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公开(公告)号：US20160047772A1
公开(公告)日：2016-02-18
申请号：US14460589
申请日：2014-08-15
IPC分类号： G01N27/403
CPC分类号： G01N27/403 , B05D5/12 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K3/0011 , H05K3/107 , H05K3/42 , H05K3/46 , H05K3/467
摘要： A method of making an imprinted electronic sensor structure on a substrate for sensing an environmental factor includes coating, imprinting, and curing a curable layer on the substrate to form a plurality of spatially separated micro-channels extending from the layer surface into the cured layer. First and second layers are located in each micro-channel to form a multi-layer micro-wire. Either the first layer is a cured electrical conductor forming a conductive layer located only within the micro-channel and the second layer is a reactive layer or the first layer is a reactive layer and the second layer is a cured electrical conductor forming a conductive layer located only within the micro-channel. The reactive layer is exposed to the environmental factor and at least a portion of the reactive layer responds to the environmental factor.
摘要翻译： 在感测环境因素的基板上制作印刷电子传感器结构的方法包括在基板上涂覆，压印和固化可固化层，以形成从层表面延伸到固化层中的多个空间分离的微通道。 第一和第二层位于每个微通道中以形成多层微线。 第一层是固化电导体，其形成仅位于微通道内的导电层，第二层是反应层，或者第一层是反应层，第二层是形成导电层的固化电导体 只在微通道内。 反应层暴露于环境因素，并且反应层的至少一部分响应环境因素。
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公开(公告)号：US09186698B1
公开(公告)日：2015-11-17
申请号：US14526603
申请日：2014-10-29
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00 , B05D3/00 , H01J37/32 , B29C59/00 , B29K101/12 , B29K105/00
CPC分类号： G03F7/0002 , B05D3/007 , B29C59/005 , B29K2101/12 , B29K2105/0011 , B29K2995/0005 , C03C17/3405 , C03C2218/328 , H01J37/32009
摘要： A method of making an imprinted multi-layer structure includes providing a support and locating a first curable layer including a first material on or over the support. A second curable layer including a second material different from the first material is located on or over the first curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed to form an imprinted multi-layer structure with a depth greater than the thickness of the second cured layer.
摘要翻译： 一种制造压印多层结构的方法包括提供支撑件并将包括第一材料的第一可固化层定位在支撑体上或上方。 包含与第一材料不同的第二材料的第二可固化层位于第一可固化层上或上方。 第一可固化层和第二可固化层用一个具有深度大于第二可固化层的厚度的结构的压印印模在一个步骤中印刷。 第一可固化层和第二可固化层在一个步骤中固化以形成第一固化层和第二固化层。 去除压印印模以形成深度大于第二固化层厚度的印刷多层结构。
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公开(公告)号：US20140209359A1
公开(公告)日：2014-07-31
申请号：US13751464
申请日：2013-01-28
IPC分类号： H05K1/02
CPC分类号： H05K1/0296 , G06F3/044 , H05K1/02 , H05K1/0289 , H05K3/1258 , H05K2201/0108 , H05K2201/0376 , H05K2201/09227 , H05K2201/09272 , H05K2201/09681 , H05K2201/09727 , Y10T428/26
摘要： A conductive micro-wire structure includes a substrate. A plurality of spaced-apart electrically connected micro-wires is formed on or in the substrate forming the conductive micro-wire structure. The conductive micro-wire structure has a transparency of less than 75% and greater than 0%.
摘要翻译： 导电微线结构包括衬底。 多个间隔开的电连接的微线形成在形成导电微线结构的衬底上或衬底中。 导电微线结构具有小于75％且大于0％的透明度。
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公开(公告)号：US20150279688A1
公开(公告)日：2015-10-01
申请号：US14230024
申请日：2014-03-31
IPC分类号： H01L21/311 , G02B5/18 , G02B5/30 , H01L21/027 , C23C16/455
CPC分类号： H01L21/31138 , C23C16/45525 , G02B5/001 , G02B5/1857 , G02B5/3058 , G02B6/00 , G02B2207/123 , G02F1/133524 , G06F21/84 , H01L21/0274 , Y10T156/1002
摘要： A method of making a high-aspect-ratio imprinted structure includes providing a substrate, forming a first layer on the substrate, imprinting a plurality of micro-channels in the first layer, and curing the first layer. Each micro-channel has a bottom and walls, the micro-channel bottom having distinct first and second portions. A material is deposited on the first layer and in each micro-channel and anisotropically etched to remove the deposited material from the first layer and the second portion of the micro-channel bottom, leaving the deposited material on the micro-channel walls. A filler material is located in the micro-channels between the deposited materials and on only the second portion of the micro-channel bottom and cured.
