公开(公告)号：US06794167B2

公开(公告)日：2004-09-21

申请号：US09843250

申请日：2001-04-26

Applicant: Rebecca Parales ,  David Gibson ,  Sol Resnick ,  Kyoung Lee

Inventor： Rebecca Parales ,  David Gibson ,  Sol Resnick ,  Kyoung Lee

IPC: C12N902

CPC classification number: C12N9/0071 ,  C12Y114/12012

Abstract: The invention provides an NDO or NDO related complex comprising at least one alpha-subunit polypeptide that comprises: 1) a substituted amino acid at the position corresponding to position 352 in NDO, 2) a substituted amino acid at the position corresponding to position 201, 202, 260, 316, 351, 358, 362, or 366 in NDO, or 3) a substituted amino acid at the position corresponding to position 352 in NDO, and a substituted amino acid at the position corresponding to position 201, 202, 260, 316, 351, 358, 362, or 366 in NDO; or a catalytically active fragment thereof. The invention also provides DNA encoding such polypeptides, host cells augmented by such DNA, and methods for using the enzymes or host cells to provide useful and novel synthons. The invention also provides novel compounds prepared with the complexes or methods of the invention.

Abstract translation: 本发明提供了包含至少一种α亚基多肽的NDO或NDO相关复合物，其包含：1）在对应于NDO中的位置352的位置处的取代的氨基酸，2）对应于位置201的位置处的取代的氨基酸， 在NDO中的202,260,316,351,358,362或366，或3）在对应于NDO中的位置352的位置处的取代的氨基酸和对应于位置201,202,260的位置的取代的氨基酸 ，316,351,358,362或366在NDO中; 或其催化活性片段。 本发明还提供了编码这种多肽的DNA，由这种DNA增强的宿主细胞，以及使用酶或宿主细胞提供有用和新颖的合成子的方法。 本发明还提供用本发明的复合物或方法制备的新型化合物。

公开(公告)号：US5171318A

公开(公告)日：1992-12-15

申请号：US825425

申请日：1992-01-21

Applicant: David Gibson ,  Michael Lerner ,  Robert Nordquist ,  Cary Reich

Inventor： David Gibson ,  Michael Lerner ,  Robert Nordquist ,  Cary Reich

IPC: A61K6/00 ,  A61L27/34 ,  A61L27/54

CPC classification number: A61L27/54 ,  A61K6/0023 ,  A61K6/083 ,  A61L27/34 ,  A61L2300/252 ,  A61L2300/404 ,  A61L2300/414 ,  A61L2300/606

Abstract: Prosthetic devices are prepared for subepithelial implantation by coating their surfaces with a coating comprising crosslinked or uncrosslinked fibronectin. If the surface of the device comprises a material which does not normally bind fibronectin, it is pretreated, for example, by coating with poly(L-lysine). The coated prosthetic device is implanted by removing a portion of the epithelium, affixing the coated device to the subepithelial tissue optionally replacing all or part of the removed epithelium, and allowing new epithelial tissue to grow over and affix itself to the surface of the prosthetic device. The method of the invention can be used to implant contact lenses permanently beneath the epithelium of the cornea.

Abstract translation: 通过用包含交联或未交联的纤连蛋白的涂层涂覆其表面来制备假体装置用于上皮下植入。 如果装置的表面包含通常不结合纤连蛋白的材料，则可以例如通过用聚（L-赖氨酸）包被来预处理。 通过去除一部分上皮植入涂覆的假体装置，将涂覆的装置固定在上皮组织上，任选地取代所有或部分去除的上皮细胞，并允许新的上皮组织生长并固定在假体装置的表面上 。 本发明的方法可用于将隐形眼镜永久地植入在角膜的上皮下。

公开(公告)号：US20160275584A1

公开(公告)日：2016-09-22

申请号：US14659890

申请日：2015-03-17

Applicant: Janell Gibson ,  David Gibson

Inventor： Janell Gibson ,  David Gibson

IPC: G06Q30/06

CPC classification number: G06Q30/0621

Abstract: A method, system, and apparatus are provided for personalizing electronically printed greeting cards so that any generally applicable messages printed therein particularly address any intended recipients. In an embodiment, the system may prompt a user to upload a remote address book containing mailing information and one or more personal details relating to each of her intended recipients. For example, the one or more personal details may comprise any gifts given by the card recipient to the card sender. The one or more details may be automatically incorporated into a generally applicable message template and then sent to the corresponding recipient according to the mailing information thus avoiding the need to draft individual messages.

