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公开(公告)号：US20160025529A1
公开(公告)日：2016-01-28
申请号：US14802066
申请日：2015-07-17
Applicant: Infineon Technologies AG
Inventor： Berthold Astegher , Helmut Wietschorke
CPC classification number: G01D18/00 , G01D3/028 , G01D5/145 , G01L1/16 , G01L9/08 , G01L9/12 , G01L19/0092 , G01L25/00 , G01L27/007 , G01R33/07 , G01R33/072 , G01R33/09 , G01R33/091 , G01R35/005
Abstract: An apparatus for detecting a physical variable has a first sensor unit and a second sensor unit. The first sensor unit detects a physical variable on the basis of a first detection principle. Furthermore, the second sensor unit detects the physical variable on the basis of a second detection principle. In this case, the first detection principle differs from the second detection principle. The first sensor unit the second sensor unit are accommodated in a common housing.
Abstract translation: 用于检测物理变量的装置具有第一传感器单元和第二传感器单元。 第一传感器单元基于第一检测原理来检测物理变量。 此外，第二传感器单元基于第二检测原理检测物理变量。 在这种情况下，第一检测原理与第二检测原理不同。 第一传感器单元将第二传感器单元容纳在公共壳体中。
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公开(公告)号：US09013013B1
公开(公告)日：2015-04-21
申请号：US14098585
申请日：2013-12-06
Applicant: Infineon Technologies AG
Inventor： Sebastian Beer , Helmut Wietschorke , Jochen Dangelmaier , Horst Theuss
CPC classification number: G01L19/0069 , G01L19/141 , H01L23/24 , H01L23/3135 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/92 , H01L2224/04042 , H01L2224/06135 , H01L2224/291 , H01L2224/2919 , H01L2224/32145 , H01L2224/371 , H01L2224/40145 , H01L2224/40247 , H01L2224/45014 , H01L2224/48145 , H01L2224/48247 , H01L2224/49109 , H01L2224/49175 , H01L2224/73263 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/84801 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/1431 , H01L2924/1433 , H01L2924/15151 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/19107 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: A pressure sensor package includes a pressure sensor having a first side with a pressure sensor port, a second side opposite the first side, and electrical contacts. A logic die stacked on the pressure sensor has a first side attached to the second side of the pressure sensor and a second side opposite the first side with electrical contacts. The logic die is laterally offset from the electrical contacts of the pressure sensor and operable to process signals from the pressure sensor. Electrical conductors connect the electrical contacts of the pressure sensor to the electrical contacts of the logic die. Molding compound encapsulates the pressure sensor, the logic die and the electrical conductors, and has an opening defining an open passage to the pressure sensor port. External electrical contacts are provided at a side of the pressure sensor package.
Abstract translation: 压力传感器组件包括压力传感器，该压力传感器具有第一侧，其具有压力传感器端口，与第一侧相对的第二侧和电触头。 堆叠在压力传感器上的逻辑管芯具有附接到压力传感器的第二侧的第一侧和具有电触点的与第一侧相对的第二侧。 逻辑管芯从压力传感器的电触头侧向偏移并可操作以处理来自压力传感器的信号。 电导体将压力传感器的电触点连接到逻辑管芯的电触头。 成型复合物封装压力传感器，逻辑管芯和电导体，并且具有限定到压力传感器端口的开放通道的开口。 外部电触头设置在压力传感器封装的一侧。
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公开(公告)号：US11536781B2
公开(公告)日：2022-12-27
申请号：US17301795
申请日：2021-04-14
Applicant: Infineon Technologies AG
Inventor： Horst Theuss , Klaus Elian , Helmut Wietschorke
IPC: G01R33/038 , G01R33/07
Abstract: The present disclosure relates to a magnetic-sensor device comprising a circuit board made of an electrically insulating material and having conductor tracks, and comprising a permanent magnet surface-mounted on the circuit board, and a magnetic-field sensor connected to the conductor tracks of the circuit board. An SMD component for populating a circuit board is also proposed, which SMD component comprises a permanent magnet and a magnetic-field sensor.
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Patent Agency Ranking
公开(公告)号：US09691687B2
公开(公告)日：2017-06-27
申请号：US14266348
申请日：2014-04-30
Applicant: Infineon Technologies AG
Inventor： Daniel Kehrer , Ulrich Krumbein , Beng-Keh See , Horst Theuss , Helmut Wietschorke , Tze Yang Hin , Stefan Martens
CPC classification number: H01L23/495 , H01L23/3107 , H01L23/315 , H01L23/49548 , H01L23/49575 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2223/6611 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01322 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
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公开(公告)号：US20150090042A1
公开(公告)日：2015-04-02
申请号：US14039706
申请日：2013-09-27
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Horst Theuss , Helmut Wietschorke
CPC classification number: G01L9/0045 , B81B7/0048 , B81B2201/0264 , B81C1/00325 , G01L9/0042 , G01L9/0054 , G01L19/0007 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
Abstract: A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.
Abstract translation: 压力传感器封装包括引线和与引线间隔开的半导体管芯，并且包括设置在管芯第一侧的端子和隔膜。 模具被配置成响应于横跨隔膜的压差而改变电参数。 该封装还包括将端子连接到引线的电导体，封装电导体，模具和引线的一部分的模制化合物，暴露隔膜的模制化合物中的空腔，以及设置在该导体的侧面上的密封环 与空腔成型。 密封环围绕腔体并具有比模塑料更低的弹性模量。 或者，密封环可以是模制化合物的脊，其从模制化合物与空腔的侧面突出并且包围空腔。 还提供了一种封装制造方法。
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公开(公告)号：US10677675B2
公开(公告)日：2020-06-09
申请号：US16114543
申请日：2018-08-28
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
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公开(公告)号：US10060819B2
公开(公告)日：2018-08-28
申请号：US14945661
申请日：2015-11-19
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
CPC classification number: G01L19/0084 , G01L19/147 , G01L19/148
Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
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公开(公告)号：US20140346623A1
公开(公告)日：2014-11-27
申请号：US13900949
申请日：2013-05-23
Applicant: Infineon Technologies AG
Inventor： Klaus Elian , Helmut Wietschorke
CPC classification number: H01L29/84 , G01L5/0004 , G01L19/147 , H01L23/04 , H01L23/24 , H01L24/16 , H01L24/48 , H01L24/97 , H01L27/14618 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/12042 , H01L2924/181 , H01L2924/00012 , H01L2224/45099 , H01L2224/13099 , H01L2924/00
Abstract: Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages.
Abstract translation: 公开了一种用于在间歇过程中覆盖开放式集成电路封装的技术。 在一个示例性方法中，多个开放式空腔包装被模制在单个批量引线框架或基板上，每个开放式空腔封装包括地板和布置在地板周围的多个壁，以形成空腔，每个所述壁具有 底端邻接所述底板并且具有与底端相对的顶侧。 至少一个半导体器件附接到每个开口腔封装的地板和空腔内，并且单个柔性膜固定到多个开放式腔封装的壁的顶侧，从而基本上 覆盖所有的空腔。 然后在包装之间切断柔性膜。
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