公开(公告)号：US09254532B2

公开(公告)日：2016-02-09

申请号：US12655407

申请日：2009-12-30

申请人： Deepak V. Kulkarni ,  Carl L. Deppisch ,  Leonel R. Arana ,  Gregory S. Constable ,  Sriram Srinivasan

发明人： Deepak V. Kulkarni ,  Carl L. Deppisch ,  Leonel R. Arana ,  Gregory S. Constable ,  Sriram Srinivasan

IPC分类号： H01L23/02 ,  H01L23/12 ,  H01L23/10 ,  H01L23/34 ,  B23K1/00 ,  B23K3/08

CPC分类号： B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K3/085 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251 ,  Y10T428/12222

摘要： Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

摘要翻译： 形成封装结构的方法和相关结构包括在IHS的阻焊剂开口位置上形成低熔点焊料材料，从而在非SRO保护区域内形成密封剂; 将IHS连接到密封剂上，并固化密封剂，其中在IHS和低熔点焊料材料之间形成焊接接头。

公开(公告)号：US20110159310A1

公开(公告)日：2011-06-30

申请号：US12655407

申请日：2009-12-30

申请人： Deepak V. Kulkarni ,  Carl L. Deppisch ,  Leonel R. Arana ,  Gregory S. Constable ,  Sriram Srinivasan

发明人： Deepak V. Kulkarni ,  Carl L. Deppisch ,  Leonel R. Arana ,  Gregory S. Constable ,  Sriram Srinivasan

IPC分类号： B32B15/04 ,  B23K31/02 ,  B32B38/00

CPC分类号： B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K3/085 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251 ,  Y10T428/12222

摘要： Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

摘要翻译： 形成封装结构的方法和相关结构包括在IHS的阻焊剂开口位置上形成低熔点焊料材料，从而在非SRO保护区域内形成密封剂; 将IHS连接到密封剂上，并固化密封剂，其中在IHS和低熔点焊料材料之间形成焊接接头。

公开(公告)号：US06867978B2

公开(公告)日：2005-03-15

申请号：US10266996

申请日：2002-10-08

申请人： Kris J. Whittenburg ,  Fay Hua ,  Carl L. Deppisch ,  Sabina J. Houle ,  Peter Brandenburger ,  Kim L. Phillippe

发明人： Kris J. Whittenburg ,  Fay Hua ,  Carl L. Deppisch ,  Sabina J. Houle ,  Peter Brandenburger ,  Kim L. Phillippe

IPC分类号： H01L23/373 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3733 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

摘要： A system includes a thermal interface material (TIM) to transfer heat from a die to a heat spreader. The system includes a heat transfer subsystem disposed on the backside surface of the die. In one embodiment, the heat transfer subsystem comprises a first heat transfer material and a second heat transfer material discretely disposed within the first heat transfer material. A method of bonding a die to a heat spreader uses a die-referenced process as opposed to a substrate-referenced process.

公开(公告)号：US06504242B1

公开(公告)日：2003-01-07

申请号：US09990622

申请日：2001-11-15

申请人： Carl L. Deppisch ,  Sabina J. Houle ,  Thomas J. Fitzgerald ,  Kristopher E. Dayton ,  Fay Hua

发明人： Carl L. Deppisch ,  Sabina J. Houle ,  Thomas J. Fitzgerald ,  Kristopher E. Dayton ,  Fay Hua

IPC分类号： H01L2310

CPC分类号： H01L23/433 ,  H01L23/10 ,  H01L23/3735 ,  H01L23/3736 ,  H01L24/31 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00

摘要： An electronic assembly including a die, having an integrated circuit formed therein, a thermally conductive heat spreader, and indium located between the die and the heat spreader, is described. The heat spreader has a layer of nickel. A gold layer is formed on the nickel layer, and provides better wetting of indium than nickel. A better structural connection between the indium and the heat spreader is provided, especially during thermal cycling.

摘要翻译： 描述了一种包括其中形成有集成电路的模具，导热散热器和位于模具和散热器之间的铟的电子组件。 散热器有一层镍。 在镍层上形成金层，并且比镍提供更好的铟润湿。 提供铟和散热器之间更好的结构连接，特别是在热循环期间。

公开(公告)号：US06471792B1

公开(公告)日：2002-10-29

申请号：US09429871

申请日：1999-10-29

申请人： John F. Breedis ,  Ronald N. Caron ,  Carl L. Deppisch

发明人： John F. Breedis ,  Ronald N. Caron ,  Carl L. Deppisch

IPC分类号： C22C902

CPC分类号： C22C9/04 ,  C22F1/08

摘要： An alpha brass (copper/zinc alloy with less than 39%, by weight, of zinc) stock alloy has controlled additions of nickel, tin and phosphorous. The combination of nickel and tin increase resistance of the alloy to elevated temperature stress relaxation. As a result, spring contacts formed from alloys of the invention maintain a higher percentage of initially imposed stress at elevated temperatures, in the range of 125° C. to 150° C., for significantly longer times than other brass alloys of comparable strength.

