057 , H01L23/31 , H01L23/367 , H01L23/42 , H01L23/498 , H01L25/065 , H01L23/52 , H01L23/34 , H01L23/48 , H01L23/04
CPC分类号： H01L23/057 , H01L23/3128 , H01L23/367 , H01L23/3675 , H01L23/42 , H01L23/49816 , H01L23/49894 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/0652 , H01L2225/06527 , H01L2225/06541 , H01L2225/06555 , H01L2225/06572 , H01L2225/06582 , H01L2225/06586 , H01L2225/06589 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15312 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/30107
摘要： There is provided a metallic component for an electronic package. The component is coated with an electrically non-conductive layer and has a plurality of conductive circuit traces are formed on a surface. The circuit traces are soldered directly to the input/output pads of an integrated circuit device and to a second plurality of circuit traces. The component may include a heat sink to enhance dissipation of heat from an encapsulated integrated circuit device.
摘要翻译： 提供了用于电子封装的金属部件。 该部件涂覆有非导电层，并且在表面上形成多个导电电路迹线。 电路迹线直接焊接到集成电路器件的输入/输出焊盘和第二多个电路迹线。 该组件可以包括散热器，以增强来自封装的集成电路器件的散热。
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公开(公告)号：US5343073A
公开(公告)日：1994-08-30
申请号：US1014
申请日：1993-01-06
IPC分类号： C23C30/00 , C22C9/00 , C22C9/06 , H01L21/56 , H01L23/28 , H01L23/48 , H01L23/495 , H01L23/50 , H01L29/44 , H01L29/52 , H01L29/62
CPC分类号： H01L23/10 , H01L23/3107 , H01L23/49582 , H01L24/48 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48618 , H01L2224/73265 , H01L2224/85201 , H01L2224/85418 , H01L2224/85871 , H01L24/45 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/16152 , H01L2924/181 , H01L2924/20752
摘要： There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.
摘要翻译： 提供了对聚合物树脂具有增强粘附性的引线框架。 引线框架涂有含有铬和锌混合物的薄层。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架对聚合树脂的粘附性提高。
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公开(公告)号：US5969414A
公开(公告)日：1999-10-19
申请号：US249104
申请日：1994-05-25
IPC分类号： H01L23/433 , H01L23/495 , H01L23/02 , H01L23/28 , H01L23/36 , H01L23/48
CPC分类号： H01L23/4334 , H01L23/49582 , H01L24/48 , H01L2224/05599 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/73265 , H01L2224/85207 , H01L2224/85447 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/20752
摘要： There is provided a leadframe assembly for encapsulation in a polymer resin which prevents post-assembly fracture or swelling of the resin. The leadframe is coated with an adhesion enhancing layer that increases the shear stress required for delamination to in excess of about 3.4 MPa. In combination with this adhesion enhancing layer is a compliant die attach adhesive bonding an integrated circuit device to a central die attach paddle. This compliant die attach adhesive has a compliancy factor, E.multidot.a of less than 1.5 MPa/.degree.C. and a thickness of from about 0.01 mm to about 0.08 mm.
摘要翻译： 提供了一种用于封装在聚合物树脂中的引线框架组件，其防止树脂的组装后破裂或膨胀。 引线框架涂有粘附增强层，其将分层所需的剪切应力增加到超过约3.4MPa。 与该粘合增强层结合是将集成电路装置粘合到中央管芯附接浆板上的柔性管芯附着粘合剂。 这种适合的芯片附着粘合剂具有小于1.5MPa /℃的合并因子，Exa为约0.01mm至约0.08mm的厚度。
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公开(公告)号：US5563442A
公开(公告)日：1996-10-08
申请号：US449503
申请日：1995-05-24
IPC分类号： H01L23/28 , H01L21/56 , H01L23/495 , H01L23/50 , H05K3/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/32 , H01L23/49582 , H01L24/48 , H05K3/3426 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48699 , H01L2224/48724 , H01L2224/48739 , H01L2224/48824 , H01L2224/48839 , H01L2224/73265 , H01L2224/85424 , H01L2224/85439 , H01L23/49579 , H01L24/45 , H01L24/73 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H05K2201/10689 , H05K2201/10909 , H05K2201/2081 , Y02P70/613
摘要： There is disclosed a leadframe for electrically interconnecting a semiconductor device to external circuitry. The leadframe has an electrically conductive substrate that is coated with an oxidation resistant external layer. An intervening layer is disposed between a portion of the substrate and the external layer. The intervening layer is absent from the outer lead ends of the leadframe. Subsequent removal of the external layer from the outer lead ends enables a solder to directly contact the leadframe substrate.