Abstract translation: 提供了一种用于个性化电子印刷的贺卡的方法，系统和装置，使得其中打印的任何普遍适用的消息特别地解决了任何预期的接收者。 在一个实施例中，系统可以提示用户上传包含邮寄信息的远程地址簿以及与她的每个预期接收者有关的一个或多个个人细节。 例如，一个或多个个人细节可以包括由卡接收者给卡发送者给予的任何礼物。 一个或多个细节可以被自动并入通常适用的消息模板中，然后根据邮件信息被发送到相应的接收者，从而避免了对单个消息的制定。

公开(公告)号：US08681630B1

公开(公告)日：2014-03-25

申请号：US13229280

申请日：2011-09-09

Applicant: David Gibson

Inventor： David Gibson

IPC: H04L12/26

CPC classification number: H04L67/325 ,  G06F9/54

Abstract: A system disclosed rate limits API requests. The system includes an API server that receives an API request from a developer application at an API server and a token bucket to rate limit API requests from the developer application. A token query translation module determines a number of tokens needed to process the API request based on a rate configured in predefined policy data for the developer application and a replenish rate of the token bucket. The number of tokens inversely corresponds to the rate configured in the predefined policy data. A token request module instructs the API server to process the API request if the token bucket has sufficient tokens and reduces the number of tokens in the token bucket for the developer application by the number of tokens needed to process the API request. In this way, the disclosed system effectively simulates buckets having configurable replenish rates.

Abstract translation: 系统公开速率限制API请求。 该系统包括API服务器，其接收来自API服务器的开发者应用程序的API请求和令牌桶以对来自开发者应用程序的API请求进行限制。 令牌查询翻译模块基于在开发者应用的预定义策略数据中配置的速率和令牌桶的补充速率来确定处理API请求所需的令牌数量。 令牌的数量与预定义策略数据中配置的速率成反比。 令牌请求模块指示API服务器处理API请求，如果令牌桶具有足够的令牌，并且通过处理API请求所需的令牌数减少开发者应用的令牌桶中的令牌数量。 以这种方式，所公开的系统有效地模拟具有可配置补充率的桶。

公开(公告)号：US07183643B2

公开(公告)日：2007-02-27

申请号：US10981067

申请日：2004-11-04

Applicant: David Gibson ,  Andy Stavros

Inventor： David Gibson ,  Andy Stavros

IPC: H01L23/34

CPC classification number: H01L25/10 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/107 ,  H01L2924/1437 ,  H01L2924/15311 ,  H05K1/112 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10515 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A microelectronic assembly incorporates units stacked one above the other and may include a plurality of similar stacks mounted to a circuit board. Some of the stacks may be inverted, rotated or both relative to other stacks so that corresponding edges of the stacks face one another to facilitate communication between the stacks. Communication between the stacks may be carried along traces on one or more interposers intercepting the stacks remote from the circuit board. Within each stack, conducting paths may extend in vertical columns or in other arrangements such as a stair step arrangement wherein each conductive path traverses a series of column positions, or in a crossing arrangement such two conductive paths cross back and forth between column positions along the vertical extend of the stack. A stack may include portions disposed above and below the circuit board.

Abstract translation: 微电子组件包括彼此层叠的单元，并且可以包括安装到电路板的多个相似的堆叠。 堆叠中的一些可以相对于其他堆叠反转，旋转或两者，使得堆叠的相应边缘彼此面对以便于堆叠之间的连通。 堆叠之间的通信可以沿着拦截远离电路板的堆叠的一个或多个插入器上的迹线进行。 在每个堆叠内，导电路径可以在垂直列中或在其他布置中延伸，例如阶梯式布置，其中每个导电路径穿过一系列列位置，或者在交叉布置中，这样的两个导电路径沿着沿着该列位置的列位置之间来回交替 堆叠的垂直延伸。 堆叠可以包括设置在电路板上方和下方的部分。

公开(公告)号：US07149095B2

公开(公告)日：2006-12-12

申请号：US10281550

申请日：2002-10-28

Applicant: Michael Warner ,  Philip Damberg ,  John B. Riley ,  David Gibson ,  Young-Gon Kim ,  Belgacem Haba ,  Vernon Solberg

Inventor： Michael Warner ,  Philip Damberg ,  John B. Riley ,  David Gibson ,  Young-Gon Kim ,  Belgacem Haba ,  Vernon Solberg

IPC: H05K1/11

CPC classification number: H05K1/189 ,  H01L23/5387 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/3011 ,  H01L2224/05599

Abstract: A stacked microelectronic assembly includes a plurality of microelectronic subassemblies. Each subassembly includes a substrate having at least one site, a plurality of first contacts and a plurality of second contacts. Each subassembly also has at least one microelectronic element assembled to the at least one attachment site and electrically connected to at least some of the first and second contacts. The substrate is folded so that the first contacts are accessible at a bottom of a subassembly and the second contacts are accessible at a top of a subassembly. The plurality of subassemblies are stacked one on top of another in a generally vertical configuration. The substrate of at least one of the subassemblies has a plurality of attachment sites and a plurality of microelectronic elements assembled to the attachment sites. The substrate is folded so that at least some of the plurality of microelectronic elements are disposed alongside one another.

