摘要:
A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.
摘要:
A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.
摘要:
An illumination apparatus is disclosed in the invention. The illumination apparatus includes a cavity with a diffusion surface, a light source, a light-spreading device, and at least one optically-conditioning surface with a wave-like array formed thereon. The light-spreading device and the optically-conditioning surface spread the light generated by the light source. The light-spreading device includes a wing-shaped protrusion part, a light incident surface, a recess located away from the light incident surface, and an optically-conditioning surface including a wave-like array, wherein the wave-like array has a wavefront direction.
摘要:
An improved hoop support for semiconductor wafers reduces contamination of the wafer during edge beveling operations through the use of support pins that make only line contact with the wafer. The support pins are spaced around the periphery of the hoop and possess a triangular cross section. Two intersecting sides of the pins form an edge that defines the line contact with the wafer. These intersecting sides are preferably inclined relative to the wafer at an angle of between 60 and 80 degrees.
摘要:
A process for preparing a surface of a lower level metal structure, exposed at the bottom of a sub-micron diameter opening, to allow a low resistance interface to be obtained when overlaid with an upper level metal structure, has been developed. A disposable, capping insulator layer is first deposited on the composite insulator layer in which the sub-micron diameter opening will be defined in, to protect underlying components of the composite insulator from a subsequent metal pre-metal procedure. After anisotropically defining the sub-micron diameter opening in the capping insulator, and composite insulator layers, and after removal of the defining photoresist shape, an argon sputtering procedure is used to remove native oxide from the surface of the lower level metal structure. In addition to native oxide removal the argon sputtering procedure, featuring a negative DC bias applied to the substrate, also removes the capping insulator layer from the top surface of the composite insulator layer. An in situ metal deposition then allows a clean interface to result between the overlying metal layer, and the underlying plasma treated, metal surface.
摘要:
A current-leveling electrode for improving electroplating and electrochemical polishing uniformity in the electrochemical plating or electropolishing of metals on a substrate is disclosed. The current-leveling electrode includes a base electrode and at least one sub-electrode carried by the base electrode. The at least one sub-electrode has a width which is less than a width of the base electrode to impart a generally tapered, stepped or convex configuration to the current-leveling electrode.
摘要:
An illumination apparatus is disclosed in the invention. The illumination apparatus includes a cavity with a diffusion surface, a light source, a light-spreading device, and at least one optically-conditioning surface with a wavelike array formed thereon. The light-spreading device and the optically-conditioning surface spread the light generated by the light source. The light-spreading device includes a wing-shaped protrusion part, a light incident surface, a recess located away from the light incident surface, and an optically-conditioning surface including a wavelike array, wherein the wavelike array has a wavefront direction.
摘要:
A heart rate alarm system includes an article of clothing, at least two conductive units, at least one alarm device, a heart rate measurement unit, a first transmission unit, a second transmission unit, and an operation unit. The at least two conductive units are coupled to each other through at least one conductive fibric. The heart rate measurement unit measures a heart rate through the at least two conductive units, and generates a control signal and a heart rate value according to the heart rate. The first transmission unit transmits the control signal to the at least one alarm device and transmits the heart rate value. The at least one alarm device generates at least one alarm signal according to the control signal. The operation unit calculates a heart beat period, a heart physiological age, indicators of autonomic nervous system, and/or a calorie consumption indicator.
摘要:
A backlight module including an independent light source is provided. The backlight module includes a light generation device, a light transmission device, a light mixing device and a planar light generation device. The light generation device may include one or more light emitting components. The light transmission device may be adopted for receiving and transmitting the light emitted by the light generation device. The light mixing device may be adopted for mixing the light emitted by the light transmission device to generate a mixed linear light. The planar light generation device may comprise a light distributing portion for receiving the mixed linear light to generate a planar light.
摘要:
A method for preventing the formation of voids and contaminants in vias during the fabrication of a metal interconnect structure such as a dual damascene structure is disclosed. The method includes providing a substrate; providing a dielectric layer having trench openings and via openings on the substrate, wherein the ratio of the sum of the areas of the trench openings to the sum of the areas of the via openings is between 1 and 300; wherein the via opening bottom has a width of less than about 25 μm; and electroplating a metal in the trench openings and via openings. An interconnect structure having at least one void-free via is further disclosed.