摘要翻译： 制造高纵横比的印刷结构的方法包括提供基板，在基板上形成第一层，在第一层中印刷多个微通道，并固化第一层。 每个微通道具有底部和壁，微通道底部具有不同的第一和第二部分。 将材料沉积在第一层和每个微通道中并进行各向异性蚀刻以从微通道底部的第一层和第二部分移除沉积的材料，从而将沉积的材料留在微通道壁上。 填充材料位于沉积材料之间的微通道中，仅位于微通道底部的第二部分上并固化。
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公开(公告)号：US20150041203A1
公开(公告)日：2015-02-12
申请号：US13964453
申请日：2013-08-12
IPC分类号： H05K1/02
CPC分类号： H05K1/0296 , H05K1/0272 , H05K3/107 , H05K3/1258
摘要： A pattern of micro-wires in a layer over which ink is to be coated to form micro-wires includes a substrate with first, second, and third regions. A plurality of connected first micro-channels, second micro-channels, and third micro-channels are formed in the first, second, and third regions having first, second, and third micro-channel densities, respectively. The first density is greater than the second density and the second density is greater than the third density. Thus, the density of the layer monotonically decreases from the first region to the second region and from the second region to the third region so that the ink coated over the layer is more effectively distributed.
摘要翻译： 要涂覆油墨以形成微线的层中的微细线图案包括具有第一，第二和第三区域的基底。 分别在具有第一，第二和第三微通道密度的第一，第二和第三区域中形成多个连接的第一微通道，第二微通道和第三微通道。 第一密度大于第二密度，第二密度大于第三密度。 因此，层的密度从第一区域到第二区域从第二区域到第三区域单调减小，使得涂覆在层上的油墨更有效地分布。
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公开(公告)号：US20160047767A1
公开(公告)日：2016-02-18
申请号：US14460598
申请日：2014-08-15
IPC分类号： G01N27/12
CPC分类号： G01N27/126 , G01N27/07 , G02F1/13439 , G06F3/044 , G06F2203/04103 , H05K3/0014 , H05K3/1258 , H05K2201/0108 , H05K2201/0112 , H05K2201/0257 , H05K2201/0269 , H05K2201/0272 , H05K2201/0338 , H05K2201/0376 , H05K2201/2054 , H05K2203/0108 , H05K2203/1131 , H05K2203/1476
摘要： A method of operating an imprinted electronic sensor to sense an environmental factor includes providing spatially separated micro-channels in a cured layer on a substrate. A multi-layer micro-wire is formed in each micro-channel. Each multi-layer micro-wire includes at least a conductive layer and a reactive layer exposed to the environmental factor. The conductive layer is a cured electrical conductor located only within the micro-channel and at least a portion of the reactive layer responds to the environmental factor. A controller is provided for electrically controlling first and second groups of multi-layer micro-wires, each first and second group including one or more multi-layer micro-wires. The reactive layer is exposed to the environment. The controller measures the electrical response of the first and second groups of multi-layer micro-wires. The electrical response includes at least one of the amperometric response, the resistance, the capacitance, the impedance, the complex impedance, or the inductance.
摘要翻译： 操作印刷电子传感器以感测环境因素的方法包括在基板上的固化层中提供空间分离的微通道。 在每个微通道中形成多层微线。 每个多层微线包括至少暴露于环境因素的导电层和反应层。 导电层是仅位于微通道内的固化电导体，并且反应层的至少一部分响应于环境因素。 提供一种用于电控制第一组和第二组多层微线的控制器，每个第一组和第二组包括一个或多个多层微线。 反应层暴露于环境中。 控制器测量第一组和第二组多层微线的电响应。 电响应包括电流响应，电阻，电容，阻抗，复阻抗或电感中的至少一个。
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公开(公告)号：US09131606B2
公开(公告)日：2015-09-08
申请号：US13964453
申请日：2013-08-12
CPC分类号： H05K1/0296 , H05K1/0272 , H05K3/107 , H05K3/1258
摘要： A pattern of micro-wires in a layer over which ink is to be coated to form micro-wires includes a substrate with first, second, and third regions. A plurality of connected first micro-channels, second micro-channels, and third micro-channels are formed in the first, second, and third regions having first, second, and third micro-channel densities, respectively. The first density is greater than the second density and the second density is greater than the third density. Thus, the density of the layer monotonically decreases from the first region to the second region and from the second region to the third region so that the ink coated over the layer is more effectively distributed.