Abstract translation: 堆叠的微电子组件包括多个微电子子组件。 每个子组件包括具有至少一个位置，多个第一触点和多个第二触点的基板。 每个子组件还具有组装到至少一个附接位置并电连接到第一和第二触点中的至少一些的至少一个微电子元件。 折叠基板使得第一触头在子组件的底部可接近，并且第二触头可在子组件的顶部接近。 多个子组件以大致垂直的配置堆叠在另一个之上。 至少一个子组件的衬底具有多个附接位置和组装到附接位置的多个微电子元件。 折叠基板使得多个微电子元件中的至少一些彼此并排设置。

公开(公告)号：US20060249857A1

公开(公告)日：2006-11-09

申请号：US11315466

申请日：2005-12-22

Applicant: Belgacem Haba ,  David Gibson

Inventor： Belgacem Haba ,  David Gibson

IPC: H01L21/00 ,  H01L23/28

CPC classification number: G01R1/0483 ,  G01R1/0735 ,  G01R1/07378 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/0367 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The assembly also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements.

Abstract translation: 用于测试微电子器件的组件包括具有面和触点的微电子元件，与微电子元件的第一面间隔开并且覆盖微电子元件的第一面的柔性基板，以及从柔性基板延伸并远离第一面 微电子元件，至少一些导电柱与微电子元件电互连。 组件还包括设置在微电子元件和衬底之间的多个支撑元件，用于将柔性衬底支撑在微电子元件上。 至少一些导电柱从支撑元件偏移。

公开(公告)号：US20060153718A1

公开(公告)日：2006-07-13

申请号：US10540286

申请日：2003-12-22

Applicant: David Gibson ,  Terence Bannister

Inventor： David Gibson ,  Terence Bannister

IPC: F04B43/12

CPC classification number: F04B43/1253

Abstract: A tube holder (105) for use with a peristaltic pump includes a housing having a recess (165) for receipt of a pump rotor and a tube race around the recess. The tube race has a first race part and a second race part, a first tube inlet (167a) into the first race part and a first tube outlet (167b) from the first race part, a second tube inlet (167c) into the second race part and a second tube outlet (167d) from the second race part. The tube is insertable in the tube race by movement in a substantially orthogonal direction relative to the tube race so that it extends in through the first tube inlet (167a), around the first race part, out through the first tube outlet (167b), in through the second tube inlet (167c), around the second race part, and out through the second tube outlet (167d).

Abstract translation: 用于蠕动泵的管保持器（105）包括具有用于接收泵转子的凹部（165）和围绕凹部的管座的壳体。 管座具有第一座圈部和第二座圈部，从第一座圈部到第一座圈部的第一管入口（167a）和第一管出口（167b），第二管入口（167c） 进入第二座圈部分和从第二座圈部分的第二管出口（167d）。 管可以通过相对于管座大致正交的方向运动而插入管座中，使得管能够通过第一管出口（167b）穿过第一管入口（167a）延伸穿过第一座圈部分 ），通过第二管入口（167c），围绕第二座圈部分穿过第二管出口（167d）。

公开(公告)号：US20060100150A1

公开(公告)日：2006-05-11

申请号：US11304721

申请日：2005-12-15

Applicant: Wing Cheung ,  David Gibson ,  Christine Cote ,  Els Vercammen

Inventor： Wing Cheung ,  David Gibson ,  Christine Cote ,  Els Vercammen

IPC: A61K38/18 ,  G06F19/00

CPC classification number: G16C20/30 ,  A61K38/00 ,  A61K38/1816 ,  G16H50/50 ,  A61K38/14 ,  A61K33/24 ,  A61K31/70 ,  A61K31/505 ,  A61K31/475 ,  A61K31/28 ,  A61K2300/00

Abstract: The present invention relates to systems and methods for obtaining optimized EPO dosage regimens for a desired pharmacodynamic/pharmacokinetic response. The system includes choosing one or more EPO dosage regimens, then using a PK/PD model to determine the pharmacodynamic/pharmacokinetic profile of one or more EPO dosage regimens, and finally selecting one of the EPO dosage regimens for administration to achieve the desired pharmacodynamic/pharmacodynamic response based on the EPO profile.

公开(公告)号：US06913949B2

公开(公告)日：2005-07-05

申请号：US10834342

申请日：2004-04-28

Applicant: L. Elliott Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig S. Mitchell

Inventor： L. Elliott Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig S. Mitchell

IPC: H01L25/18 ,  H01L21/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02 ,  H01L23/48 ,  H01L23/528 ,  H01L25/065 ,  H01L25/10 ,  H01L25/11 ,  H01L31/0336

CPC classification number: H01L23/528 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively interrupted, as by breaking the individual branches, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.

Abstract translation: 堆叠式芯片组件包括具有安装在电介质层上的芯片的单独单元和在将芯片的触点与布置在电介质层的周边区域中的端子互连的电介质层上的迹线。 至少一些迹线是将分片选择触点连接到芯片选择端子的多分支迹线。 这些单元彼此堆叠，不同单元的相应端子通过焊球或其它导电元件彼此连接，以形成垂直总线。 在堆叠之前，单个单元的多分支迹线通过断开各个分支而被选择性地中断，以便将芯片的芯片选择触点留在连接到不同芯片选择端子的不同单元中，从而将这些芯片连接到不同的垂直 巴士 各个单元期望地是薄的并且直接地彼此邻接，以便提供具有来自堆叠内的芯片的良好热传递的低高度组件。