公开(公告)号：US09969048B2

公开(公告)日：2018-05-15

申请号：US14808252

申请日：2015-07-24

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Yoichi Kobayashi ,  Katsutoshi Ono ,  Masaki Kinoshita ,  Toshifumi Kimba

IPC: B24B49/12 ,  B24B37/013 ,  B24B37/10 ,  B24B37/26 ,  H01L21/67 ,  H01L21/687 ,  B24B37/04 ,  B24B37/005 ,  H01L21/3105 ,  H01L21/66

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/013 ,  B24B37/04 ,  B24B37/042 ,  B24B37/10 ,  B24B49/12 ,  H01L21/31053 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/68721 ,  H01L22/26

Abstract: A polishing apparatus for polishing a substrate is provided. The polishing apparatus includes: a polishing table holding a polishing pad; a top ring configured to press the substrate against the polishing pad; first and second optical heads each configured to apply the light to the substrate and to receive reflected light from the substrate; spectroscopes each configured to measure at each wavelength an intensity of the reflected light received; and a processor configured to produce a spectrum indicating a relationship between intensity and wavelength of the reflected light. The first optical head is arranged so as to face a center of the substrate, and the second optical head is arranged so as to face a peripheral portion of the substrate.

公开(公告)号：US11926018B2

公开(公告)日：2024-03-12

申请号：US17314573

申请日：2021-05-07

Applicant: EBARA CORPORATION

Inventor： Masayoshi Ito ,  Hisanori Matsuo ,  Itsuki Kobata ,  Takuya Moriura

IPC: B24B57/02 ,  B24B37/005 ,  B24B37/04 ,  B24B37/10 ,  B24B37/32

CPC classification number: B24B57/02 ,  B24B37/005 ,  B24B37/042 ,  B24B37/107 ,  B24B37/32

Abstract: There is provided an apparatus for polishing, comprising a polishing table configured to support and rotate a polishing pad; a holder configured to hold an object and press the object against the polishing pad; a polishing solution supply device provided with a contact member and configured to supply a polishing solution to an opening in a bottom face of the contact member in a state that the contact member comes into contact with or is adjacent to the polishing pad, thereby spreading the polishing solution on the polishing pad, the polishing solution supply device causing at least part of used polishing solution returned by rotation of the polishing pad to be dammed up by the contact member and setting the contact member either in a direction of keeping the dammed up polishing solution on the polishing pad or in a direction of discharging the dammed up polishing solution, according to an angle of the polishing solution supply device with respect to a radial direction of the polishing pad; an arm linked with the polishing solution supply device; a rotating mechanism configured to rotate the polishing solution supply device with respect to the arm; and a controller configured to control the rotating mechanism to change the angle of the polishing solution supply device with respect to the radial direction of the polishing pad and thereby control a discharge amount of the polishing solution by the contact member of the polishing solution supply device.

公开(公告)号：US11839948B2

公开(公告)日：2023-12-12

申请号：US16692092

申请日：2019-11-22

Applicant: EBARA CORPORATION

Inventor： Takashi Yamazaki ,  Itsuki Kobata ,  Ryuichi Kosuge ,  Tadakazu Sone

IPC: B24B57/02 ,  B24B37/34 ,  B24B37/005 ,  B24B37/10

CPC classification number: B24B57/02 ,  B24B37/005 ,  B24B37/10 ,  B24B37/34

Abstract: A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.

公开(公告)号：US20220168866A1

公开(公告)日：2022-06-02

申请号：US17432284

申请日：2020-01-08

Applicant: EBARA CORPORATION

Inventor： Erina Baba ,  Itsuki Kobata

IPC: B24B37/20 ,  B24B57/02 ,  B24B53/017 ,  B01J35/00

Abstract: Provided is an apparatus and a method that allow a control of a removal amount at an atomic level and allow a selective removal from a projecting portion of a process target.
According to one embodiment, a substrate processing apparatus is provided, and the substrate processing apparatus includes: a table for holding a substrate; a nozzle for supplying a process liquid to a top of the substrate held onto the table; a head for holding a photocatalyst; a conditioner for conditioning the photocatalyst; a first moving mechanism for moving the head in a direction perpendicular to a surface of the table; and a second moving mechanism for moving the head between the table and the conditioner.