摘要翻译： 公开了一种用于将半导体器件电连接到外部电路的引线框架。 引线框架具有涂覆有抗氧化外层的导电基板。 在衬底的一部分和外部层之间设置中间层。 引线框的外引线端不存在中间层。 随后从外部引线端部移除外部层使得焊料能够直接接触引线框架基板。
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公开(公告)号：US5540378A
公开(公告)日：1996-07-30
申请号：US126862
申请日：1993-09-27
IPC分类号： H01L23/28 , H01L21/56 , H01L23/495 , H01L23/50 , H05K3/34 , H01L21/58 , H01L23/532
CPC分类号： H01L24/32 , H01L23/49582 , H01L24/48 , H05K3/3426 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48624 , H01L2224/48639 , H01L2224/48699 , H01L2224/48724 , H01L2224/48739 , H01L2224/48824 , H01L2224/48839 , H01L2224/73265 , H01L2224/85424 , H01L2224/85439 , H01L23/49579 , H01L24/45 , H01L24/73 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H05K2201/10689 , H05K2201/10909 , H05K2201/2081 , Y02P70/613
摘要： There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.
摘要翻译： 公开了一种用于组装电子封装的方法，其中引线框的外引线端可焊接到外部电路，而不需要锡或焊料涂层。 在封装组装之前，在引线框架上沉积抗氧化层。 在外部引线焊接之前去除抗氧化层，提供清洁，无氧化的金属表面进行焊接。
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公开(公告)号：US5449951A
公开(公告)日：1995-09-12
申请号：US270064
申请日：1994-07-01
IPC分类号： C23C30/00 , C22C9/00 , C22C9/06 , H01L21/56 , H01L23/28 , H01L23/48 , H01L23/495 , H01L23/50 , H01L23/043 , H01L23/544
CPC分类号： H01L23/10 , H01L23/3107 , H01L23/49582 , H01L24/48 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48618 , H01L2224/73265 , H01L2224/85201 , H01L2224/85418 , H01L2224/85871 , H01L24/45 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/014 , H01L2924/14 , H01L2924/15747 , H01L2924/16152 , H01L2924/181 , H01L2924/20752
摘要： There is provided a lead frame with enhanced adhesion to a polymer resin. The lead frame is coated with a thin layer of containing chromium, zinc or a mixture of chromium and zinc. A mixture of chromium and zinc with the zinc-to-chromium ratio in excess of about 4:1 is most preferred. The coated lead frames exhibit improved adhesion to a polymeric resin.
摘要翻译： 提供了对聚合物树脂具有增强粘附性的引线框架。 引线框架涂有含有铬，锌或铬和锌的混合物的薄层。 锌与铬的比例超过约4:1的铬和锌的混合物是最优选的。 涂覆的引线框架对聚合树脂的粘附性提高。
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公开(公告)号：US4647315A
公开(公告)日：1987-03-03
申请号：US750573
申请日：1985-07-01
申请人： Arvind Parthasarathi , Ned W. Polan
发明人： Arvind Parthasarathi , Ned W. Polan
CPC分类号： C23C22/33 , C23C22/83 , H05K3/282 , H05K2203/0307 , H05K2203/0723
摘要： The present invention relates to a technique for improving the tarnish and oxidation resistance of copper and copper base alloy materials. The technique of the present invention involves immersing the copper or copper base alloy material in a dilute aqueous chromic acid-phosphoric acid solution. After emerging from the chromic acid-phosphoric acid solution, the copper or copper base alloy material is preferably rinsed with a dilute aqueous caustic solution and dried. Copper and copper base alloy materials treated in accordance with the present invention have particular utility in printed circuit applications.
摘要翻译： 本发明涉及一种提高铜和铜基合金材料的抗褪色和抗氧化性能的技术。 本发明的技术包括将铜或铜基合金材料浸入稀酸铬酸 - 磷酸水溶液中。 在从铬酸 - 磷酸溶液中出来之后，铜或铜基合金材料优选用稀的苛性碱水溶液冲洗并干燥。 根据本发明处理的铜和铜基合金材料在印刷电路应用中具有特殊的用途。
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