摘要翻译： 一种阿尔法黄铜（铜/锌合金，小于39％重量的锌）原料合金可控制添加镍，锡和磷。 镍和锡的组合增加了合金对高温应力松弛的抵抗力。 结果，由本发明的合金形成的弹簧触点在升高的温度下在125℃至150℃的范围内保持较高的初始应力的百分比，比其他具有相当强度的黄铜合金的时间要长得多。

公开(公告)号：US07704798B2

公开(公告)日：2010-04-27

申请号：US12330080

申请日：2008-12-08

申请人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E Xu

发明人： Fay Hua ,  Carl L. Deppisch ,  Joni G. Hansen ,  Youzhi E Xu

IPC分类号： H01L21/00

CPC分类号： H01L23/367 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29076 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29124 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  Y10T428/249921 ,  H01L2924/00 ,  H01L2924/014

摘要： A composite of two or more thermal interface materials (“TIMs”) is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

摘要翻译： 将两个或多个热界面材料（“TIM”）的复合物放置在管芯和散热器之间，以改善集成电路封装中管芯的冷却。 根据模具热点的位置，两个或多个TIM的散热能力各不相同。 在一个实施例中，更多导热材料可以被定位在一个或多个管芯热点上方，并且较少的导热材料可以被定位成邻接和/或围绕更多导热材料。 两个或更多个TIM可以包括焊料和聚合物。 复合TIM可以作为一个单元或多个单元来执行。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US20080293188A1

公开(公告)日：2008-11-27

申请号：US12220218

申请日：2008-07-22

申请人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

发明人： Fay Hua ,  Carl L. Deppisch ,  Krista J. Whittenburg

IPC分类号： H01L21/60

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00014

摘要： Reactive solder material. The reactive solder material may be soldered to semiconductor surfaces such as the backside of a die or wafer. The reactive solder material includes a base solder material alloyed with an active element material. The reactive solder material may also be applied to a portion of a thermal management device. The reactive solder material may be useful as a thermally conductive interface between a semiconductor surface and a thermal management device.

公开(公告)号：US06848172B2

公开(公告)日：2005-02-01

申请号：US10023720

申请日：2001-12-21

申请人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

发明人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

IPC分类号： H01L23/367 ,  H01L23/373 ,  G06F17/50 ,  H01R43/00 ,  H05K3/30 ,  H05K33/34

CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3511 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built to compensate for deformations resulting from (1) physical manipulation during assembly, (2) thermal gradients during operation, and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

摘要翻译： 一种用于设计和制造集成散热器的装置和方法，使得集成的散热器将具有平坦表面，在将其组装成封装件并暴露于模具的热量之后，将散热器安装在该平面上。 这种用于设计和制造集成散热器的装置和方法将产生一个散热器，其将被建造以补偿由于（1）组装期间的物理操纵，（2）操作期间的热梯度，和（3）不同的速率 包装材料的膨胀和收缩以及在高温下的多个包装组装步骤，使得集成散热器的一个表面将具有平坦的形状。

公开(公告)号：US06817091B2

公开(公告)日：2004-11-16

申请号：US10200807

申请日：2002-07-22

申请人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

发明人： Thomas J. Fitzgerald ,  Carl L. Deppisch ,  Fay Hua

IPC分类号： H05K334

CPC分类号： H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16251 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

摘要翻译： 提供具有模具，散热器和固化的焊料材料的电子组件。 模具包括管芯基板和在管芯基板的底表面上的集成电路。 散热器位于模具上方，具有左右倾斜面。 左倾斜面从模具中心附近的点逐渐变细到上表面的上方和左侧。 右倾斜面从靠近中心的点向上和上表面上方逐渐变细。 固化的焊料材料填充下表面的上表面和倾斜面之间的区域。

公开(公告)号：US09613933B2

公开(公告)日：2017-04-04

申请号：US14198479

申请日：2014-03-05

申请人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, Jr. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

发明人： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, Jr. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

IPC分类号： H01L23/12 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/76802 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13023 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/37001 ,  H01L2924/00

摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.