公开(公告)号：US11192216B2

公开(公告)日：2021-12-07

申请号：US15898028

申请日：2018-02-15

Applicant: EBARA CORPORATION

Inventor： Hiromitsu Watanabe ,  Kuniaki Yamaguchi ,  Itsuki Kobata ,  Yutaka Wada

IPC: B24B57/00 ,  B24B37/04 ,  B24B37/34

Abstract: A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate is brought into sliding contact with a polishing pad while a polishing liquid, which has passed through a filter, is supplied onto the polishing pad. The polishing method includes: passing the polishing liquid through the filter while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate W on the polishing pad while supplying the polishing liquid that has passed through the filter onto the polishing pad.

公开(公告)号：US20210237224A1

公开(公告)日：2021-08-05

申请号：US17147677

申请日：2021-01-13

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Hozumi Yasuda ,  Akio Yanai ,  Nobuyuki Takahashi ,  Takamasa Nakamura ,  Keisuke Sakata ,  Nobuyuki Takada ,  Yuji Yagi ,  Yasuhiro Takada ,  Katsuhide Watanabe

IPC: B24B37/10 ,  B24B37/005

Abstract: A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.

公开(公告)号：US20210187685A1

公开(公告)日：2021-06-24

申请号：US17132573

申请日：2020-12-23

Applicant: EBARA CORPORATION

Inventor： Atsuo Katagiri ,  Itsuki Kobata

IPC: B24B1/00 ,  H01L21/306 ,  H01L21/67 ,  H01L21/3105 ,  H01L21/321

Abstract: A substrate processing apparatus comprising: a stage for holding a substrate with a surface to be processed upward; a catalyst holding head for holding a catalyst to process the surface to be processed of the substrate; a pushing mechanism for pushing the catalyst holding head against the surface to be processed of the substrate; a swing mechanism for swinging the catalyst holding head in a radial direction of the substrate; and a pushing force control unit configured to adjust a pushing force of the catalyst holding head by the pushing mechanism according to a position of the catalyst holding head or a contact area between the substrate and the catalyst when the catalyst projects to outside the substrate by the swing of the catalyst holding head.

公开(公告)号：US10183374B2

公开(公告)日：2019-01-22

申请号：US14834195

申请日：2015-08-24

Applicant: EBARA CORPORATION

Inventor： Kuniaki Yamaguchi ,  Toshio Mizuno ,  Itsuki Kobata

IPC: B24B37/04 ,  B24B37/10 ,  B24B37/20 ,  B24B41/00

Abstract: A buffing module for buffing a substrate is provided. The buffing module comprises a buff table for supporting the substrate, the buff table being rotatable; and a buff head to which a buff pad is attached, being rotatable and movable in a direction of approaching the buff table and a direction of moving away from the buff table. The buff pad includes a first part and a second part arranged so as to surround the first part on an outer side of the first part, the first part and the second part have different characteristics from each other.

公开(公告)号：US12062563B2

公开(公告)日：2024-08-13

申请号：US17881508

申请日：2022-08-04

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Keita Yagi ,  Katsuhide Watanabe ,  Yoichi Shiokawa ,  Toru Maruyama ,  Nobuyuki Takahashi

IPC: H01L21/677 ,  B24B37/04 ,  B24B37/20 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/311 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67742 ,  B24B37/04 ,  B24B37/20 ,  H01L21/30612 ,  H01L21/30625 ,  H01L21/31055 ,  H01L21/31111 ,  H01L21/32115 ,  H01L21/3212 ,  H01L21/32134 ,  H01L21/6708 ,  H01L21/67092 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/6838 ,  H01L22/26 ,  H01L22/12

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

公开(公告)号：US12017323B2

公开(公告)日：2024-06-25

申请号：US17147677

申请日：2021-01-13

Applicant: EBARA CORPORATION

Inventor： Itsuki Kobata ,  Hozumi Yasuda ,  Akio Yanai ,  Nobuyuki Takahashi ,  Takamasa Nakamura ,  Keisuke Sakata ,  Nobuyuki Takada ,  Yuji Yagi ,  Yasuhiro Takada ,  Katsuhide Watanabe

IPC: B24B37/10 ,  B24B37/005

CPC classification number: B24B37/10 ,  B24B37/005

Abstract: A polishing head system capable of precisely controlling a film-thickness profile of a workpiece, such as a wafer, substrate, or panel, is disclosed. The polishing head system includes a polishing head having a plurality of piezoelectric elements configured to apply pressing forces to a workpiece, and an operation controller configured to determine instruction values of voltages to be applied to the plurality of piezoelectric elements.