公开(公告)号：US06817091B2

公开(公告)日：2004-11-16

申请号：US10200807

申请日：2002-07-22

申请人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

发明人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

IPC分类号： H05K334

CPC分类号： H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

摘要翻译： 提供具有模具，散热器和固化的焊料材料的电子组件。 模具包括管芯基板和在管芯基板的底表面上的集成电路。 散热器位于模具上方，具有左右倾斜面。 左倾斜面从模具中心附近的点逐渐变细到上表面的上方和左侧。 右倾斜面从靠近中心的点向上和上表面上方逐渐变细。 固化的焊料材料填充下表面的上表面和倾斜面之间的区域。

公开(公告)号：US07256058B2

公开(公告)日：2007-08-14

申请号：US11470209

申请日：2006-09-05

申请人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

发明人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

IPC分类号： G01R31/26 ,  H01L21/66 ,  G06F17/50

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3511 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

摘要翻译： 一种用于设计和制造集成散热器的装置和方法，使得集成的散热器将具有平坦表面，在将其组装成封装件并暴露于模具的热量之后，将散热器安装在该平面上。 这种用于设计和制造集成散热器的装置和方法将产生散热器，该散热器将补偿由（1）装配期间的物理操作（2）运行期间的热梯度和（3）不同的膨胀和收缩速率导致的变形 的包装材料在高温下与多个包装组装步骤相结合，使得一体式散热器的一个表面将具有平坦的形状。

公开(公告)号：US07036573B2

公开(公告)日：2006-05-02

申请号：US10071471

申请日：2002-02-08

申请人： Paul A. Koning ,  Fay Hua ,  Carl L. Deppisch

发明人： Paul A. Koning ,  Fay Hua ,  Carl L. Deppisch

IPC分类号： F28F7/00 ,  C08K9/10

CPC分类号： F28F13/00 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  Y10S165/905 ,  H01L2924/00

摘要： A thermal interface material made of a binder material and a fusible filler.

摘要翻译： 由粘合剂材料和易熔填料制成的热界面材料。

公开(公告)号：US06504723B1

公开(公告)日：2003-01-07

申请号：US09990489

申请日：2001-11-15

申请人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

发明人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

IPC分类号： H05K720

CPC分类号： H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

摘要翻译： 提供具有模具，散热器和固化的焊料材料的电子组件。 模具包括管芯基板和在管芯基板的底表面上的集成电路。 散热器位于模具上方，具有左右倾斜面。 左倾斜面从模具中心附近的点逐渐变细到上表面的上方和左侧。 右倾斜面从靠近中心的点向上和上表面上方逐渐变细。 固化的焊料材料填充下表面的上表面和倾斜面之间的区域。

公开(公告)号：US07102226B2

公开(公告)日：2006-09-05

申请号：US11047811

申请日：2005-02-01

申请人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

发明人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

IPC分类号： H01L23/34

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3511 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

公开(公告)号：US07436058B2

公开(公告)日：2008-10-14

申请号：US10141735

申请日：2002-05-09

申请人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

发明人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

IPC分类号： H01L23/12 ,  H01L23/10 ,  H01L29/40 ,  H01L21/00

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

摘要： Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

摘要翻译： 反应性焊料。 反应性焊料材料可以焊接到半导体表面，例如晶片或晶片的背面。 反应性焊料材料包括与活性元素材料合金化的基底焊料。 反应性焊料材料也可以应用于热管理装置的一部分。 反应性焊料材料可用作半导体表面和热管理装置之间的导热界面。

公开(公告)号：US07362580B2

公开(公告)日：2008-04-22

申请号：US10871978

申请日：2004-06-18

申请人： Fay Hua ,  Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Gregory M. Chrysler

发明人： Fay Hua ,  Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Gregory M. Chrysler

IPC分类号： H05K7/20

CPC分类号： H01L23/3735 ,  H01L23/10 ,  H01L23/3736 ,  H01L23/433 ,  H01L24/32 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/3512 ,  H01L2924/00

摘要： Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is formed on the metal body. The thermal interface material on the die is brought into contact with the wetting layer of material comprising indium. The thermal interface material is heated to form a bond between the thermal interface material and the wetting layer so that the thermal interface material is coupled to the metal body, and to form a bond between the thermal interface material and the die so that the thermal interface material is coupled to the die.

摘要翻译： 实施例包括用于形成电子封装的电子封装和方法。 一种方法包括在管芯上提供管芯和热界面材料。 金属体适于装配在模具上。 包含铟的材料的润湿层形成在金属体上。 模具上的热界面材料与包含铟的材料的润湿层接触。 热界面材料被加热以在热界面材料和润湿层之间形成结合，使得热界面材料耦合到金属体，并且在热界面材料和模具之间形成结合，使得热界面 材料耦合到模具。

公开(公告)号：US06471792B1

公开(公告)日：2002-10-29

申请号：US09429871

申请日：1999-10-29

申请人： John F. Breedis ,  Ronald N. Caron ,  Carl L. Deppisch

发明人： John F. Breedis ,  Ronald N. Caron ,  Carl L. Deppisch

IPC分类号： C22C902

CPC分类号： C22C9/04 ,  C22F1/08

摘要： An alpha brass (copper/zinc alloy with less than 39%, by weight, of zinc) stock alloy has controlled additions of nickel, tin and phosphorous. The combination of nickel and tin increase resistance of the alloy to elevated temperature stress relaxation. As a result, spring contacts formed from alloys of the invention maintain a higher percentage of initially imposed stress at elevated temperatures, in the range of 125° C. to 150° C., for significantly longer times than other brass alloys of comparable strength.

摘要翻译： 一种阿尔法黄铜（铜/锌合金，小于39％重量的锌）原料合金可控制添加镍，锡和磷。 镍和锡的组合增加了合金对高温应力松弛的抵抗力。 结果，由本发明的合金形成的弹簧触点在升高的温度下在125℃至150℃的范围内保持较高的初始应力的百分比，比其他具有相当强度的黄铜合金的时间要长得多。

公开(公告)号：US09613933B2

公开(公告)日：2017-04-04

申请号：US14198479

申请日：2014-03-05

申请人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, Jr. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

发明人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, Jr. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

IPC分类号： H01L23/12 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/76802 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13023 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/37001 ,  H01L2924/00

摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

公开(公告)号：US09254532B2

公开(公告)日：2016-02-09

申请号：US12655407

申请日：2009-12-30

申请人： Deepak V. Kulkarni ,  Carl L. Deppisch ,  Leonel R. Arana ,  Gregory S. Constable ,  Sriram Srinivasan

发明人： Deepak V. Kulkarni ,  Carl L. Deppisch ,  Leonel R. Arana ,  Gregory S. Constable ,  Sriram Srinivasan

IPC分类号： H01L23/02 ,  H01L23/12 ,  H01L23/10 ,  H01L23/34 ,  B23K1/00 ,  B23K3/08

CPC分类号： B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K3/085 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251 ,  Y10T428/12222

摘要： Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

摘要翻译： 形成封装结构的方法和相关结构包括在IHS的阻焊剂开口位置上形成低熔点焊料材料，从而在非SRO保护区域内形成密封剂; 将IHS连接到密封剂上，并固化密封剂，其中在IHS和低熔点焊料材料之间形成焊接接头。