摘要翻译： 要涂覆油墨以形成微线的层中的微细线图案包括具有第一，第二和第三区域的基底。 分别在具有第一，第二和第三微通道密度的第一，第二和第三区域中形成多个连接的第一微通道，第二微通道和第三微通道。 第一密度大于第二密度，第二密度大于第三密度。 因此，层的密度从第一区域到第二区域从第二区域到第三区域单调减小，使得涂覆在层上的油墨更有效地分布。
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公开(公告)号：US09754704B2
公开(公告)日：2017-09-05
申请号：US14264545
申请日：2014-04-29
CPC分类号： H01B19/04 , H01B1/02 , H01B1/22 , H05K1/097 , H05K3/1258 , H05K3/246 , H05K2203/072
摘要： A method of making a thin-film multi-layer micro-wire structure includes providing a substrate and a layer on the substrate with one or more micro-channels having a width less than or equal to 20 microns. A conductive material including silver nano-particles and having a percent ratio of silver that is greater than or equal to 40% by weight is located in the micro-channels and cured to form an electrically conductive micro-wire. The electrically conductive micro-wire has a width less than or equal to 20 microns and a depth less than or equal to 20 microns. Each micro-wire is electrolessly plated to form a plated layer located at least partially within each micro-channel between the micro-wire and the layer surface in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.
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公开(公告)号：US09288901B2
公开(公告)日：2016-03-15
申请号：US14264499
申请日：2014-04-29
CPC分类号： H05K1/0298 , H01B1/02 , H05K1/0293 , H05K1/097 , H05K1/165 , H05K3/103 , H05K3/107 , H05K3/1258 , H05K3/181 , H05K3/246 , H05K3/247 , H05K2201/0317 , H05K2201/0338 , H05K2201/0341 , H05K2201/0344 , H05K2201/0347 , H05K2201/035 , H05K2201/09036 , H05K2201/10098 , H05K2203/1476 , H05K2203/173
摘要： A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.
摘要翻译： 薄膜多层微线结构包括衬底和位于衬底上或形成衬底的一部分的层。 一个或多个微通道位于该层中。 每个微通道具有小于或等于20微米的宽度。 固化的导电微线仅位于每个微通道内。 微线具有小于或等于20微米的厚度，包括银纳米颗粒，并且银的百分比大于或等于40重量％。 无电镀层至少部分地位于微线和层表面之间的每个微通道内并与微线电接触。 电镀层的厚度小于微线的厚度，使得微线和镀层形成薄膜多层微线。
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公开(公告)号：US20150313009A1
公开(公告)日：2015-10-29
申请号：US14264499
申请日：2014-04-29
CPC分类号： H05K1/0298 , H01B1/02 , H05K1/0293 , H05K1/097 , H05K1/165 , H05K3/103 , H05K3/107 , H05K3/1258 , H05K3/181 , H05K3/246 , H05K3/247 , H05K2201/0317 , H05K2201/0338 , H05K2201/0341 , H05K2201/0344 , H05K2201/0347 , H05K2201/035 , H05K2201/09036 , H05K2201/10098 , H05K2203/1476 , H05K2203/173
摘要： A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.
摘要翻译： 薄膜多层微线结构包括衬底和位于衬底上或形成衬底的一部分的层。 一个或多个微通道位于该层中。 每个微通道具有小于或等于20微米的宽度。 固化的导电微线仅位于每个微通道内。 微线具有小于或等于20微米的厚度，包括银纳米颗粒，并且银的百分比大于或等于40重量％。 无电镀层至少部分地位于微线和层表面之间的每个微通道内并与微线电接触。 电镀层的厚度小于微线的厚度，使得微线和镀层形成薄膜多层微线。
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